Micro-moving device and its manufacturing method
    1.
    发明授权
    Micro-moving device and its manufacturing method 有权
    微动装置及其制造方法

    公开(公告)号:US07005304B2

    公开(公告)日:2006-02-28

    申请号:US10362913

    申请日:2002-06-26

    IPC分类号: H01L21/00

    CPC分类号: G11B5/5552 Y10S438/928

    摘要: A micro-transfer device for fine positioning is employed typically in recording and playback apparatus for recording disks. Voltage is stably supplied to an expandable element which displaces the position of a recording head by applying voltage. An end different from one end connected to a base, where the recording head is mounted, is fixed to a fixing substrate for preventing changes in dimensions of the expandable element. An external electrode connection for supplying voltage to the expandable element is provided in an area on the fixing substrate.

    摘要翻译: 用于精细定位的微转移装置通常用于记录盘的记录和重放装置。 电压被稳定地供给到通过施加电压来移位记录头的位置的可扩展元件。 与安装有记录头的底座连接的一端不同的端部固定到固定基板上,以防止可扩张元件的尺寸变化。 用于向可膨胀元件提供电压的外部电极连接设置在固定基板上的区域中。

    Angular velocity sensor
    2.
    发明授权
    Angular velocity sensor 有权
    角速度传感器

    公开(公告)号:US06865945B2

    公开(公告)日:2005-03-15

    申请号:US10485073

    申请日:2003-06-05

    CPC分类号: G01C19/5663 G01C19/5628

    摘要: An angular velocity sensor, which is able to reduce the variations of driving resonance frequency of the vibrator and to improve the reliability of the sensitivity of detection signal with respect to the angular velocity applied, is provided. The angular velocity sensor comprises a vibrator, and a tuning-fork as the vibrator is formed of a silicone substrate with crystal orientation (100) as its main face, and a side face nearly perpendicular to the driving direction (X direction) of the arm of the tuning-fork corresponds to a crystal orientation where the elastic modulus is less dependent on azimuth angle.

    摘要翻译: 提供了一种角速度传感器,其能够减小振动器的驱动共振频率的变化并提高检测信号相对于施加的角速度的灵敏度的可靠性。 角速度传感器包括振动器,并且作为振动器的音叉由具有晶体取向(100)作为其主面的硅衬底和与臂的驱动方向(X方向)几乎垂直的侧面形成 音叉对应于其中弹性模量较小依赖于方位角的晶体取向。

    Method of manufacturing piezoelectric device using direct bonded quartz plate
    3.
    发明授权
    Method of manufacturing piezoelectric device using direct bonded quartz plate 失效
    使用直接键合石英板制造压电器件的方法

    公开(公告)号:US06719914B2

    公开(公告)日:2004-04-13

    申请号:US10132717

    申请日:2002-04-26

    IPC分类号: C03C1500

    CPC分类号: H01L41/313

    摘要: The present invention relates to a method of manufacturing a piezoelectric device of high sensitivity using direct bonded quartz plate. To achieve this object, the invented method comprises the steps of covalently bonding a plurality of quartz plates, dry etching the bonded quartz plates with plasma from one side of its surfaces down to a bonded plane, and dry etching with plasma thereafter from the other side of the surfaces.

    摘要翻译: 本发明涉及使用直接接合的石英板制造高灵敏度的压电器件的方法。 为了实现该目的,本发明的方法包括以下步骤:共价键合多个石英板,将等离子体从其表面的一侧干燥蚀刻到接合平面,然后从另一侧进行等离子体干蚀刻 的表面。

    Method for manufacturing electronic component
    4.
    发明授权
    Method for manufacturing electronic component 有权
    电子元件制造方法

    公开(公告)号:US06984572B2

    公开(公告)日:2006-01-10

    申请号:US10473980

    申请日:2003-01-24

    IPC分类号: H01L21/301

    CPC分类号: G01C19/5607 H01L21/3043

    摘要: An electronic circuit is manufactured by the following method. Elements are formed on a front surface of a substrate, and then, a recess is formed around each of the elements in the front surface of the substrate. Then, a portion of the substrate is removed from a back surface of the substrate until reaching the bottom of the recess. In the method, the elements are separated at once by removing the portion of the substrate from the back surface, and thus, the elements are manufactured efficiently.

