摘要:
A flexible metal foil-polyimide laminate is prepared by applying a dimethylacetamide solution of polyamic acid onto a metal foil, drying the applied solution to form a semi-dry adhesive layer, laminating a polyimide film thereto on a hot roll press, and heat curing for solvent removal and imidization. The polyimide film has a dimethylacetamide gas permeability of at least 0.1 kg/m2·hr at 5 Torr and 200° C. In the heat curing step, the residual solvent and the water formed upon imidization in the adhesive layer are removed through the polyimide film.
摘要翻译:通过将聚酰胺酸的二甲基乙酰胺溶液涂布在金属箔上,干燥所得溶液以形成半干燥粘合剂层,在热辊压机上层压聚酰亚胺膜,并对其进行热固化,制备柔性金属箔 - 聚酰亚胺层压体 溶剂去除和酰亚胺化。 聚酰亚胺薄膜在5托和200℃下的二甲基乙酰胺气体渗透率为至少0.1kg / m 2·hr。在热固化步骤中,残留溶剂和在酰亚胺化中形成的水 通过聚酰亚胺膜去除粘合剂层。
摘要:
A flexible metal foil-polyimide laminate is prepared by joining a polyimide film to a metal foil via an intervening adhesive layer. The adhesive is a mixture of polyamic acids: (A) the reaction product of 3,4,3′,4′-biphenyltetracarboxylic anhydride with p-phenylenediamine, (B) the reaction product of 3,4,3′,4′-biphenyltetracarboxylic anhydride with 4,4′-diaminodiphenyl ether, and (C) the reaction product of pyromellitic dianhydride with 4,4′-diaminodiphenyl ether, in a weight ratio (A+B)/C between 75/25 and 25/75. The method is simple and inexpensive, and yields a flexible metal foil-polyimide laminate that is improved in peel strength and curling resistance while maintaining the heat resistance of polyimide.
摘要:
A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 μm, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 μm. The polyimide adhesive layer has a Tg>400° C.
摘要:
A method for preparing a flexible metal foil/polyimide laminate is characterized by laminating a metal foil and a polyimide film, with a heat resistant adhesive interleaved therebetween, on a heating roll press, and heat treating the laminate for removing the residual solvent from the adhesive layer and heat curing the adhesive layer.
摘要:
A polyimide precursor resin solution composition sheet having a solvent content of 1–50% by weight and a thickness of 1–10 microns has improved adhesion, forms a heat resistant polyimide layer when cured, and is advantageously used in the bonding of conductors to plastic films.
摘要:
A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 μm, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 μm. The polyimide adhesive layer has a Tg>400° C.
摘要:
A flexible metal foil/polyimide laminate consists of all three layers, a polyimide film, a metal foil, and a polyimide resin layer disposed between the polyimide film and the metal foil.
摘要:
In a flexible metal foil/polyimide laminate comprising in sequence, a heat resistant polyimide film, an adhesive layer, and a metal foil, the adhesive layer is a polyimide adhesive layer with a Tg of at least 400° C., obtained by heat imidization of a polyamic acid varnish containing 5-200 ppm of a leveling agent, typically polyether-modified silicone. This laminate of the all polyimide type takes full advantage of the properties of heat resistant polyimide film, includes the adhesive layer having a smooth surface, and is free of thickness variations.
摘要:
Provided is an acrylic flame retardant adhesive composition, including: (A) 100 parts by mass of an acrylic polymer containing a carboxyl group, with a glass transition temperature of 5 to 30° C., (B) 1 to 20 parts by mass of a resol-type phenol resin, (C) 1 to 20 parts by mass of an epoxy resin, (D) 0.1 to 5 parts by mass of a curing accelerator, (E) a bromine-based flame retardant, in sufficient quantity to produce a bromine content within the entire composition, excluding the component (F), of 15 to 40% by mass, and (F) 10 to 100 parts by mass of an inorganic filler. Also provided are an acrylic adhesive sheet that contains an adhesive layer including this composition and a method of bonding two substrates using this acrylic adhesive sheet. The acrylic adhesive sheet exhibits excellent adhesiveness, heat resistance, workability, handling properties and flame retardancy, and the acrylic adhesive composition is useful in the production of such an adhesive sheet.
摘要:
Provided is an acrylic adhesive composition, including: (A) 100 parts by mass of an acrylic polymer containing a carboxyl group, with a glass transition temperature of 5 to 30° C., (B) 1 to 20 parts by mass of a resol-type phenol resin, (C) 1 to 20 parts by mass of an epoxy resin, and (D) 10 to 100 parts by mass of an inorganic filler, the composition optionally including 0 to 0.5 parts by mass of a curing accelerator per 100 parts by mass of the component (A). Also provided are an acrylic adhesive sheet that contains an adhesive layer including this composition and a method of bonding two substrates using this acrylic adhesive sheet. The acrylic adhesive sheet exhibits excellent adhesiveness, heat resistance, workability, handling properties and storage stability, and the acrylic adhesive composition is useful in the production of such an adhesive sheet.