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    Method of fabricating an electronic component and apparatus used therefor
    1.
    发明授权
    Method of fabricating an electronic component and apparatus used therefor 失效
    制造电子部件的方法及其使用的装置

    公开(公告)号：US06358776B1

    公开(公告)日：2002-03-19

    申请号：US09705239

    申请日：2000-11-02

    申请人： Masataka Takehara ,  Osamu Nakagawa

    发明人： Masataka Takehara ,  Osamu Nakagawa

    IPC分类号： H01L2144

    CPC分类号： H01L22/20 ,  H01L23/544 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2924/00012

    摘要： The present invention provides a method of fabricating an electronic component, using a tool for pressing a chip against a substrate and heating the same, connecting a chip electrode and a substrate electrode together via a bump, placing the substrate in alignment with a die alignment plane for an upper die and a lower die, clamping the upper die and the lower die to form a cavity and exhausting the cavity via an exhaust hole to evacuate the same, and injecting melted resin into the cavity and curing the melted resin to provide sealing resin. Then, in a predetermined ambient at a predetermined temperature the substrate is pressed against a test board and a predetermined electrical signal is applied from the test board via an external electrode to the chip to test an operation of an electronic component configured on a unit region of the substrate and the chip. Thereafter, cutting along a virtual line completes the electronic component. Thus, a plurality of chips can be resin-sealed collectively with high precision and a plurality of electronic components can be burnt in. As a result, in mounting the chip to the substrate, sealing the same with resin and burning in the same to provide an electronic component, the electronic component can be efficiently fabricated, with the sealing resin having a dimension with high precision.

    摘要翻译： 本发明提供一种制造电子部件的方法，使用将芯片压靠在基板上并对其进行加热的工具，通过凸块将芯片电极和基板电极连接在一起，将基板与芯片对准面对准 对于上模和下模，夹紧上模和下模以形成空腔并通过排气孔排空空腔以将其排出，并将熔融树脂注入空腔中并固化熔融树脂以提供密封树脂 。 然后，在预定温度下的预定环境中，将基板压在测试板上，并且从测试板经由外部电极向芯片施加预定的电信号，以测试配置在单元区域上的电子部件的操作 基板和芯片。 此后，沿虚拟线切割完成电子部件。 因此，多个芯片可以高精度地集体树脂密封，并且可以燃烧多个电子部件。结果，在将芯片安装到基板上时，用树脂密封其并在其中燃烧以提供 电子部件可以有效地制造电子部件，密封树脂具有高精度的尺寸。

    Cutting apparatus
    3.
    发明授权
    Cutting apparatus 失效
    切割设备

    公开(公告)号：US07207868B2

    公开(公告)日：2007-04-24

    申请号：US11522447

    申请日：2006-09-18

    申请人： Masataka Takehara ,  Masaharu Yoshida ,  Yasuyuki Kitagawa ,  Kazuyuki Kishimoto ,  Kiyoharu Kato

    发明人： Masataka Takehara ,  Masaharu Yoshida ,  Yasuyuki Kitagawa ,  Kazuyuki Kishimoto ,  Kiyoharu Kato

    IPC分类号： B24B1/00

    CPC分类号： B24C1/045 ,  B24C3/04

    摘要： A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions. Thus, in the case where the workpiece is cut along the intersecting cutting lines, replacement of the fixing table fixing the workpiece is unnecessary and wear of the fixing table is prevented.

    摘要翻译： 切割装置在高压下喷射含有磨粒的水，以沿相交方向延伸的切割线切割工件。 切割装置包括：固定工件的固定台; 在切割线下方的各个位置设置在固定台中的槽部; 设置在固定台的除了设置槽部的区域以外的区域的突出部分以工件与突出部分接触的方式; 支撑部分，用于将所述突出部分基本上平行于沿着所述凹槽部分延伸Y方向的切割线; 框架部分，其设置成在固定台的外周的至少一部分中将支撑部彼此连接; 以及可附接和可拆卸地设置以覆盖支撑部分的保护构件。 因此，在沿着相交的切割线切割工件的情况下，不需要更换固定工件的固定台，并且防止了固定台的磨损。

    CUTTING APPARATUS
    4.
    发明申请
    CUTTING APPARATUS 失效
    切割装置

    公开(公告)号：US20070066190A1

    公开(公告)日：2007-03-22

    申请号：US11522447

    申请日：2006-09-18

    申请人： Masataka Takehara ,  Masaharu Yoshida ,  Yasuyuki Kitagawa ,  Kiyoharu Kato

    发明人： Masataka Takehara ,  Masaharu Yoshida ,  Yasuyuki Kitagawa ,  Kiyoharu Kato

    IPC分类号： B24C3/00

    CPC分类号： B24C1/045 ,  B24C3/04

    摘要： A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions. Thus, in the case where the workpiece is cut along the intersecting cutting lines, replacement of the fixing table fixing the workpiece is unnecessary and wear of the fixing table is prevented.

