公开(公告)号：US20130200784A1

公开(公告)日：2013-08-08

申请号：US12294850

申请日：2007-03-28

申请人： Shingo Matsuura ,  Tomoya Tabuchi ,  Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Daisuke Sakumoto

发明人： Shingo Matsuura ,  Tomoya Tabuchi ,  Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Daisuke Sakumoto

IPC分类号： H05B33/02 ,  F21V13/04

CPC分类号： H05B33/02 ,  F21V13/04 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/83385 ,  H01L2224/83951

摘要： To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base (1) that has an opening part (1p) constituted by a light-reflecting surface (1r) and a bottom surface (1u), a light-emitting chip (2) that is mounted on the bottom surface (1u) of the opening part (1p), a transparent member (3) that covers the light-emitting chip (2), and an optical member (4) that is disposed on the transparent member (3). The transparent member (3) is disposed on the bottom surface (1u) of the opening part (1p) in a state where the transparent member (3) is spaced away from the light-reflecting surface (1r) of the opening part (1p).

摘要翻译： 为了提高发光装置发出的光的亮度，发光装置包括具有由光反射面（1r）和底面（1u）构成的开口部（1p）的基体（1） ，安装在开口部（1p）的底面（1u）上的发光芯片（2），覆盖发光芯片（2）的透明部件（3）和光学部件 ），其设置在透明构件（3）上。 在透明构件（3）与开口部（1p）的光反射面（1r）隔开的状态下，透明构件（3）设置在开口部（1p）的底面（1u） ）。

公开(公告)号：US20050211991A1

公开(公告)日：2005-09-29

申请号：US11088238

申请日：2005-03-22

申请人： Yuki Mori ,  Akira Miyake

发明人： Yuki Mori ,  Akira Miyake

IPC分类号： F21K7/00 ,  F21S2/00 ,  F21Y20060101 ,  H01L21/00 ,  H01L27/15 ,  H01L33/50 ,  H01L33/56

CPC分类号： H01L33/501 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a light-emitting apparatus with favorable radiation light intensity, which is excellent in light extraction efficiency, color temperature and color rendering property. The light-emitting apparatus includes a light-emitting element, a base body having, on its top surface, a placement portion for emplacing thereon the light-emitting element, a frame body attached to the top surface of the base body so as to surround the placement portion, a light transmitting member disposed inside the frame body so as to cover the light-emitting element, and phosphors contained in the light transmitting member, which performs wavelength conversion on the light emitted from the light-emitting element. The light transmitting member has a pre-cured viscosity ranging from 0.4 to 50 Pa.s.

摘要翻译： 提供了具有良好的辐射光强度的发光装置，其具有优异的光提取效率，色温和显色性能。 发光装置包括发光元件，基体，其顶表面上具有用于放置发光元件的放置部，安装在基体的上表面上的框体， 放置部分，设置在框体内部以覆盖发光元件的透光构件，以及包含在透光构件中的荧光体，其对从发光元件发射的光进行波长转换。 透光部件的预固化粘度为0.4〜50Pa·s。

公开(公告)号：US20120161186A1

公开(公告)日：2012-06-28

申请号：US13393408

申请日：2010-10-22

申请人： Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Shingo Matsuura ,  Masayuki Mori

发明人： Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Shingo Matsuura ,  Masayuki Mori

IPC分类号： H01L33/50

CPC分类号： H01L33/60 ,  H01L33/507 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/00012

摘要： A light-emitting device includes a substrate mounted with a light-emitting element, and a frame disposed on the substrate. The frame includes a first frame portion disposed on the substrate and surrounding the light-emitting element, and having an inner wall surface substantially perpendicular to an upper surface of the substrate, an upper end of the inner wall surface being positioned at a level higher than that of an upper surface of the light-emitting element, and a second frame portion surrounding the inner wall surface of the first frame portion when viewed in a plan view, and having an inner periphery which is so shaped as to extend at an outward incline from a lower end of the inner periphery to an upper thereof. The light-emitting device includes a wavelength converter supported on the frame and opposed to the substrate with a gap.

