GAN SUBSTRATE WAFER AND METHOD FOR MANUFACTURING SAME

    公开(公告)号:US20220084819A1

    公开(公告)日:2022-03-17

    申请号:US17536252

    申请日:2021-11-29

    IPC分类号: H01L21/02 C30B25/20 H01L29/20

    摘要: Provided are: a GaN substrate wafer having a crystallinity suitable as a substrate for a semiconductor device as well as an improved productivity; and a method of producing the same. The GaN substrate wafer is a (0001)-oriented GaN substrate wafer that includes a first region arranged on an N-polar side and a second region arranged on a Ga-polar side via a regrowth interface therebetween. In this GaN substrate wafer, the second region has a minimum thickness of not less than 20 μm, the concentration of at least one element selected from Li, Na, K, F, Cl, Br, and I in the first region is 1×1015 atoms/cm3 or higher, and the second region satisfies one or more conditions selected from the following (a) to (c): (a) the Si concentration is 5×1016 atoms/cm3 or higher; (b) the O concentration is 3×1016 atoms/cm3 or lower; and (c) the H concentration is 1×1017 atoms/cm3 or lower.

    GAN CRYSTAL AND SUBSTRATE
    5.
    发明申请

    公开(公告)号:US20210384336A1

    公开(公告)日:2021-12-09

    申请号:US17406218

    申请日:2021-08-19

    摘要: Provided are a GaN crystal used in a substrate for a nitride semiconductor device having a horizontal device structure such as GaN-HEMT, and a substrate used for production of a nitride semiconductor device having a horizontal device structure such as GaN-HEMT. The Gab crystal has a (0001) surface having an area of not less than 5 cm2, the (0001) surface having an inclination of not more than 10° with respect to the (0001) crystal plane, wherein the Fe concentration is not less than 5×1017 atoms/cm3 and less than 1×109 atoms/cm3, and wherein the total donor impurity concentration is less than 5×1016 atoms/cm3.

    GAN SUBSTRATE WAFER AND PRODUCTION METHOD FOR SAME

    公开(公告)号:US20220084820A1

    公开(公告)日:2022-03-17

    申请号:US17536396

    申请日:2021-11-29

    IPC分类号: H01L21/02 C30B25/20 H01L29/20

    摘要: Provided is a GaN substrate wafer with an improved productivity, which can be preferably used in the production of a nitride semiconductor device having a horizontal device structure. The GaN substrate wafer is a (0001)-oriented GaN substrate wafer that includes a first region arranged on an N-polar side and a second region, which is arranged on a Ga-polar side and has a minimum thickness, via a regrowth interface therebetween. In this GaN substrate wafer, the second region has a minimum thickness of not less than 20 μm, and at least a portion of the second region has a total compensating impurity concentration of 1×1017 atoms/cm3 or higher.