    摘要翻译: 通过以下方法制造电子电路。 元件形成在基板的前表面上,然后在基板的前表面中的每个元件周围形成凹部。 然后,将基板的一部分从基板的背面去除,直至到达凹部的底部。 在该方法中,通过从背面去除基板的一部分,元件被分开,因此有效地制造元件。

    Method for manufacturing resonant device
    5.
    发明申请
    Method for manufacturing resonant device 失效
    制造谐振装置的方法

    公开(公告)号:US20050000934A1

    公开(公告)日:2005-01-06

    申请号:US10494640

    申请日:2003-08-20

    摘要: A piezoelectric member and an electrode are formed over a silicon substrate. The piezoelectric member and the electrode are patterned by photolithography. The silicon substrate is etched to form a body. A protective film is formed on at least one surface of the body. Another surface having no protective film thereon is etched to obtain a resonant device. The body is etched in its thickness direction accurately while a resonance frequency of the body is measured. The manufacturing processes allow the resonance frequency and a gap frequency of the resonant device to be adjusted to predetermined values.

    摘要翻译: 在硅衬底上形成压电元件和电极。 压电元件和电极通过光刻图案化。 硅衬底被蚀刻以形成体。 在身体的至少一个表面上形成保护膜。 在其上没有保护膜的另一表面被蚀刻以获得谐振装置。 在测量身体的共振频率的同时,精确地蚀刻身体的厚度方向。 制造过程允许共振频率和谐振装置的间隙频率被调节到预定值。

    Method for manufacturing resonant device
    6.
    发明授权
    Method for manufacturing resonant device 失效
    制造谐振装置的方法

    公开(公告)号:US07083740B2

    公开(公告)日:2006-08-01

    申请号:US10494640

    申请日:2003-08-20

    IPC分类号: B34C1/22

    摘要: A piezoelectric member and an electrode are formed over a silicon substrate. The piezoelectric member and the electrode are patterned by photolithography. The silicon substrate is etched to form a body. A protective film is formed on at least one surface of the body. Another surface having no protective film thereon is etched to obtain a resonant device. The body is etched in its thickness direction accurately while a resonance frequency of the body is measured. The manufacturing processes allow the resonance frequency and a gap frequency of the resonant device to be adjusted to predetermined values.

    摘要翻译: 在硅衬底上形成压电元件和电极。 压电元件和电极通过光刻图案化。 硅衬底被蚀刻以形成体。 在身体的至少一个表面上形成保护膜。 在其上没有保护膜的另一表面被蚀刻以获得谐振装置。 在测量身体的共振频率的同时,精确地蚀刻身体的厚度方向。 制造过程允许共振频率和谐振装置的间隙频率被调节到预定值。

    Thin-film micromechanical resonator, thin-film micromechanical resonator gyro, and navigation system and automobile using the resonator gyro
    8.
    发明授权
    Thin-film micromechanical resonator, thin-film micromechanical resonator gyro, and navigation system and automobile using the resonator gyro 有权
    薄膜微机械谐振器,薄膜微机械谐振陀螺,以及使用谐振陀螺的导航系统和汽车

    公开(公告)号:US07002284B2

    公开(公告)日:2006-02-21

    申请号:US10470669

    申请日:2002-11-26

    IPC分类号: H03H9/21

    摘要: A thin film micromechanical resonator (resonator) having improved drive efficiency, a resonator gyro having improved sensitivity in detecting an angular velocity, and a navigation system and an automobile using the resonator gyro. The resonator includes a tuning fork structure made of a non-piezoelectric material, and a first electrode and a second electrode disposed respectively at the inner side and the outer side of the tuning fork arm. On the first and second electrodes, a first piezo film and a second piezo film are provided respectively, and a third electrode and a fourth are respectively provided electrode thereon. When an alternating voltage is applied to the third and fourth electrodes at the opposite phases each other, the tuning fork resonates in the direction perpendicular to the center line. The resonator gyro detects, at the sensing section which is formed of another electrodes and another piezo film, the Coriolis force generated in proportion to angular velocity given to the resonator.

