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    Method of fabricating an electronic component and apparatus used therefor
    1.
    发明授权
    Method of fabricating an electronic component and apparatus used therefor 失效
    制造电子部件的方法及其使用的装置

    公开(公告)号：US06358776B1

    公开(公告)日：2002-03-19

    申请号：US09705239

    申请日：2000-11-02

    申请人： Masataka Takehara ,  Osamu Nakagawa

    发明人： Masataka Takehara ,  Osamu Nakagawa

    IPC分类号： H01L2144

    CPC分类号： H01L22/20 ,  H01L23/544 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2924/00012

    摘要： The present invention provides a method of fabricating an electronic component, using a tool for pressing a chip against a substrate and heating the same, connecting a chip electrode and a substrate electrode together via a bump, placing the substrate in alignment with a die alignment plane for an upper die and a lower die, clamping the upper die and the lower die to form a cavity and exhausting the cavity via an exhaust hole to evacuate the same, and injecting melted resin into the cavity and curing the melted resin to provide sealing resin. Then, in a predetermined ambient at a predetermined temperature the substrate is pressed against a test board and a predetermined electrical signal is applied from the test board via an external electrode to the chip to test an operation of an electronic component configured on a unit region of the substrate and the chip. Thereafter, cutting along a virtual line completes the electronic component. Thus, a plurality of chips can be resin-sealed collectively with high precision and a plurality of electronic components can be burnt in. As a result, in mounting the chip to the substrate, sealing the same with resin and burning in the same to provide an electronic component, the electronic component can be efficiently fabricated, with the sealing resin having a dimension with high precision.

    摘要翻译： 本发明提供一种制造电子部件的方法，使用将芯片压靠在基板上并对其进行加热的工具，通过凸块将芯片电极和基板电极连接在一起，将基板与芯片对准面对准 对于上模和下模，夹紧上模和下模以形成空腔并通过排气孔排空空腔以将其排出，并将熔融树脂注入空腔中并固化熔融树脂以提供密封树脂 。 然后，在预定温度下的预定环境中，将基板压在测试板上，并且从测试板经由外部电极向芯片施加预定的电信号，以测试配置在单元区域上的电子部件的操作 基板和芯片。 此后，沿虚拟线切割完成电子部件。 因此，多个芯片可以高精度地集体树脂密封，并且可以燃烧多个电子部件。结果，在将芯片安装到基板上时，用树脂密封其并在其中燃烧以提供 电子部件可以有效地制造电子部件，密封树脂具有高精度的尺寸。

    Child seat
    3.
    发明申请
    Child seat 有权
    儿童座椅

    公开(公告)号：US20070080568A1

    公开(公告)日：2007-04-12

    申请号：US11524330

    申请日：2006-09-21

    申请人： Osamu Nakagawa ,  Masayuki Sakumoto

    发明人： Osamu Nakagawa ,  Masayuki Sakumoto

    IPC分类号： B60N2/28

    CPC分类号： B60N2/2839 ,  B60N2/2809 ,  B60N2/2863 ,  B60N2/2887

    摘要： A child seat is constructed such that when the child seat is set facing the rear of the car on a car seat, the child seat is securely fixed on the seat. A handle surrounding the front of a sitting occupant is provided in a seat back portion of the child seat, and a tether extends from the handle. When the child seat is set on a car seat so that it faces the rear of the car, the tether is pulled toward the rear of the car. A hook on the tip portion of the tether is latched onto a tether anchor of the car behind the car seat, and the rear panel and the handle are joined.

    摘要翻译： 儿童座椅的构造使得当儿童座椅面向汽车后座时，儿童座椅牢固地固定在座椅上。 在儿童座椅的座椅靠背部分设置有围绕着乘坐者前方的手柄，并且系绳从手柄延伸。 当儿童座椅放置在汽车座椅上，使其面向汽车后部时，将系绳向汽车后部拉出。 系绳的尖端部分上的钩子被锁定在汽车座椅后面的汽车系绳锚上，并且后面板和把手被接合。

    Child seat with inclination indicator
    4.
    发明授权
    Child seat with inclination indicator 失效
    带倾斜指示器的儿童座椅

    公开(公告)号：US06322142B1

    公开(公告)日：2001-11-27

    申请号：US09406121

    申请日：1999-09-27

    申请人： Junichi Yoshida ,  Osamu Nakagawa

    发明人： Junichi Yoshida ,  Osamu Nakagawa

    IPC分类号： B60N228

    CPC分类号： B60N2/2863 ,  B60N2/2806 ,  B60N2/2821 ,  B60N2/286

    摘要： A child seat is formed of a bottom squab on which buttocks of a child is seated, a seat back connected to the bottom squab for supporting a back of the child, and side walls disposed on side portions of the bottom squab and the seat back. An indicator for indicating an inclination angle of the child seat is arranged on a top of one of the side walls. In the child seat, the inclination angle of the seat can be easily checked through the indicator, thus facilitating the attachment of the child seat to a vehicle seat.