    摘要翻译： 切割装置在高压下喷射含有磨粒的水，以沿相交方向延伸的切割线切割工件。 切割装置包括：固定工件的固定台; 在切割线下方的各个位置设置在固定台中的槽部; 设置在固定台的除了设置槽部的区域以外的区域的突出部分以工件与突出部分接触的方式; 支撑部分，用于将所述突出部分基本上平行于沿着所述凹槽部分延伸Y方向的切割线; 框架部分，其设置成在固定台的外周的至少一部分中将支撑部彼此连接; 以及可附接和可拆卸地设置以覆盖支撑部分的保护构件。 因此，在沿着相交的切割线切割工件的情况下，不需要更换固定工件的固定台，并且防止了固定台的磨损。

    Semiconductor device
    5.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号：US5067005A

    公开(公告)日：1991-11-19

    申请号：US675040

    申请日：1991-03-26

    申请人： Kazunari Michii ,  Masataka Takehara

    发明人： Kazunari Michii ,  Masataka Takehara

    IPC分类号： H01L23/34 ,  H01L21/60 ,  H01L23/433 ,  H01L23/495 ,  H01L23/64 ,  H01L25/00

    CPC分类号： H01L23/4334 ,  H01L23/49589 ,  H01L23/642 ,  H01L24/50

    摘要： A semiconductor device having a heat radiating member and a laminated structure for improvements in electrical and heat radiating characteristics. The heat radiating member is partially exposed outside a resin package of the semiconductor device to radiate heat generated by a semiconductor element to the outside of the device. In the laminated structure, a capacitor having a small capacity is formed by two electrically conductive plates one of which is connected to power supply leads and the other of which is connected to a grounded portion of the semiconductor element and to a grounding lead.

    摘要翻译： 一种具有散热构件和用于改善电热辐射特性的叠层结构的半导体器件。 散热构件部分地暴露在半导体器件的树脂封装外部，以将由半导体元件产生的热辐射到器件的外部。 在层叠结构中，通过两个导电板形成具有小容量的电容器，其中一个连接到电源引线，另一个连接到半导体元件的接地部分和接地引线。

    Pressing method, pressing mechanism and resin molding device
    7.
    发明授权
    Pressing method, pressing mechanism and resin molding device 失效
    压制方法，压制机构和树脂成型装置

    公开(公告)号：US06851355B2

    公开(公告)日：2005-02-08

    申请号：US09929694

    申请日：2001-08-13

    申请人： Akiyuki Harada ,  Masataka Takehara

    发明人： Akiyuki Harada ,  Masataka Takehara

    IPC分类号： B29C43/58 ,  B29C31/04 ,  B29C43/02 ,  B29C43/18 ,  B29C43/34 ,  B29C43/36 ,  B29C45/02 ,  B29C45/14 ,  B29L31/34 ,  B30B1/32 ,  F15B3/00 ,  F15B7/08 ,  F15B11/12 ,  B30B13/00 ,  F15B7/00

    CPC分类号： F15B3/00 ,  B29C33/20 ,  B29C43/361 ,  B29C45/021 ,  F15B7/08 ,  F15B11/128

    摘要： The pressing method includes the first step of displacing a sub-piston provided within a sub-cylinder from its initial position to press working fluid such that the working fluid is introduced via a check valve into a main cylinder to displace a main piston provided therein, and the second step of causing the sub-piston to return to the initial position such that the working fluid is supplied to the sub-cylinder. The first and second steps are repeated successively until the working fluid in the main cylinder attains a prescribed pressure level. With this method, variation in the way of pressing an object is alleviated, contamination due to the working fluid is prevented, and downsizing of the pressing mechanism is enabled.

