公开(公告)号：US20050006754A1

公开(公告)日：2005-01-13

申请号：US10614497

申请日：2003-07-07

申请人： Mehmet Arik ,  Stanton Weaver ,  James Carnahan ,  Charles Becker ,  William Gerstler

发明人： Mehmet Arik ,  Stanton Weaver ,  James Carnahan ,  Charles Becker ,  William Gerstler

IPC分类号： F28F13/18 ,  H01L23/373 ,  H01L23/473 ,  H01L23/485 ,  H01L33/62 ,  H01L33/64 ,  H01L23/10

CPC分类号： F28F13/185 ,  B82Y10/00 ,  H01L23/373 ,  H01L23/473 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L33/62 ,  H01L33/648 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13084 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/1703 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19042 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor device die (10, 116) is disposed on a heat-sinking support structure (30, 100). Nanotube regions (52, 120) contain nanotubes (54, 126) are arranged on a surface of or in the heatsinking support structure (30, 100). The nanotube regions (52, 120) are arranged to contribute to heat transfer from the semiconductor device die (10, 116) to the heat-sinking support structure (30, 100). In one embodiment, the semiconductor device die (10) includes die electrodes (20, 22), and the support structure (30) includes contact pads (40, 42) defined by at least some of the nanotube regions (52). The contact pads (40, 42) electrically and mechanically contact the die electrodes (20, 22). In another embodiment, the heat-sinking support structure (100) includes microchannels (120) arranged laterally in the support structure (100). At least some of the nanotube regions are disposed inside the microchannels (100).

摘要翻译： 半导体器件管芯（10,116）设置在散热支撑结构（30,100）上。 纳米管区域（52,120）包含纳米管（54,126）布置在散热支撑结构（30,100）的表面上或散热支撑结构（30,100）中。 纳米管区域（52,120）被布置成有助于从半导体器件管芯（10,116）到散热支撑结构（30,100）的热传递。 在一个实施例中，半导体器件管芯（10）包括管芯电极（20,22），并且支撑结构（30）包括由至少一些纳米管区域（52）限定的接触焊盘（40,42）。 接触焊盘（40,42）与管芯电极（20,22）电接触和机械接触。 在另一个实施例中，散热支撑结构（100）包括在支撑结构（100）中侧向设置的微通道（120）。 至少一些纳米管区域设置在微通道（100）的内部。

公开(公告)号：US20050258438A1

公开(公告)日：2005-11-24

申请号：US10851273

申请日：2004-05-21

申请人： Mehmet Arik ,  Stanton Weaver ,  Charles Becker

发明人： Mehmet Arik ,  Stanton Weaver ,  Charles Becker

IPC分类号： F21K99/00 ,  H01L21/00 ,  H01L25/075 ,  H01L33/64 ,  H01L33/00

CPC分类号： F21V29/51 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/648 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

摘要翻译： 发光设备（10,110,210,310,410）包括设置在芯片支撑壁（16,116,216）上的一个或多个发光二极管芯片（12,112,212,312,412），其包括印刷电路 （34,134,234,360,362,460,462），与发光二极管芯片连接。 热管（24,124,224,324,424）具有由包括芯片支撑壁和至少一个附加壁（18,20,28）的壁限定的密封体积（22,122,222,322,422） 120,218）。 热管还包括设置在密封体积中的传热流体（26,226,326,426）。

公开(公告)号：US20070147046A1

公开(公告)日：2007-06-28

申请号：US11682784

申请日：2007-03-06

申请人： Mehmet Arik ,  James Petroski ,  Stanton Weaver

发明人： Mehmet Arik ,  James Petroski ,  Stanton Weaver

IPC分类号： F21V29/00

CPC分类号： F21V29/74 ,  F21V29/02 ,  F21V29/67 ,  F21V29/76 ,  F21Y2115/10 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： An LED light system that includes an LED and a synthetic jet actuator to cool the LED as disclosed.