摘要翻译： 发光装置包括安装有发光元件的基板和设置在基板上的框架。 所述框架包括设置在所述基板上并围绕所述发光元件的第一框架部分，并且具有基本上垂直于所述基板的上表面的内壁表面，所述内壁表面的上端定位在高于 发光元件的上表面以及围绕第一框架部分的内壁表面的平面图中的第二框架部分，并且具有内周，该内周被成形为在向外倾斜 从内周的下端到其上部。 发光装置包括支撑在框架上并与间隙相对的基板的波长转换器。

公开(公告)号：US20050186407A1

公开(公告)日：2005-08-25

申请号：US11064784

申请日：2005-02-23

申请人： Yuki Mori ,  Akira Miyake

发明人： Yuki Mori ,  Akira Miyake

IPC分类号： B32B3/00 ,  H01L23/498 ,  H05K1/03 ,  H05K3/46

CPC分类号： C04B35/63 ,  B32B18/00 ,  B32B2311/04 ,  B32B2311/06 ,  B32B2311/08 ,  B32B2311/09 ,  B32B2311/12 ,  C04B35/632 ,  C04B35/634 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3231 ,  C04B2235/3244 ,  C04B2235/3418 ,  C04B2235/3463 ,  C04B2235/3481 ,  C04B2235/365 ,  C04B2235/48 ,  C04B2235/6025 ,  C04B2235/604 ,  C04B2235/96 ,  C04B2237/403 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/62 ,  C04B2237/704 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/09881 ,  Y10T428/24926 ,  H01L2924/00

摘要： In manufacturing a ceramic multi-layer wiring substrate which is formed by stacking a plurality of ceramic layers and which includes an internal wiring, a ceramic paste is printed using a screen printing process on a part of a ceramic green sheet to be a ceramic layer having the internal wiring formed thereon which part does not include the internal wiring, to form between the ceramic layers a ceramic filling layer including a same ceramic component as that in the ceramic layers which ceramic filling layer is not formed on the internal wiring. The ceramic paste includes a ceramic component, an acrylic resin, and a cellulose resin, and loss factor tan δ of the paste represented by (loss modulus)/(storage modulus) in a dry condition after printing is equal to or greater than loss factor tan δ of a conductor paste layer to be the internal wiring in a dry condition.

摘要翻译： 在制造通过堆叠多个陶瓷层并且包括内部布线形成的陶瓷多层布线基板时，通过丝网印刷方法将陶瓷浆料印刷在陶瓷生片的一部分上，作为具有 在其上形成的部分不包括内部布线的内部布线，在陶瓷层之间形成陶瓷填充层，陶瓷填充层包括与内部布线中没有形成陶瓷填充层的陶瓷层相同的陶瓷成分。 陶瓷膏包括陶瓷成分，丙烯酸树脂和纤维素树脂，印刷后的干燥条件下（损耗模量）/（储能模量）表示的糊剂的损失因子tanδ等于或大于损耗因子 导体糊层的tanδ在干燥条件下成为内部布线。

公开(公告)号：US20110096526A1

公开(公告)日：2011-04-28

申请号：US12810769

申请日：2008-12-26

申请人： Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Shingo Matsuura

发明人： Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Shingo Matsuura

IPC分类号： F21V9/16

CPC分类号： H01L33/60 ,  F21K9/64 ,  F21Y2115/10 ,  H01L33/507 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting device includes a base, a sub-mount substrate, and a frame member. The light emitting device further includes a light emitting element and a wavelength converting member. The sub-mount substrate is disposed on the base, and has an upper surface made of a ceramic sintered body. The frame member has a light reflecting portion made of porous ceramics, is disposed on the base, and surrounds the sub-mount substrate. The light emitting element is mounted on the sub-mount substrate. The wavelength converting member covers the light emitting element and the light reflecting portion of the frame member.

