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    ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE INCLUDING THE SAME
    1.
    发明申请
    ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE INCLUDING THE SAME 有权

    公开(公告)号：US20210265233A1

    公开(公告)日：2021-08-26

    申请号：US17315403

    申请日：2021-05-10

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Masato NOMIYA

    IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H03H9/145 ,  H03H9/25 ,  H03H9/64

    Abstract: An electronic component includes a substrate, a functional portion, external connection conductor portions, and first and second heat-conducting portions. The functional portion is located on first principal surface of the substrate and portion generates heat during operation. The external connection conductor portions are located directly on the first principal surface of the substrate or located below the first principal surface without direct contact with the substrate. The second principal surface of the substrate includes first and second regions. When viewed in plan in a thickness direction of the substrate, the first region does not overlap the functional portion, and the second region coincides with the functional portion. The first heat-conducting portion is located directly on all or a portion of the first region or located over all or a portion of the first region without direct contact with the substrate. The second heat-conducting portion is located directly on a region that is a portion of the second principal surface of the substrate and including at least a portion of the second region or located over the region without direct contact with the substrate and is discretely spaced away from the first heat-conducting portion when viewed in plan in the thickness direction of the substrate.

    ELECTRONIC DEVICE
    2.
    发明申请
    ELECTRONIC DEVICE 有权

    公开(公告)号：US20210250016A1

    公开(公告)日：2021-08-12

    申请号：US17243651

    申请日：2021-04-29

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Masato NOMIYA

    IPC: H03H9/64 ,  H03H9/72 ,  H04B1/10

    Abstract: An electronic component includes circuits that function independently of one another, and a switch electrically connected to the circuits. The electronic component includes a base body and two or more input/output terminals. The base body includes a main surface. The two or more input/output terminals are provided to the main surface of the base body, and include two first input/output terminals adjacent to each other. The switch changes one of the two first input/output terminals adjacent to each other to a hot terminal and changes the other to a ground terminal.

    ELECTRONIC COMPONENT
    4.
    发明申请
    ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210385949A1

    公开(公告)日：2021-12-09

    申请号：US17412314

    申请日：2021-08-26

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Masato NOMIYA

    IPC: H05K1/11 ,  H05K1/09

    Abstract: An electronic component includes a substrate and side wires. The substrate includes a first major surface, a second major surface, and a side surface. The side wires are on the side surface of the substrate and spaced apart from each other in a direction along an outer periphery of the substrate when viewed in plan in a thickness direction of the substrate. At least a portion of each of the side wires is provided indirectly on the side surface of the substrate. The electronic component further includes an electrically insulating layer interposed between the side surface of the substrate and the at least a portion of each of the side wires. Each of the side wires includes a bent portion bent when viewed in plan in the thickness direction of the substrate.

    ELECTRONIC COMPONENT DEVICE, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATION DEVICE
    6.
    发明申请
    ELECTRONIC COMPONENT DEVICE, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATION DEVICE 审中-公开

    公开(公告)号：US20190318871A1

    公开(公告)日：2019-10-17

    申请号：US16452590

    申请日：2019-06-26

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Masato NOMIYA

    IPC: H01G4/012 ,  H01F17/00 ,  H01F27/00 ,  H01G4/258 ,  H01G4/30 ,  H01G4/224 ,  H01G4/40 ,  H01F27/40 ,  H04B1/40

    Abstract: An electronic component device includes an electronic component, a resin structure including the electronic component such that one main surface thereof is exposed, a through-electrode, and first and second wiring layers, in which the electronic component includes an element body, an inner electrode in the element body and connected to the first and second wiring layers, and an adjustment electrode provided in an adjustment region in the element body, the first wiring layer is continuously provided on the inner electrode, the adjustment region, and the resin structure, and a thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy an expression of the thermal expansion coefficient of the resin structure≤the thermal expansion coefficient of the adjustment region≤the thermal expansion coefficient of the inner electrode.

    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
    7.
    发明申请
    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
    电子元件及其制造方法

    公开(公告)号：US20150156868A1

    公开(公告)日：2015-06-04

    申请号：US14611513

    申请日：2015-02-02

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Masato NOMIYA

    IPC: H05K1/02 ,  H05K3/00 ,  H05K3/12 ,  H05K1/03

    CPC classification number: H05K1/0298 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H05K1/0237 ,  H05K1/025 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/162 ,  H05K3/0067 ,  H05K3/12 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/09336 ,  H05K2201/09736

    Abstract: The electronic component of this invention includes a multilayer ceramic substrate 14 composed of a plurality of ceramic layers 12. A wiring electrode 16 and a planar electrode 18 are formed on a ceramic layer 12, which is an insulating layer. The planar electrode 18 is formed so as to be spaced apart from the wiring electrode 16 at the certain interval. An edge portion 22 is formed in a region of the planar electrode 18 adjacent to and spaced apart from the wiring electrode 16 at a certain interval. A central portion 20 is formed in a region of the planar electrode 18 other than the edge portion 22. At least the composition of the central portion 20 is different from the composition of the wiring electrode 16, and the composition of the edge portion 22 is the same as the composition of the wiring electrode 16.

    Abstract translation: 本发明的电子部件包括由多个陶瓷层12构成的多层陶瓷基板14.在作为绝缘层的陶瓷层12上形成有布线电极16和平面电极18。 平面电极18形成为以一定间隔与布线电极16间隔开。 边缘部分22以一定间隔形成在平面电极18的与布线电极16相邻并间隔开的区域中。 中心部分20形成在平面电极18的除了边缘部分22的区域中。至少中心部分20的组成与布线电极16的组成不同，边缘部分22的组成是 与布线电极16的组成相同。

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