    摘要翻译： 儿童座椅是由一个底部的小屁股组成，一个小孩的臀部就座，一个座位靠背连接到底部支腿上，用于支撑一个孩子的背部，以及设置在底部小腿和座椅靠背侧面的侧壁。 用于指示儿童座椅的倾斜角度的指示器布置在一个侧壁的顶部上。 在儿童座椅中，可以通过指示器容易地检查座椅的倾斜角度，从而便于将儿童座椅附接到车辆座椅。

    Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad
    5.
    发明授权
    Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad 失效
    封装半导体器件具有与管芯焊盘电绝缘的悬挂散热板

    公开(公告)号：US5334872A

    公开(公告)日：1994-08-02

    申请号：US62567

    申请日：1993-05-18

    申请人： Tetsuya Ueda ,  Osamu Nakagawa

    发明人： Tetsuya Ueda ,  Osamu Nakagawa

    IPC分类号： H01L21/56 ,  H01L23/433 ,  H01L23/495 ,  H01L23/48 ,  H01L23/02 ,  H01L23/28 ,  H01L27/54

    CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/181

    摘要： A packaged semiconductor device includes a semiconductor chip having first and second surfaces, a plurality of electrodes formed on the first surface of the semiconductor chip, a die pad bonded to the second surface of the semiconductor chip for supporting the semiconductor chip, a plurality of leads having first and second ends, the first ends being connected to corresponding electrodes of the semiconductor chip, a heat spreading plate disposed in opposed relation to the die pad and having an area larger than that of the die pad, at least one end portion of the heat spreading plate lying in the same plane as the second ends of the plurality of leads, and a resin package body encapsulating the semiconductor chip, the die pad, the first ends of the plurality of leads, and the heat spreading plate.

    摘要翻译： 封装半导体器件包括具有第一和第二表面的半导体芯片，形成在半导体芯片的第一表面上的多个电极，连接到用于支撑半导体芯片的半导体芯片的第二表面的芯片焊盘，多个引线 具有第一端和第二端，所述第一端连接到所述半导体芯片的对应电极，与所述芯片焊盘相对设置并且具有大于所述管芯焊盘的面积的散热板，所述散热板的至少一个端部 与多根引线的第二端部位于同一平面上的散热板以及封装半导体芯片，芯片焊盘，多个引线的第一端部和散热板的树脂封装主体。

    Carrier tape
    6.
    发明授权
    Carrier tape 失效
    载带

    公开(公告)号：US5196917A

    公开(公告)日：1993-03-23

    申请号：US444973

    申请日：1989-12-04

    申请人： Tetsuya Ueda ,  Kou Shimomura ,  Osamu Nakagawa ,  Seiji Takemura ,  Kazunari Michii

    发明人： Tetsuya Ueda ,  Kou Shimomura ,  Osamu Nakagawa ,  Seiji Takemura ,  Kazunari Michii

    IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/48

    CPC分类号： H01L23/48 ,  H01L2224/16

    摘要： A carrier tape includes an insulating film supporting a plurality of leads. The film has a center device hole for receiving a semiconductor chip therein, a plurality of outer lead holes formed at the periphery of the center device hole, a lead supporting portion positioned between the center device hole and the outer lead holes, and a link portion positioned between a pair of adjacent outer lead holes and connected to the lead supporting portion for directing the flow of molten resin during encapsulation of the semiconductor chip. The link portion includes an opening or recess. The plurality of leads of the carrier tape are supported on the lead supporting of the film, with one end portion of each lead projecting into the center device hole of the film. During manufacture, a semiconductor chip having a plurality of electrodes is positioned within the center device hole, and the leads are electrically connected to respective electrodes of the semiconductor chip. The resultant chip is placed within a cavity of a mold, and a molten resin is injected into the cavity through the opening or recess passage formed in the link portion of the film.