摘要翻译： 发光装置包括基座，副安装基板和框架构件。 发光装置还包括发光元件和波长转换构件。 副安装基板设置在基座上，具有由陶瓷烧结体构成的上表面。 框架构件具有由多孔陶瓷制成的光反射部分，设置在基座上并且包围副安装基板。 发光元件安装在副安装基板上。 波长转换部件覆盖框架部件的发光元件和光反射部。

公开(公告)号：US20050133808A1

公开(公告)日：2005-06-23

申请号：US10978302

申请日：2004-10-29

申请人： Mitsugu Uraya ,  Daisuke Sakumoto ,  Akira Miyake ,  Fumiaki Sekine ,  Yuki Mori ,  Mitsuo Yanagisawa ,  Hiroshi Shibayama ,  Shingo Matsuura

发明人： Mitsugu Uraya ,  Daisuke Sakumoto ,  Akira Miyake ,  Fumiaki Sekine ,  Yuki Mori ,  Mitsuo Yanagisawa ,  Hiroshi Shibayama ,  Shingo Matsuura

IPC分类号： H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

CPC分类号： H01L33/486 ,  B41J2/455 ,  H01L33/508 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting apparatus provides a ceramic-made base body, a frame body, a light-emitting element, a conductor layer and a light-transmitting member. The base body has on its upper surface a mounting portion for the light-emitting element. The frame body is joined to the upper surface of the base body so as to surround the mounting portion, with its inner peripheral surface shaped into a reflection surface. The wiring conductor has its one end formed on the upper surface of the base body and electrically connected to the light-emitting element, and has another end led to a side or lower surface of the base body. The light-transmitting member is disposed inside the frame body so as to cover the light-emitting element, which contains fluorescent materials for performing wavelength conversion. The base body is so designed that ceramic crystal grains range in average particle diameter from 1 to 5 μm.

摘要翻译： 发光装置提供陶瓷制的基体，框体，发光元件，导体层和透光构件。 基体在其上表面上具有用于发光元件的安装部分。 框架体以围绕安装部的方式与基体的上表面接合，其内周面形成为反射面。 布线导体的一端形成在基体的上表面上并与发光元件电连接，另一端被引导到基体的侧面或下表面。 透光构件设置在框体内，以覆盖包含用于进行波长转换的荧光材料的发光元件。 基体的设计使得陶瓷晶粒的平均粒径范围为1〜5μm。

公开(公告)号：US08710737B2

公开(公告)日：2014-04-29

申请号：US12294850

申请日：2007-03-28

申请人： Shingo Matsuura ,  Tomoya Tabuchi ,  Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Daisuke Sakumoto

发明人： Shingo Matsuura ,  Tomoya Tabuchi ,  Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Daisuke Sakumoto

IPC分类号： H01J1/62

CPC分类号： H05B33/02 ,  F21V13/04 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/83385 ,  H01L2224/83951

摘要： To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base (1) that has an opening part (1p) constituted by a light-reflecting surface (1r) and a bottom surface (1u), a light-emitting chip (2) that is mounted on the bottom surface (1u) of the opening part (1p), a transparent member (3) that covers the light-emitting chip (2), and an optical member (4) that is disposed on the transparent member (3). The transparent member (3) is disposed on the bottom surface (1u) of the opening part (1p) in a state where the transparent member (3) is spaced away from the light-reflecting surface (1r) of the opening part (1p).

摘要翻译： 为了提高发光装置发出的光的亮度，发光装置包括具有由光反射面（1r）和底面（1u）构成的开口部（1p）的基体（1） ，安装在开口部（1p）的底面（1u）上的发光芯片（2），覆盖发光芯片（2）的透明部件（3）和光学部件 ），其设置在透明构件（3）上。 在透明构件（3）与开口部（1p）的光反射面（1r）隔开的状态下，透明构件（3）设置在开口部（1p）的底面（1u） ）。

公开(公告)号：US08529089B2

公开(公告)日：2013-09-10

申请号：US12810769

申请日：2008-12-26

申请人： Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Shingo Matsuura

发明人： Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Shingo Matsuura

IPC分类号： F21S4/00

CPC分类号： H01L33/60 ,  F21K9/64 ,  F21Y2115/10 ,  H01L33/507 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting device includes a base, a sub-mount substrate, and a frame member. The light emitting device further includes a light emitting element and a wavelength converting member. The sub-mount substrate is disposed on the base, and has an upper surface made of a ceramic sintered body. The frame member has a light reflecting portion made of porous ceramics, is disposed on the base, and surrounds the sub-mount substrate. The light emitting element is mounted on the sub-mount substrate. The wavelength converting member covers the light emitting element and the light reflecting portion of the frame member.

