Integrated tunable high efficiency power amplifier
    3.
    发明授权
    Integrated tunable high efficiency power amplifier 有权
    集成可调高效率功率放大器

    公开(公告)号:US06232841B1

    公开(公告)日:2001-05-15

    申请号:US09346097

    申请日:1999-07-01

    IPC分类号: H03F304

    CPC分类号: H03F3/2176 H01H59/0009

    摘要: Power amplifiers having reactive networks (such as classes C, C-E, E and F) employ tunable reactive devices in their reactive networks, with the reactive devices respective reactance values capable of being adjusted by means of respective control signals. The tunable reactive devices are made from micro-electromechanical (MEM) devices capable of being integrated with the control circuitry needed to produce the control signals and other amplifier components on a common substrate. The reactive components have high Q values across their adjustment range, enabling the amplifier to produce an output with a low harmonic content over a wide range of input signal frequencies, and a frequency agile, high quality output. The invention can be realized on a number of foundry technologies.

    摘要翻译: 具有无功网络(例如类C,C-E,E和F)的功率放大器在其无功网络中采用可调谐无功装置,其中无功装置可以通过相应的控制信号来调整各自的电抗值。 可调谐无功装置由能够与在公共基板上产生控制信号和其它放大器部件所需的控制电路集成的微机电(MEM)器件制成。 无功分量在其调节范围内具有高Q值,使得放大器能够在宽范围的输入信号频率以及频率灵敏,高质量输出下产生具有低谐波含量的输出。 本发明可以通过多种铸造技术实现。

    Integrated variable gain power amplifier and method
    4.
    发明授权
    Integrated variable gain power amplifier and method 失效
    集成可变增益功率放大器及方法

    公开(公告)号:US5834975A

    公开(公告)日:1998-11-10

    申请号:US815694

    申请日:1997-03-12

    IPC分类号: H03G1/00 H03G3/30 H03F3/68

    摘要: An integrated, variable gain microwave frequency power amplifier comprises a number of individual amplifier stages which contain microwave frequency active devices. Each stage is fed with a common input signal, and the individual stage outputs are connected to respective micro-electromechanical (MEM) switches which, when closed, connect the individual outputs together to form the power amplifier's output. The power amplifier's gain is determined by the number of outputs connected together. The preferred switch provides low insertion loss and excellent electrical isolation, enabling a number of amplifier stages to be efficiently interconnected to provide a wide dynamic range power amplifier. The switches are preferably integrated on a common substrate with the active devices, eliminating the need for wire bonds and reducing parasitic capacitances. A variable impedance network comprising a number of impedance matching networks selected using MEM switches can be connected to and integrated with a variable gain power amplifier to provide impedance matching that is appropriate for each of the power amplifier's possible output power levels.

    摘要翻译: 集成的可变增益微波频率功率放大器包括多个单独的放大器级,其包含微波频率有源器件。 每个级馈入一个公共输入信号,并且各个级输出连接到相应的微机电(MEM)开关,当关闭时,各个输出端连接在一起形成功率放大器的输出。 功率放大器的增益取决于连接在一起的输出数量。 优选的开关提供低插入损耗和优异的电隔离,使得能够高效地互连多个放大器级,以提供宽动态范围功率放大器。 这些开关优选地与有源器件集成在公共衬底上,消除了对引线键合的需要并降低寄生电容。 包括使用MEM开关选择的多个阻抗匹配网络的可变阻抗网络可以连接到可变增益功率放大器并与可变增益功率放大器集成,以提供适合于每个功率放大器的可能输出功率电平的阻抗匹配。

    Monolithically integrated switched capacitor bank using micro electro
mechanical system (MEMS) technology
    7.
    发明授权
    Monolithically integrated switched capacitor bank using micro electro mechanical system (MEMS) technology 失效
    使用微机电系统(MEMS)技术的单片集成开关电容器组