摘要翻译： 一种LED灯系统，其包括LED和合成射流致动器以冷却LED，如所公开的。

公开(公告)号：US06964877B2

公开(公告)日：2005-11-15

申请号：US10832969

申请日：2004-04-27

申请人： Chen-Lun Hsing Chen ,  Stanton Weaver, Jr. ,  Ivan Eliashevich ,  Sebastien Libon ,  Mehmet Arik ,  David Shaddock

发明人： Chen-Lun Hsing Chen ,  Stanton Weaver, Jr. ,  Ivan Eliashevich ,  Sebastien Libon ,  Mehmet Arik ,  David Shaddock

IPC分类号： H01L21/00 ,  H01L31/02 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/05155 ,  H01L2224/05166

摘要： Surface mount light emitting diode (LED) packages each contain a light emitting diode (LED) die (24). A plurality of arrays of openings are drilled into an electrically insulating sub-mount wafer (10). A metal is applied to the drilled openings to produce a plurality of via arrays (12). The LED dice (24) are flip-chip bonded onto a frontside (16) of the sub-mount wafer (10). The p-type and n-type contacts of each flip-chip bonded LED (24) electrically communicate with a solderable backside (18) of the sub-mount wafer (10) through a via array (12). A thermal conduction path (10, 12) is provided for thermally conducting heat from the flip-chip bonded LED dice (24) to the solderable backside (18) of the sub-mount wafer (10). Subsequent to the flip-chip bonding, the sub-mount wafer (10) is separated to produce the surface mount LED packages.

摘要翻译： 表面贴装发光二极管（LED）封装各自包含发光二极管（LED）裸片（24）。 将多个开口阵列钻入电绝缘子安装晶片（10）中。 金属被施加到钻孔以产生多个通孔阵列（12）。 LED芯片（24）被倒装芯片接合到子安装晶片（10）的前侧（16）上。 每个倒装芯片接合的LED（24）的p型和n型触点通过通孔阵列（12）与辅助安装晶片（10）的可焊接背面（18）电连通。 提供了一种导热路径（10,12），用于将来自倒装芯片接合的LED骰子（24）的热量传导到子安装晶片（10）的可焊接背面（18）。 在倒装芯片接合之后，子安装晶片（10）被分离以产生表面贴装LED封装。

公开(公告)号：US20070069357A1

公开(公告)日：2007-03-29

申请号：US11449002

申请日：2006-06-07

申请人： Stanton Weaver ,  Mehmet Arik

发明人： Stanton Weaver ,  Mehmet Arik

IPC分类号： H01L23/02

CPC分类号： H01L35/08 ,  H01J45/00 ,  H01L35/32

摘要： A system is provided. The system includes a device that includes top and bottom thermally conductive substrates positioned opposite to one another, wherein a top surface of the bottom thermally conductive substrate is substantially atomically flat and a thermal blocking layer disposed between the top and bottom thermally conductive substrates. The device also includes top and bottom electrodes separated from one another between the top and bottom thermally conductive substrates to define a tunneling path, wherein the top electrode is disposed on the thermal blocking layer and the bottom electrode is disposed on the bottom thermally conductive substrate.

摘要翻译： 提供了一个系统。 该系统包括一个装置，该装置包括彼此相对定位的顶部和底部导热基底，其中底部导热基底的顶表面基本上是原子上平坦的，以及设置在顶部和底部导热基底之间的热阻挡层。 该装置还包括在顶部和底部导热基板之间彼此分离的顶部和底部电极以限定隧道路径，其中顶部电极设置在热阻挡层上，而底部电极设置在底部导热基底上。

公开(公告)号：US08434906B2

公开(公告)日：2013-05-07

申请号：US12711000

申请日：2010-02-23

申请人： Mehmet Arik ,  Stanton Weaver ,  Thomas Stecher ,  Charles Seeley ,  Glenn Kuenzler ,  Charles Wolfe, Jr. ,  Yogen Utturkar ,  Rajdeep Sharma ,  Satish Prabhakaran ,  Tunc Icoz

发明人： Mehmet Arik ,  Stanton Weaver ,  Thomas Stecher ,  Charles Seeley ,  Glenn Kuenzler ,  Charles Wolfe, Jr. ,  Yogen Utturkar ,  Rajdeep Sharma ,  Satish Prabhakaran ,  Tunc Icoz

IPC分类号： F21V29/00 ,  H01L23/34

CPC分类号： H05B33/0803 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V23/006 ,  F21V29/02 ,  F21V29/63 ,  F21V29/74 ,  F21V29/763 ,  F21V29/83 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F28F3/02 ,  H01L2924/0002 ,  H01L2924/00

摘要： Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

公开(公告)号：US20110204790A1

公开(公告)日：2011-08-25

申请号：US12711000

申请日：2010-02-23

申请人： Mehmet Arik ,  Stanton Weaver ,  Thomas Stecher ,  Charles Seeley ,  Glenn Kuenzler ,  Charles Wolfe, JR. ,  Yogen Utturkar ,  Rajdeep Sharma ,  Satish Prabhakaran ,  Tunc Icoz

发明人： Mehmet Arik ,  Stanton Weaver ,  Thomas Stecher ,  Charles Seeley ,  Glenn Kuenzler ,  Charles Wolfe, JR. ,  Yogen Utturkar ,  Rajdeep Sharma ,  Satish Prabhakaran ,  Tunc Icoz