摘要翻译： 发光装置包括基座，副安装基板和框架构件。 发光装置还包括发光元件和波长转换构件。 副安装基板设置在基座上，具有由陶瓷烧结体构成的上表面。 框架构件具有由多孔陶瓷制成的光反射部分，设置在基座上并且包围副安装基板。 发光元件安装在副安装基板上。 波长转换部件覆盖框架部件的发光元件和光反射部。

公开(公告)号：US20090296367A1

公开(公告)日：2009-12-03

申请号：US11909592

申请日：2006-03-23

申请人： Fumiaki Sekine ,  Daisuke Sakumoto ,  Yuki Mori ,  Mitsuo Yanagisawa ,  Shingo Matsuura

发明人： Fumiaki Sekine ,  Daisuke Sakumoto ,  Yuki Mori ,  Mitsuo Yanagisawa ,  Shingo Matsuura

IPC分类号： F21V9/16 ,  F21V7/00

CPC分类号： H01L33/60 ,  H01L33/62 ,  H01L2224/16

摘要： A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.

摘要翻译： 一种包装体，包括具有用于安装发光装置的安装部的基体，安装在基体的上表面的框状的第一反射构件，其内周面成形为第一光反射面， 围绕安装部的框状的第二反射构件和安装在基体的上表面的框状的第二反射构件，其间隔固定在第二反射构件的内周面与第一反射构件的外周面之间， 围绕第一反射构件的周边表面，并且在第一反射构件的上端上方的位置具有第二光反射表面。

公开(公告)号：US09117836B2

公开(公告)日：2015-08-25

申请号：US13349430

申请日：2012-01-12

申请人： Naoki Tega ,  Yasuhiro Shimamoto ,  Yuki Mori ,  Hirotaka Hamamura ,  Hiroyuki Okino ,  Digh Hisamoto

发明人： Naoki Tega ,  Yasuhiro Shimamoto ,  Yuki Mori ,  Hirotaka Hamamura ,  Hiroyuki Okino ,  Digh Hisamoto

IPC分类号： H01L21/28 ,  H01L29/66 ,  H01L29/45 ,  H01L29/78 ,  H01L21/04 ,  H01L29/16 ,  H01L29/423 ,  H01L29/51

CPC分类号： H01L29/7802 ,  H01L21/0475 ,  H01L21/0485 ,  H01L29/1608 ,  H01L29/42372 ,  H01L29/42376 ,  H01L29/4238 ,  H01L29/45 ,  H01L29/513 ,  H01L29/518 ,  H01L29/66068 ,  H01L29/7813

摘要： A SiC MOSFET has a subject that resistance in the source region is increased when annealing for metal silicidation is performed to a source region before forming the gate insulating film, the metal silicide layer of the source region is oxidized by an oxidizing treatment (including oxynitriding treatment) when the gate insulating film is formed. When a metal silicide layer to be formed on the surface of a SiC epitaxial substrate is formed before forming a gate insulating film interface layer (oxide film), and an anti-oxidation film for the metal silicide is formed on the metal silicide layer, it is possible to suppress oxidation of the metal silicide layer by the oxidizing treatment upon forming the gate insulating film interface layer and the resistance of the source region can be decreased without lowering the channel mobility.

摘要翻译： SiC MOSFET具有在形成栅极绝缘膜之前对源极区域进行金属硅化退火时源极区域的电阻增加的对象，源极区域的金属硅化物层通过氧化处理（包括氮氧化处理）被氧化 ）形成栅极绝缘膜。 当在形成栅极绝缘膜界面层（氧化物膜）之前形成在SiC外延基板的表面上形成的金属硅化物层时，在金属硅化物层上形成用于金属硅化物的抗氧化膜， 可以通过在形成栅极绝缘膜界面层时的氧化处理来抑制金属硅化物层的氧化，并且可以降低源极区域的电阻而不降低沟道迁移率。