Semiconductor device having a region doped to a level exceeding the
solubility limit
    2.
    发明授权
    Semiconductor device having a region doped to a level exceeding the solubility limit 失效
    具有掺杂到超过溶解度极限的水平的区域的半导体器件

    公开(公告)号:US5518937A

    公开(公告)日:1996-05-21

    申请号:US407254

    申请日:1995-03-20

    摘要: A bipolar transistor includes a base region made of silicon crystal doped with a first impurity to a first level so as to establish a first carrier concentration in the base region and an emitter region made of silicon crystal doped with a second impurity to a second level substantially larger than the first level by a predetermined factor so as to establish a second carrier concentration in the emitter region, in which the second impurity exceeds the solubility limit of the second impurity in silicon crystal. The first and second levels are chosen in such a range that a difference in the carrier concentrations between the emitter region and the base region decreases substantially with increasing impurity level in the base region.

    摘要翻译: 双极晶体管包括由掺杂有第一杂质的硅晶体制成的第一电平的基极区域,以便在基极区域中建立第一载流子浓度,并且将由掺杂有第二杂质的硅晶体制成的发射极区域基本上 大于第一电平预定因子,以便在第二杂质超过硅晶体中的第二杂质的溶解度极限的发射极区域中建立第二载流子浓度。 第一和第二电平在这样一个范围内选择,使得发射极区域和基极区域之间的载流子浓度的差异随着基极区域中的杂质水平的增加而显着降低。

    Method of growing a single crystalline .beta.-SiC layer on a silicon
substrate
    7.
    发明授权
    Method of growing a single crystalline .beta.-SiC layer on a silicon substrate 失效
    在硅衬底上生长单晶β-SiC层的方法

    公开(公告)号:US4855254A

    公开(公告)日:1989-08-08

    申请号:US283642

    申请日:1988-12-13

    摘要: A single crystalline silicon carbide (.beta.-SiC) layer having a thickness greater than 1 .mu.m is grown on a silicon substrate by the following method of the present invention. The silicon substrate is provided in a reactor chamber, and the reactor chamber is evacuated and maintained at a reduced atmospheric pressure during the growing processes. While flowing a mixed gas containing acetylene into the reactor chamber, the substrate is heated up at a temperature range from 800.degree. to 1000.degree. C., preferable in a range from 810.degree. to 850.degree. C., whereby a buffer layer of carbonized silicon having a thickness of 60 to 100 .ANG. is grown on the substrate. Thereafter, the flowing gas is changed to a mixed gas containing hydrocarbon and chlorosilane, and the substrate temperature is raised to a temperature from 850.degree. to 950.degree. C. In this process, a single crystalline .beta.-SiC layer can be grown on the buffer layer, and a thickness of a few .mu.m for the grown .beta.-SiC layer can be expected.

    Ferroelectric memory device and its drive method
    8.
    发明授权
    Ferroelectric memory device and its drive method 失效
    铁电存储器及其驱动方式

    公开(公告)号:US06191441B1

    公开(公告)日:2001-02-20

    申请号:US09178426

    申请日:1998-10-26

    IPC分类号: H01L2976

    摘要: A ferroelectric memory capable of writing data at a small operation voltage has an insulated-gate field effect transistor, a ferroelectric film, and a pair of capacitor electrodes formed on the ferroelectric film and facing each other, one of the pair of capacitor electrodes being electrically connected to the insulated gate. A ferroelectric memory device with a simple structure has an insulated-gate field effect transistor including a source, a drain, and an insulated gate, and a ferroelectric capacitor connected between the drain and the insulated gate.

    摘要翻译: 能够以小的操作电压写入数据的铁电存储器具有绝缘栅场效应晶体管,铁电体膜和形成在铁电体膜上并且彼此面对的一对电容器电极,所述一对电容器电极中的一个电气 连接到绝缘门。 具有简单结构的铁电存储器件具有包括源极,漏极和绝缘栅极的绝缘栅场效应晶体管和连接在漏极和绝缘栅极之间的铁电电容器。

    Method of making a device having a heteroepitaxial substrate
    9.
    发明授权
    Method of making a device having a heteroepitaxial substrate 失效
    制造具有异质外延衬底的器件的方法

    公开(公告)号:US5834362A

    公开(公告)日:1998-11-10

    申请号:US619249

    申请日:1996-03-21

    摘要: A method for fabricating a compound semiconductor device includes the steps of depositing a first group III-V compound semiconductor layer on a surface of a Si substrate while holding a temperature of the Si substrate at a first temperature, depositing a second group III-V compound semiconductor layer on the first group III-V compound semiconductor layer while holding the temperature of the substrate at a second, higher temperature, and depositing a third group III-V compound semiconductor layer on the second group III-V compound semiconductor layer while holding the temperature of the substrate at a third temperature higher than said second temperature, wherein the second group III-V compound semiconductor layer contains Al.

    摘要翻译: 一种制造化合物半导体器件的方法包括以下步骤:在Si衬底的表面上沉积第一III-V族化合物半导体层,同时将Si衬底的温度保持在第一温度,沉积第二组III-V族化合物 半导体层,同时保持基板的温度处于第二较高温度,并且在第二组III-V族化合物半导体层上沉积第三组III-V族化合物半导体层,同时保持第 在比所述第二温度高的第三温度下的衬底的温度,其中第二组III-V族化合物半导体层含有Al。

    Method of growing a compound semiconductor film
    10.
    发明授权
    Method of growing a compound semiconductor film 失效
    生长化合物半导体膜的方法

    公开(公告)号:US5402748A

    公开(公告)日:1995-04-04

    申请号:US44029

    申请日:1993-04-08

    IPC分类号: C30B25/02 H01L21/205

    摘要: A method of fabricating a semiconductor device comprises the steps of growing a first layer of a group III-V compound semiconductor material on a substrate by a vapor phase deposition process by setting the temperature at a first temperature, raising the temperature from the first temperature to a second, higher temperature, growing a second layer of a group III-V compound semiconductor material on the first layer, wherein the step of raising the temperature is conducted while supplying a source gas for the group V element under a condition, determined in terms of a total pressure and a partial pressure of the source gas, such that the condition falls within a region defined by a first condition wherein the total pressure is set to 76 Torr and the partial pressure is set to 0.35 Torr, a second condition wherein the total pressure is set to 760 Torr and the partial pressure is set to 0.6 Torr, a third condition wherein the total pressure is set to 760 Torr and the partial pressure is set to 5.7 Torr, and a fourth condition wherein the total pressure is set to 76 Torr and the partial pressure is set to 1.3 Torr.

    摘要翻译: 制造半导体器件的方法包括以下步骤:通过将温度设定在第一温度,通过气相沉积工艺在衬底上生长第III-V族化合物半导体材料的第一层,将温度从第一温度升高到 第二高温,在第一层上生长III-V族化合物半导体材料的第二层,其中提供温度的步骤是在对V族元素提供源气体的条件下进行的, 的总压力和源气体的分压,使得该条件落在由总压力设定为76乇并且分压设定为0.35乇的第一条件限定的区域内,其中第二条件 总压设定为760乇,分压设定为0.6乇,第三条件为总压为760乇,分压为 t至5.7乇,第四条件为总压为76乇,分压设定为1.3乇。