    公开(公告)号:US5880921A

    公开(公告)日:1999-03-09

    申请号:US848116

    申请日:1997-04-28

    IPC分类号: H01H59/00 H03B1/00 H01G23/00

    摘要: A monolithically integrated switched capacitor bank using MEMS technology that is capable of handling GHz signal frequencies in both the RF and millimeter bands while maintaining precise digital selection of capacitor levels over a wide tuning range. Each MEMS switch includes a cantilever arm that is affixed to the substrate and extends over a ground line and a gapped signal line. An electrical contact is formed on the bottom of the cantilever arm positioned above and facing the gap in the signal line. A top electrode atop the cantilever arm forms a control capacitor structure above the ground line. A capacitor structure, preferably a MEMS capacitor suspended above the substrate at approximately the same height as the cantilever arm, is anchored to the substrate and connected in series with a MEMS switch. The MEMS switch is actuated by applying a voltage to the top electrode, which produces an electrostatic force that attracts the control capacitor structure toward the ground line, thereby causing the electrical contact to close the gap in the signal line and connect the MEMS capacitor structure between a pair of output terminals. The integrated MEMS switch-capacitor pairs have a large range between their on-state and off-state impedance, and thus exhibit superior isolation and insertion loss characteristics.

    摘要翻译: 使用MEMS技术的单片集成开关电容器组,其能够处理RF和毫米波段中的GHz信号频率,同时在宽调谐范围内保持电容器电平的精确数字选择。 每个MEMS开关包括悬臂,其固定在基板上并在接地线和间隙信号线上延伸。 在位于信号线上方并面向信号线的间隙的悬臂的底部上形成电接触。 在悬臂上方的顶部电极在地线上方形成控制电容器结构。 电容器结构,优选地悬置在基板上方的悬臂上方与悬臂大致相同高度的MEMS电容器被锚定到基板并与MEMS开关串联连接。 通过向顶部电极施加电压来致动MEMS开关,该电压产生吸引控制电容器结构朝向接地线的静电力,从而使电接触闭合信号线中的间隙,并将MEMS电容器结构 一对输出端子。 集成的MEMS开关电容器对在其导通状态和截止状态阻抗之间具有较大的范围,因此表现出优异的隔离和插入损耗特性。

    Methods of fabricating integrated, aligned tunneling tip pairs
    9.
    发明授权
    Methods of fabricating integrated, aligned tunneling tip pairs 失效
    制造集成的对准的隧道尖端对的方法

    公开(公告)号:US5449903A

    公开(公告)日:1995-09-12

    申请号:US76906

    申请日:1993-06-15

    摘要: Self-aligned, opposed, nanometer dimension tips are fabricated in pairs, one of each pair being located on a movable, single crystal beam, with the beam being movable in three dimensions with respect to a substrate carrying the other tip of a pair. Motion of one tip with respect to the other is controlled or sensed by transducers formed on the supporting beams. Spring means in each beam allow axial motion of the beam. The tips and beams are fabricated from single crystal silicon substrate, and the tips may be electrically isolated from the substrate by fabricating insulating segments in the beam structure.

    摘要翻译: 自对准的,相对的,纳米尺寸的尖端成对制造,每对中的一个位于可移动的单晶束上,其中光束可相对于承载一对的另一个尖端的基板在三维空间中移动。 一个尖端相对于另一个尖端的运动由形成在支撑梁上的换能器控制或感测。 每个梁中的弹簧装置允许梁的轴向运动。 尖端和光束由单晶硅衬底制成,并且尖端可以通过在梁结构中制造绝缘段而与衬底电隔离。

    Submicron isolated, released resistor structure
    10.
    发明授权
    Submicron isolated, released resistor structure 失效
    亚微米隔离,释放电阻结构

    公开(公告)号:US5287082A

    公开(公告)日:1994-02-15

    申请号:US906877

    申请日:1992-07-02

    IPC分类号: H01L21/02 H01C1/012

    CPC分类号: H01L28/20

    摘要: A submicron resistor having negligible parasitic capacitance includes an isolated released beam carried on a single crystal silicon wafer. The resistor is fabricated by defining a resistor region in the substrate, doping the region to produce the desired resistivity, and etching around the region to produce a resistive island. The island is then isolated from the substrate by oxidation, and is released by removing the oxide to produce an isolated, released resistor beam.

    摘要翻译: 具有可忽略的寄生电容(40),(42),(44)的亚微米电阻器包括承载在单晶硅晶片上的隔离放电光束(20)。 通过在衬底(24)中限定电阻器区域,掺杂该区域以产生期望的电阻率,以及围绕该区域蚀刻以产生电阻岛,来制造电阻器。 然后通过氧化将岛与基底隔离,并通过去除氧化物来产生隔离的释放的束(20)。