    摘要翻译： 载带包括支撑多根引线的绝缘膜。 薄膜具有用于容纳半导体芯片的中心装置孔，形成在中心装置孔周边的多个外部引线孔，位于中心装置孔和外部引线孔之间的引线支承部分，以及连接部分 定位在一对相邻的外引线孔之间并连接到引线支撑部分，用于在半导体芯片封装期间引导熔融树脂的流动。 连杆部分包括开口或凹槽。 载带的多个引线被支撑在膜的引线支撑上，每个引线的一个端部突出到膜的中心装置孔中。 在制造过程中，具有多个电极的半导体芯片位于中心器件孔内，引线与半导体芯片的各个电极电连接。 将所得的芯片放置在模具的空腔内，并且通过形成在薄膜的连接部分中的开口或凹槽通道将熔融树脂注入空腔中。

    VEHICLE CHILD SAFETY SEAT
    8.
    发明申请
    VEHICLE CHILD SAFETY SEAT 有权
    车辆儿童安全座椅

    公开(公告)号：US20150291064A1

    公开(公告)日：2015-10-15

    申请号：US14647735

    申请日：2013-11-27

    申请人： Tetsu MITSUO ,  Osamu NAKAGAWA ,  Masayuki SAKUMOTO

    发明人： Tetsu Mitsuo ,  Osamu Nakagawa ,  Masayuki Sakumoto

    IPC分类号： B60N2/26 ,  B60N2/28

    CPC分类号： B60N2/265 ,  B60N2/2812 ,  B60N2/2821 ,  B60N2002/2815

    摘要： Vehicle child safety seat including: a seat main body on which an occupant sits; a seat belt for restraining the occupant to the seat main body, the seat belt including a shoulder harness having a belt shape and facing a shoulder of the occupant; a harness cover formed in an elongated pouch shape and slidably attached to the shoulder harness in a longitudinal direction such that the shoulder harness is passed through paired insertion holes formed on respective end portions of the harness cover in the longitudinal direction; and a shoulder pad formed in an elongated shape, accommodated in the harness cover, placed between the shoulder and the shoulder harness along the longitudinal direction of the shoulder harness, and including paired connection portions provided on respective end portions of the shoulder pad in the longitudinal direction so as to be connected to the shoulder harness slidably in the longitudinal direction.

    摘要翻译： 车辆儿童安全座椅，包括：乘坐人员所在的座椅主体; 安全带，用于将乘客限制在座椅主体上，该安全带包括具有皮带形状并且面向乘员肩部的肩带; 线束罩，其形成为细长的袋状，并且沿着纵向方向可滑动地附接到所述肩带，使得所述肩带线束沿着纵向方向穿过形成在所述线束罩的相应端部上的成对插入孔; 和形成为细长形状的肩垫，其容纳在所述线束盖中，沿着所述肩带线束的纵向方向放置在所述肩部和所述肩带之间，并且包括设置在所述肩垫的纵向方向上的相应端部上的成对连接部 方向，从而沿长度方向可滑动地连接到肩带。

    Child seat anchoring device and child seat
    9.
    发明申请
    Child seat anchoring device and child seat 审中-公开
    儿童座椅固定装置和儿童座椅

    公开(公告)号：US20080296944A1

    公开(公告)日：2008-12-04

    申请号：US12068149

    申请日：2008-02-04

    申请人： Osamu Nakagawa ,  Kenji Kawabe

    发明人： Osamu Nakagawa ,  Kenji Kawabe

    IPC分类号： B60N2/28 ,  B60N2/01

    CPC分类号： B60N2/2809

    摘要： A child seat anchoring device for anchoring a child seat to a vehicle body includes first and second tether belts, a connecting member connecting the first and second tether belts, a housing of the connecting member, and first and second shafts in the connecting member. One of the first and second shafts is a tension driven shaft movable by a tension. An urging member is provided for urging the tension driven shaft, and a see-through portion is provided with the housing. A tension indicator having an indicating portion faces the see-through portion. The other of the first and second shafts serves as a locking shaft movable toward the tension driven shaft. The housing further includes a pressing member, a clamping portion for clamping the tether belt, and an operating portion for moving the locking shaft.

    摘要翻译： 用于将儿童座椅固定到车身的儿童座椅固定装置包括第一和第二系绳带，连接第一和第二系绳带的连接构件，连接构件的壳体以及连接构件中的第一和第二轴。 第一和第二轴之一是张力可动的张力驱动轴。 设置有用于推压张力从动轴的推动构件，并且具有壳体的透视部。 具有指示部分的张力指示器面向透视部分。 第一和第二轴中的另一个用作可朝向张力驱动轴移动的锁定轴。 壳体还包括按压构件，用于夹紧系绳带的夹持部分和用于移动锁定轴的操作部分。