    摘要翻译: 具有改进的驱动效率的薄膜微机械谐振器(谐振器),在检测角速度方面具有改进的灵敏度的谐振器陀螺仪以及使用谐振器陀螺仪的导航系统和汽车。 谐振器包括由非压电材料制成的音叉结构,以及分别设置在音叉臂的内侧和外侧的第一电极和第二电极。 在第一和第二电极上分别设置第一压电膜和第二压电膜,第三电极和第四电极分别设置有电极。 当交替电压以相反的相位施加到第三和第四电极时,音叉在垂直于中心线的方向上共振。 谐振器陀螺仪在由另一个电极和另一个压电膜形成的感测部分检测到与给予谐振器的角速度成比例地产生的科里奥利力。

    Angular-velocity sensor
    9.
    发明申请
    Angular-velocity sensor 有权
    角速度传感器

    公开(公告)号:US20050029606A1

    公开(公告)日:2005-02-10

    申请号:US10495926

    申请日:2003-08-06

    CPC分类号: G01C19/5607

    摘要: An angular velocity sensor includes a tuning-fork-shaped substrate (1), drivers (110) that are provided on the arms forming a tuning fork and vibrate the arms; monitors (150) for detecting vibrations generated by the drivers (110); and detectors (120) for detecting displacement of vibrations made in application of an angular velocity. The drivers (110), the monitors (150), and the detectors (120) are made of a lower electrode layer, a piezoelectric thin film, and an upper electrode layer formed on the arms. The outer peripheral edge of the piezoelectric thin film is shaped like a step having at least one flat portion. The flat portion along the outer peripheral edge has no upper electrode layer formed thereon. This structure prevents short circuits between the lower electrode layer and the upper electrode layer.

    摘要翻译: 角速度传感器包括音叉形基板(1),驱动器(110),其设置在形成音叉的臂上并使臂振动; 监视器(150),用于检测由驾驶员(110)产生的振动; 以及用于检测施加角速度的振动的位移的检测器(120)。 驱动器(110),监视器(150)和检测器(120)由形成在臂上的下电极层,压电薄膜和上电极层制成。 压电薄膜的外周缘成形为具有至少一个平坦部分的台阶。 沿着外周边缘的平坦部分没有形成上电极层。 这种结构防止了下电极层和上电极层之间的短路。

    Electronic circuit device and manufacturing method thereof
    10.
    发明授权
    Electronic circuit device and manufacturing method thereof 失效
    电子电路装置及其制造方法

    公开(公告)号:US5346402A

    公开(公告)日:1994-09-13

    申请号:US19671

    申请日:1993-02-19

    摘要: It is an object of the invention to provide an electronic circuit device in which semiconductor elements, resistors, capacitors and the like are packaged onto an insulating substrate such as a ceramic substrate or the like, wherein high-density packaging is realized. A circuit module comprises a terminal section having an annular insulating frame body and a plurality of terminals provided on respective portions of the frame body to extend outwardly therefrom, and a circuit substrate having wiring patterns each adapted for connection with the respective terminals of the terminal section and packaging to one surface of the circuit substrate surface packaging parts, the circuit substrate being connected to the terminals with the surface packaging parts directed toward the inside of the terminal section. One circuit module is stacked on the other circuit module to be connected to the latter by the terminals. Thus high-density packaging can be readily realized.

    摘要翻译: 本发明的目的是提供一种电子电路装置,其中将半导体元件,电阻器,电容器等封装在诸如陶瓷基板等的绝缘基板上,其中实现了高密度封装。 电路模块包括端子部分,其具有环形绝缘框架体和设置在框架主体的相应部分上以从其向外延伸的多个端子,以及具有各自适于与端子部分的各个端子连接的布线图案的电路基板 并且将电路基板表面的包装部件的一个表面封装,电路基板连接到端子,表面封装部件指向端子部分的内部。 一个电路模块堆叠在另一个电路模块上,以通过端子与后者连接。 因此,可以容易地实现高密度包装。