摘要:
A test object carrying device for use in an appearance inspection device for checking the appearance of the test objects, which includes a back/front reversal unit for turning over the test objects being conveyed by the forward conveying means and supplying them to the returning unit; the back/front reversal means is provided with a first drum for rotating and conveying the test objects unit while holding the test objects on the peripheral surface thereof, and a second drum for rotating and conveying the test objects being conveyed by the first drum while holding the test objects on the peripheral surface thereof; wherein at least one of the first drum and the second drum is structured so that the test objects are transferred in parallel to the forward conveying unit and returning unit by rotating and conveying the test objects while holding them on the peripheral surface thereof.
摘要:
An appearance inspection device, which inspects an appearance of test objects, includes a first and second conveying means 21 and 22a conveying the test objects, a back/front reversal means 23 turning over the front and back surfaces of the test objects being conveyed by the first conveying means 21 and supplying the test objects to the second conveying means 22a, and a plurality of image-pickup means 30b and 30c capturing images of each test object from upper oblique directions while the test objects are conveyed by the first and second conveying means 21 and 22a. The appearance inspection device also includes a defect detection means detecting the presence of defects in the test objects based on image data captured by the image-pickup means 30b and 30c. This appearance inspection device makes it possible to reliably and readily inspect an entire appearance of the test objects.
摘要:
A vibrating feeder provided with a feeder ball 14a having a circular bottom wall and a conveyance path formed along the periphery of the bottom wall 141a; a feeder body 16a supporting the feeder ball 14a so as to apply torsional vibration and conveying substance supplied on the bottom wall 141a along the conveyance path; and a main body supporting member for supporting the feeder body; the conveyance path comprising an ascending rail and descending rail disposed in the downstream of the ascending rail in the conveyance direction; the main body 18a supporting member supporting the feeder body 16a on a horizontal floor so that a torsion axis C, which becomes the center of the torsional vibration, is inclined relative to the vertical direction; the ascending rail and descending rail conveying the conveyed objects upwardly or downwardly relative to the horizontal direction while the feeder body being supported by the horizontal floor via the main body supporting member.
摘要:
An appearance inspection device for inspecting the appearance of test objects, comprising: a first and second conveying means 21 and 22a for conveying the test objects; a back/front reversal means 23 for turning over the front and back surfaces of the test objects being conveyed by the first conveying means 21 and supplying the test objects to the second conveying means 22a; a plurality of image-pickup means 30b and 30c for capturing images of each test object from upper oblique directions while the test objects are conveyed by the first and second conveying means 21 and 22a; and a defect detection means for detecting the presence of defects in the test objects based on image data captured by the image-pickup means 30b and 30c. This appearance inspection device makes it possible to reliably and readily inspect the entire appearance of the test objects.
摘要:
A test object carrying device for use in an appearance inspection device for checking the appearance of the test objects, which includes a back/front reversal means 23 for turning over the test objects being conveyed by the forward conveying means 21 and supplying them to the returning means 22a; the back/front reversal means is provided with a first drum 231a for rotating and conveying the test objects being conveyed by the forward conveying means 21 while holding the test objects on the peripheral surface thereof, and a second drum 232 for rotating and conveying the test objects being conveyed by the first drum 231a while holding the test objects on the peripheral surface thereof; wherein at least one of the first drum 231a and the second drum 232 is structured so that the test objects are transferred in parallel to the forward conveying means 21 and returning means 22a by rotating and conveying the test objects while holding them on the peripheral surface thereof. This carrying device makes it possible to convey the test objects in such a manner that the appearance of the test objects can be reliable and readily inspected.
摘要:
A vibrating feeder provided with a feeder ball 14a having a circular bottom wall and a conveyance path formed along the periphery of the bottom wall 141a; a feeder body 16a supporting the feeder ball 14a so as to apply torsional vibration and conveying substance supplied on the bottom wall 141a along the conveyance path; and a main body supporting member for supporting the feeder body; the conveyance path comprising an ascending rail and descending rail disposed in the downstream of the ascending rail in the conveyance direction; the main body 18a supporting member supporting the feeder body 16a on a horizontal floor so that a torsion axis C, which becomes the center of the torsional vibration, is inclined relative to the vertical direction; the ascending rail and descending rail conveying the conveyed objects upwardly or downwardly relative to the horizontal direction while the feeder body being supported by the horizontal floor via the main body supporting member.
摘要:
According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.
摘要:
A multi-pin connector has contact pins fixedly soldered into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in a desired form without a housing. The multi-pin connector can be manufactured in a short period of time and can have any pitch, any number of pins and any shape.
摘要:
Provided are isoelectric point(pI) markers for isoelectric focusing with fluorescence detection. The markers are fluorescence-labeled oligopeptides which comprise a fluorescence dye bonded chemically to the amino group of N-terminal amino acid of oligopeptide. The marker shows its unique and narrow pI band(peak) in electrophoresis or isoelectric focusing. The markers can be designed to have appropriate pI value, and cover wide range of pI (3
摘要:
Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.