IPC分类号： H01J13/32 ,  H01J61/52

CPC分类号： H05B33/0803 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V23/006 ,  F21V29/02 ,  F21V29/63 ,  F21V29/74 ,  F21V29/763 ,  F21V29/83 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F28F3/02 ,  H01L2924/0002 ,  H01L2924/00

摘要： Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

摘要翻译： 提供具有独特配置的照明系统。 例如，照明系统可以包括光源，热管理系统和驱动器电子器件，每个都包含在外壳结构内。 光源构造成通过壳体结构中的开口提供可见的照明。 热管理系统被配置为通过壳体结构提供诸如单向空气流的空气流，以便冷却光源。 驱动器电子器件被配置为向每个光源和热管理系统提供电力。

公开(公告)号：US20060066309A1

公开(公告)日：2006-03-30

申请号：US10955635

申请日：2004-09-30

申请人： Mehmet Arik ,  Bulent Aksel ,  William Gerstler ,  Cherik Bulkes ,  Douglas Kelley ,  Steven Brzozowski

发明人： Mehmet Arik ,  Bulent Aksel ,  William Gerstler ,  Cherik Bulkes ,  Douglas Kelley ,  Steven Brzozowski

IPC分类号： G01V3/00

CPC分类号： G01R33/3856

摘要： A thermal management system and method for cooling Magnetic Resonance Imaging gradient coils. The system includes least one first header tube positioned adjacent to said gradient coils and configured to transport a coolant fluid; at least one set of cooling tubes connected to said header tube at inlet ends and configured to transport said coolant fluid, wherein said cooling tubes are parallel to each other and at least one second header tube positioned adjacent to said gradient coils, connected to said at least one set of cooling tubes at outlet ends of said at least one set of cooling tubes and configured to transport said coolant fluid.

摘要翻译： 一种用于冷却磁共振成像梯度线圈的热管理系统和方法。 该系统包括邻近所述梯度线圈定位的至少一个第一集管，并且构造成输送冷却剂流体; 至少一组冷却管在入口端处连接到所述集管，并且构造成输送所述冷却剂流体，其中所述冷却管彼此平行并且与所述梯度线圈相邻定位的至少一个第二集管， 在所述至少一组冷却管的出口端处的至少一组冷却管，并且构造成输送所述冷却剂流体。

公开(公告)号：US07010930B2

公开(公告)日：2006-03-14

申请号：US10670533

申请日：2003-09-24

申请人： Mehmet Arik ,  Warren Bessler ,  Michael Bowman ,  Charles Byrd ,  William Gerstler ,  Daniel P. Smith ,  Todd Wetzel

发明人： Mehmet Arik ,  Warren Bessler ,  Michael Bowman ,  Charles Byrd ,  William Gerstler ,  Daniel P. Smith ,  Todd Wetzel

IPC分类号： F25D23/12

CPC分类号： H05K7/208 ,  F04D25/06 ,  F25B1/04 ,  F25B31/006 ,  F25B39/02 ,  F25B2341/0014 ,  F25B2500/01 ,  F28F3/04 ,  F28F13/12 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A turbomachinery system for cooling a high power density device includes a turbomachine configured to deliver a high flux cooling medium toward the high power density device, a housing containing a motor, a compressor, or both, of the turbomachine, a heat exchanger in fluid communication with the turbomachine and arranged for being thermally coupled to the high power density device, and a transition duct arranged intermediate the heat exchanger and turbomachine.

摘要翻译： 一种用于冷却高功率密度装置的涡轮机械系统包括涡轮机构，其构造成向高功率密度装置输送高通量冷却介质，包含涡轮机的电动机，压缩机或两者的壳体，流体连通的热交换器 并且布置成与高功率密度装置热耦合，以及布置在热交换器和涡轮机之间的过渡管。

公开(公告)号：US07543961B2

公开(公告)日：2009-06-09

申请号：US11682784

申请日：2007-03-06

申请人： Mehmet Arik ,  James T. Petroski ,  Stanton Weaver

发明人： Mehmet Arik ,  James T. Petroski ,  Stanton Weaver

IPC分类号： F21V29/00

CPC分类号： F21V29/74 ,  F21V29/02 ,  F21V29/67 ,  F21V29/76 ,  F21Y2115/10 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： An LED light system that includes an LED and a synthetic jet actuator to cool the LED as disclosed.

摘要翻译： 一种LED灯系统，其包括LED和合成射流致动器以冷却LED，如所公开的。