Imprint method, imprinting equipment, and method for manufacturing semiconductor device
    1.
    发明授权
    Imprint method, imprinting equipment, and method for manufacturing semiconductor device 有权
    压印方法,压印设备以及制造半导体器件的方法

    公开(公告)号:US08906281B2

    公开(公告)日:2014-12-09

    申请号:US13402244

    申请日:2012-02-22

    IPC分类号: B29C59/02 G03F7/00

    摘要: In an imprint method according to one embodiment, a template on which a template pattern is formed is pushed against resist on a substrate to be transferred while the resist is cured in this state. The template is subsequently separated from the cured resist. The template is then degassed from the template pattern surface side between after the template is separated from the cured resist and till the template is pushed against resist at the next shot.

    摘要翻译: 在根据一个实施例的压印方法中,在该状态下,在抗蚀剂固化的同时,将其上形成有模板图案的模板压在要转印的基板上的抗蚀剂上。 随后将模板与固化的抗蚀剂分离。 然后在模板与固化的抗蚀剂分离之后,直到模板在下一次照射下被抵抗抗蚀剂时,模板从模板图案表面侧脱气。

    Imprint apparatus and method
    2.
    发明授权
    Imprint apparatus and method 有权
    印刷装置和方法

    公开(公告)号:US08550801B2

    公开(公告)日:2013-10-08

    申请号:US13230554

    申请日:2011-09-12

    IPC分类号: B29C59/02

    摘要: In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.

    摘要翻译: 在一个实施例中,压印装置包括被配置为保持用于印记的模板的模板保持部分。 该装置还包括模板移动部件,其构造成移动模板以将模板按压在转印目标基板上的光固化树脂上,或者从光固化树脂脱模模板。 该装置还包括配置成用光照射光固化树脂以固化光固化树脂的光源。 该设备还包括脱模控制部件,当脱模模板从光固化树脂脱模时,该脱模控制部件被配置为基于模板从其脱模的喷射区域的位置来控制模板的脱模速度或脱模角度。

    IMPRINT APPARATUS AND METHOD
    3.
    发明申请
    IMPRINT APPARATUS AND METHOD 有权
    印刷装置和方法

    公开(公告)号:US20120061882A1

    公开(公告)日:2012-03-15

    申请号:US13230554

    申请日:2011-09-12

    IPC分类号: B29C35/08

    摘要: In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.

    摘要翻译: 在一个实施例中,压印装置包括被配置为保持用于印记的模板的模板保持部分。 该装置还包括模板移动部件,其构造成移动模板以将模板按压在转印目标基板上的光固化树脂上,或者从光固化树脂脱模模板。 该装置还包括配置成用光照射光固化树脂以固化光固化树脂的光源。 该设备还包括脱模控制部件,当脱模模板从光固化树脂脱模时,该脱模控制部件被配置为基于模板从其脱模的喷射区域的位置来控制模板的脱模速度或脱模角度。

    Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
    4.
    发明授权
    Semiconductor manufacturing apparatus and method for manufacturing semiconductor device 有权
    半导体制造装置及半导体装置的制造方法

    公开(公告)号:US08901012B2

    公开(公告)日:2014-12-02

    申请号:US13599358

    申请日:2012-08-30

    IPC分类号: C23C16/52 H01L21/67 C23C16/44

    摘要: According to one embodiment, a semiconductor manufacturing apparatus includes a substrate stage, a transfer unit, and a control unit. A substrate is settable on the substrate stage. The transfer unit is configured to transfer a pattern having an uneven configuration onto a major surface of the substrate by attachably and removably holding a template. The pattern is provided in the transfer surface. The control unit is configured to acquire information relating to a number of foreign objects on the major surface prior to the transferring of the pattern. The control unit adds the number for a plurality of the substrates including the pattern transferred by the transfer unit. The control unit causes the transfer unit not to implement the transferring of the pattern in the case where the sum has reached the upper limit.

    摘要翻译: 根据一个实施例,半导体制造装置包括基板台,转印单元和控制单元。 衬底可在衬底台上设置。 转印单元被配置为通过可附接地和可移除地保持模板将具有不均匀构造的图案转印到基板的主表面上。 转印面上设有图案。 控制单元被配置为在传送图案之前获取与主表面上的多个异物相关的信息。 控制单元添加包括由传送单元传送的图案的多个基板的数量。 在总和达到上限的情况下,控制单元使得传送单元不执行图案的传送。

    Circuit breaking device
    6.
    发明授权
    Circuit breaking device 失效
    断路装置

    公开(公告)号:US5737162A

    公开(公告)日:1998-04-07

    申请号:US693351

    申请日:1996-08-06

    IPC分类号: H01H33/14 H01H33/59 H02H3/00

    CPC分类号: H01H33/596 H01H33/143

    摘要: An objective of this invention is to provide a DC circuit breaking device having functions for transmitting direct currents to an electric power system and interrupting direct currents to the electric power system under abnormal conditions such as grounding and short-circuits, where the DC circuit breaking device can minimize the capacity of a condenser for the commuting circuit while rapidly changing the arc voltage to cause arc currents to be quickly extended and vibrated in order to interrupt direct currents in a short arc time. This DC circuit breaking device includes a main DC circuit breaker for interrupting the transmission of direct currents to an electric power system and a DC circuit breaker that is connected in series to the main DC circuit breaker and which is smaller than the main DC circuit breaker. The circuit breaking device also includes a commutation circuit that is connected in parallel to the DC circuit breaker and the small DC circuit breaker which are connected together in series and which is constituted by a reactor and a condenser. The circuit breaking device also includes a surge absorber for absorbing a surged voltage applied to for the condenser.

