摘要:
A micro-transfer device for fine positioning is employed typically in recording and playback apparatus for recording disks. Voltage is stably supplied to an expandable element which displaces the position of a recording head by applying voltage. An end different from one end connected to a base, where the recording head is mounted, is fixed to a fixing substrate for preventing changes in dimensions of the expandable element. An external electrode connection for supplying voltage to the expandable element is provided in an area on the fixing substrate.
摘要:
An angular velocity sensor, which is able to reduce the variations of driving resonance frequency of the vibrator and to improve the reliability of the sensitivity of detection signal with respect to the angular velocity applied, is provided. The angular velocity sensor comprises a vibrator, and a tuning-fork as the vibrator is formed of a silicone substrate with crystal orientation (100) as its main face, and a side face nearly perpendicular to the driving direction (X direction) of the arm of the tuning-fork corresponds to a crystal orientation where the elastic modulus is less dependent on azimuth angle.
摘要:
The present invention relates to a method of manufacturing a piezoelectric device of high sensitivity using direct bonded quartz plate. To achieve this object, the invented method comprises the steps of covalently bonding a plurality of quartz plates, dry etching the bonded quartz plates with plasma from one side of its surfaces down to a bonded plane, and dry etching with plasma thereafter from the other side of the surfaces.
摘要:
An electronic circuit is manufactured by the following method. Elements are formed on a front surface of a substrate, and then, a recess is formed around each of the elements in the front surface of the substrate. Then, a portion of the substrate is removed from a back surface of the substrate until reaching the bottom of the recess. In the method, the elements are separated at once by removing the portion of the substrate from the back surface, and thus, the elements are manufactured efficiently.
摘要:
A piezoelectric member and an electrode are formed over a silicon substrate. The piezoelectric member and the electrode are patterned by photolithography. The silicon substrate is etched to form a body. A protective film is formed on at least one surface of the body. Another surface having no protective film thereon is etched to obtain a resonant device. The body is etched in its thickness direction accurately while a resonance frequency of the body is measured. The manufacturing processes allow the resonance frequency and a gap frequency of the resonant device to be adjusted to predetermined values.
摘要:
A piezoelectric member and an electrode are formed over a silicon substrate. The piezoelectric member and the electrode are patterned by photolithography. The silicon substrate is etched to form a body. A protective film is formed on at least one surface of the body. Another surface having no protective film thereon is etched to obtain a resonant device. The body is etched in its thickness direction accurately while a resonance frequency of the body is measured. The manufacturing processes allow the resonance frequency and a gap frequency of the resonant device to be adjusted to predetermined values.
摘要:
The drop impact measuring system has i) a plurality of bimorph-type acceleration sensor containing a plurality of free vibrating sections each of which has individual draw-out electrodes; ii) a switch section for selecting output from the bimorph-type acceleration sensors; iii) an amplifying circuit for amplifying a signal applied via the switch section from the acceleration sensors; and iv) a logic circuit for logically evaluating the output from the amplifying circuit and controlling the switch section according to the result acquired from the logical evaluation.
摘要:
A thin film micromechanical resonator (resonator) having improved drive efficiency, a resonator gyro having improved sensitivity in detecting an angular velocity, and a navigation system and an automobile using the resonator gyro. The resonator includes a tuning fork structure made of a non-piezoelectric material, and a first electrode and a second electrode disposed respectively at the inner side and the outer side of the tuning fork arm. On the first and second electrodes, a first piezo film and a second piezo film are provided respectively, and a third electrode and a fourth are respectively provided electrode thereon. When an alternating voltage is applied to the third and fourth electrodes at the opposite phases each other, the tuning fork resonates in the direction perpendicular to the center line. The resonator gyro detects, at the sensing section which is formed of another electrodes and another piezo film, the Coriolis force generated in proportion to angular velocity given to the resonator.
摘要:
An angular velocity sensor includes a tuning-fork-shaped substrate (1), drivers (110) that are provided on the arms forming a tuning fork and vibrate the arms; monitors (150) for detecting vibrations generated by the drivers (110); and detectors (120) for detecting displacement of vibrations made in application of an angular velocity. The drivers (110), the monitors (150), and the detectors (120) are made of a lower electrode layer, a piezoelectric thin film, and an upper electrode layer formed on the arms. The outer peripheral edge of the piezoelectric thin film is shaped like a step having at least one flat portion. The flat portion along the outer peripheral edge has no upper electrode layer formed thereon. This structure prevents short circuits between the lower electrode layer and the upper electrode layer.
摘要:
It is an object of the invention to provide an electronic circuit device in which semiconductor elements, resistors, capacitors and the like are packaged onto an insulating substrate such as a ceramic substrate or the like, wherein high-density packaging is realized. A circuit module comprises a terminal section having an annular insulating frame body and a plurality of terminals provided on respective portions of the frame body to extend outwardly therefrom, and a circuit substrate having wiring patterns each adapted for connection with the respective terminals of the terminal section and packaging to one surface of the circuit substrate surface packaging parts, the circuit substrate being connected to the terminals with the surface packaging parts directed toward the inside of the terminal section. One circuit module is stacked on the other circuit module to be connected to the latter by the terminals. Thus high-density packaging can be readily realized.