    摘要翻译： 该按压方法包括：使设置在副缸内的副活塞从其初始位置移动到加压工作流体的第一步骤，使得工作流体经由止回阀引入主缸以移位设置在其中的主活塞， 以及使副活塞返回到初始位置使得工作流体被供应到副气缸的第二步骤。 连续重复第一步骤和第二步骤，直到主气缸中的工作流体达到规定的压力水平。 通过该方法，可以减轻按压物体的方式的变化，防止由于工作流体引起的污染，能够实现按压机构的小型化。

    Cutting apparatus and cutting method
    8.
    发明授权
    Cutting apparatus and cutting method 失效
    切割装置和切割方法

    公开(公告)号：US06736703B2

    公开(公告)日：2004-05-18

    申请号：US10104198

    申请日：2002-03-20

    申请人： Michio Osada ,  Masataka Takehara ,  Makoto Matsuo

    发明人： Michio Osada ,  Masataka Takehara ,  Makoto Matsuo

    IPC分类号： B24B100

    CPC分类号： H01L21/67092 ,  B23D47/045 ,  B23D47/08 ,  B28D5/023 ,  B28D5/024 ,  Y10T83/7788

    摘要： A cutting blade is fixed on a shaft that rotates about its shaft center, and that is linearly advanced by an advancing movement. The shaft's center further revolves with a small radius of revolution at a rapid predetermined rate of revolution greater than the rate of advancing movement. Thus the blade is pressed against and cuts a substrate and produces chips, and the blade is intermittently disengaged from the substrate whereby the chips move in the direction in which the blade rotates to be removed from between the cutting edge of the blade and the substrate. This reduces working resistance, enhances working efficiency, and prevents the blade surface from having significant frictional heat. Furthermore, the generated frictional heat can readily dissipate and the blade can thus have a long life.

    摘要翻译： 切割刀片固定在绕其轴心旋转的轴上，并且通过前进运动线性前进。 轴的中心进一步以比前进运动速度更快的预定转速旋转小的旋转半径。 因此，叶片被压靠并切割基板并产生切屑，并且叶片间歇地从基板脱离，由此切屑沿着叶片旋转的方向移动以从叶片的切割边缘和基底之间移除。 这降低了工作阻力，提高了工作效率，并且防止叶片表面产生显着的摩擦热。 此外，所产生的摩擦热可以容易地消散，并且叶片因此可以具有长的使用寿命。

    Polishing apparatus and polishing method
    10.
    发明授权
    Polishing apparatus and polishing method 失效
    抛光设备和抛光方法

    公开(公告)号：US06712674B2

    公开(公告)日：2004-03-30

    申请号：US09957083

    申请日：2001-09-19

    申请人： Makoto Matsuo ,  Masataka Takehara ,  Michio Osada

    发明人： Makoto Matsuo ,  Masataka Takehara ,  Michio Osada

    IPC分类号： B24B100

    CPC分类号： B24B37/042

    摘要： A polishing apparatus includes a polishing pad rotated by a surface plate rotating shaft about a surface plate axis, a slurry conduit supplying slurry to an upper surface of the polishing pad, a substrate holding mechanism holding a substrate, a substrate rotating shaft rotating the substrate holding mechanism about a substrate axis, and a rotating mechanism rotating the substrate axis or the surface plate axis about an eccentric axis. The angular velocity of rotation about the eccentric axis is set larger than the angular velocity of rotation about the substrate axis or the surface plate axis. Thus, the effective contact area between a small area on the substrate and the polishing pad is increased, biased wear of abrasive grains on the polishing pad is prevented, clogging of the polishing pad is suppressed, and new abrasive grains and new chemicals can be supplied with high efficiency to each area of the substrate. Thus, the polishing rate is improved.

    摘要翻译： 抛光装置包括由表面板旋转轴围绕表面板轴线旋转的抛光垫，将浆料供给到抛光垫的上表面的浆料管道，保持基板的基板保持机构，使基板保持 关于基板轴线的机构，以及使基板轴线或表面板轴线绕偏心轴线旋转的旋转机构。 围绕偏心轴的旋转角速度被设定为大于围绕基板轴线或者平板轴线的旋转角速度。 因此，衬底上的小区域与抛光垫之间的有效接触面积增大，可以防止研磨垫上磨粒的偏置磨损，抑制抛光垫的堵塞，并且可以提供新的磨粒和新化学物质 对基板的每个区域具有高效率。 因此，提高了抛光速度。