    摘要翻译: 本发明的目的是提供一种直流断路装置,其具有在直流断路装置等异常条件下向电力系统发送直流电流和中断到电力系统的直流的功能。 可以最小化通勤电路的电容器的容量,同时快速改变电弧电压,使电弧电流迅速延伸和振动,以便在短时间内中断直流电流。 该DC断路装置包括用于中断与电力系统的直流的传输的主DC断路器和与主DC断路器串联连接并且小于主DC断路器的DC断路器。 断路装置还包括与DC断路器和小型DC断路器并联连接的换向电路,它们串联连接在一起并且由反应器和冷凝器构成。 断路装置还包括用于吸收施加到冷凝器的浪涌电压的浪涌吸收器。

    Pattern forming method, processing method, and processing apparatus
    7.
    发明授权
    Pattern forming method, processing method, and processing apparatus 有权
    图案形成方法,处理方法和处理装置

    公开(公告)号:US08420422B2

    公开(公告)日:2013-04-16

    申请号:US13041917

    申请日:2011-03-07

    IPC分类号: H01L21/00

    摘要: According to the embodiments, a distribution of a recess portion shape is calculated based on a result obtained by measuring the recess portion shape of a first projection and recess pattern formed on a surface of a template. Next, a distribution of an application amount of a curing agent to a processing target layer is calculated based on the distribution of the recess portion shape, and the curing agent is applied to the processing target layer based on this distribution of the application amount of the curing agent. Next, a second projection and recess pattern is formed by transferring the first projection and recess pattern onto the curing agent by causing the curing agent to cure in a state where the first projection and recess pattern is in contact with the curing agent.

    摘要翻译: 根据实施例,基于通过测量形成在模板的表面上的第一突起和凹部图案的凹部形状获得的结果来计算凹部形状的分布。 接下来,基于凹部形状的分布计算固化剂的涂布量到处理对象层的分布,并且基于该涂布量的分布将固化剂施加到处理对象层 固化剂。 接下来,通过使固化剂在第一突起和凹部图案与固化剂接触的状态下固化而将第一突起和凹陷图案转印到固化剂上形成第二突起和凹陷图案。

    PATTERN FORMING METHOD, PROCESSING METHOD, AND PROCESSING APPARATUS
    8.
    发明申请
    PATTERN FORMING METHOD, PROCESSING METHOD, AND PROCESSING APPARATUS 有权
    图案形成方法,处理方法和处理装置

    公开(公告)号:US20110229988A1

    公开(公告)日:2011-09-22

    申请号:US13041917

    申请日:2011-03-07

    IPC分类号: H01L21/66 G06F19/00

    摘要: According to the embodiments, a distribution of a recess portion shape is calculated based on a result obtained by measuring the recess portion shape of a first projection and recess pattern formed on a surface of a template. Next, a distribution of an application amount of a curing agent to a processing target layer is calculated based on the distribution of the recess portion shape, and the curing agent is applied to the processing target layer based on this distribution of the application amount of the curing agent. Next, a second projection and recess pattern is formed by transferring the first projection and recess pattern onto the curing agent by causing the curing agent to cure in a state where the first projection and recess pattern is in contact with the curing agent.

    摘要翻译: 根据实施例,基于通过测量形成在模板的表面上的第一突起和凹部图案的凹部形状获得的结果来计算凹部形状的分布。 接下来,基于凹部形状的分布计算固化剂的涂布量到处理对象层的分布,并且基于该涂布量的分布将固化剂施加到处理对象层 固化剂。 接下来,通过使固化剂在第一突起和凹部图案与固化剂接触的状态下固化而将第一突起和凹陷图案转印到固化剂上形成第二突起和凹陷图案。

    Fine processing method, fine processing apparatus, and recording medium with fine processing program recorded thereon
    10.
    发明授权
    Fine processing method, fine processing apparatus, and recording medium with fine processing program recorded thereon 有权
    精加工方法,精细加工装置以及记录有精加工程序的记录介质

    公开(公告)号:US08691123B2

    公开(公告)日:2014-04-08

    申请号:US13204844

    申请日:2011-08-08

    IPC分类号: B29C43/58

    摘要: According to one embodiment, a fine processing method includes determining a resist amount required for each first region of a pattern formation surface and a total amount of resist. The method include dividing the total amount of resist by a volume of one resist drop to determine the resist drops total number. The method include determining a provisional position for the resist drop of the total number. The method include assigning the each first region to nearest one resist drop, and partitioning again the pattern formation surface into second regions assigned to the each resist drop. The method include determining a divided value by dividing the volume of the one resist drop by the required total amount of resist determined. The method include finalizing a final position of the each resist drop, if a distribution of the divided value in the pattern formation surface falls within a target range.

    摘要翻译: 根据一个实施例,精细处理方法包括确定图案形成表面的每个第一区域和抗蚀剂总量所需的抗蚀剂量。 该方法包括将抗蚀剂的总量除以一个抗蚀剂滴的体积以确定抗蚀剂滴数总数。 该方法包括确定总数的抗蚀剂落下的临时位置。 该方法包括将每个第一区域分配给最接近的一个抗蚀剂层,以及再次将图案形成表面分割成分配给每个抗蚀剂层的第二区域。 该方法包括通过将一个抗蚀剂液滴的体积除以所需的抗蚀剂总量确定分割值。 如果图案形成表面中的分割值的分布落在目标范围内,则该方法包括确定每个抗蚀剂液滴的最终位置。