LIGHT EMITTING DEVICE, METHOD OF FABRICATING THE LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM
    2.
    发明申请
    LIGHT EMITTING DEVICE, METHOD OF FABRICATING THE LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM 有权
    发光装置,制造发光装置的方法,发光装置包装和照明系统

    公开(公告)号:US20110186882A1

    公开(公告)日:2011-08-04

    申请号:US12948423

    申请日:2010-11-17

    IPC分类号: H01L33/26 H01L33/60

    摘要: Provided are a light emitting device, a method of manufacturing the light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a reflective layer including a first GaN-based semiconductor layer having a first refractive index, a second GaN-based semiconductor layer having a second refractive index less than the first refractive index, and a third GaN-based semiconductor layer having a third refractive index less than the second refractive index and a light emitting structure layer including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer on the reflective layer.

    摘要翻译: 提供了发光器件,制造发光器件的方法,发光器件封装和照明系统。 发光器件包括:反射层,包括具有第一折射率的第一GaN基半导体层,具有小于第一折射率的第二折射率的第二GaN基半导体层;以及第三GaN基半导体层,其具有 第三折射率小于第二折射率的发光结构层和包括第一导电类型半导体层,第二导电类型半导体层和设置在第一导电类型半导体层和第二导电类型半导体层之间的有源层的发光结构层 在反射层上。

    FABRICATION METHOD OF LIGHT EMITTING DEVICE
    3.
    发明申请
    FABRICATION METHOD OF LIGHT EMITTING DEVICE 有权
    发光装置的制造方法

    公开(公告)号:US20110229999A1

    公开(公告)日:2011-09-22

    申请号:US13050201

    申请日:2011-03-17

    IPC分类号: H01L33/32

    摘要: Provided is a method for fabricating a light emitting device. The method for fabricating the light emitting device includes forming a buffer layer including a compound semiconductor in which a rare-earth element is doped on a substrate, forming a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, which are successively stacked on the buffer layer, forming a first electrode layer on the light emitting structure, removing the substrate, and forming a second electrode layer under the light emitting structure.

    摘要翻译: 提供一种制造发光器件的方法。 制造发光器件的方法包括:形成包括掺杂有稀土元素的化合物半导体的缓冲层,形成包括第一导电类型半导体层,有源层和第二导电类型的发光结构 导电型半导体层,其依次层叠在缓冲层上,在发光结构上形成第一电极层,去除衬底,并在发光结构的下方形成第二电极层。

    LIGHT EMITTING DEVICE
    4.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号:US20140110720A1

    公开(公告)日:2014-04-24

    申请号:US14057193

    申请日:2013-10-18

    IPC分类号: H01L33/32

    摘要: A light emitting device includes a first semiconductor layer having a first conductive dopant, an active layer on the first semiconductor layer, an electron blocking layer on the active layer, a carrier injection layer between the active layer and the electron blocking layer, and a second semiconductor layer having a second conductive dopant on the electron blocking layer. The carrier injection layer includes the first conductive dopant and the second conductive dopant, and the first conductive dopant of the carrier injection layer has a concentration lower than a concentration of the second conductive dopant.

    摘要翻译: 发光器件包括具有第一导电掺杂剂的第一半导体层,第一半导体层上的有源层,有源层上的电子阻挡层,有源层和电子阻挡层之间的载流子注入层,以及第二半导体层 半导体层在电子阻挡层上具有第二导电掺杂剂。 载流子注入层包括第一导电掺杂剂和第二导电掺杂剂,并且载流子注入层的第一导电掺杂剂的浓度低于第二导电掺杂剂的浓度。

    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM
    6.
    发明申请
    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM 有权
    发光装置,发光装置包装和照明系统

    公开(公告)号:US20110240958A1

    公开(公告)日:2011-10-06

    申请号:US13079388

    申请日:2011-04-04

    申请人: Myung Hoon JUNG

    发明人: Myung Hoon JUNG

    IPC分类号: H01L33/06

    摘要: A light emitting device according to the embodiment includes a conductive support substrate; a second conductive semiconductor layer on the conductive support substrate; an active layer on the second conductive semiconductor layer; a first conductive semiconductor layer on the active layer, the first conductive semiconductor layer including a GaN layer, an InGaN layer, and a roughness formed with selectively removed the GaN and InGaN layers; and an electrode layer on the first conductive semiconductor layer.

    摘要翻译: 根据实施例的发光器件包括导电支撑衬底; 在所述导电支撑基板上的第二导电半导体层; 在所述第二导电半导体层上的有源层; 在所述有源层上的第一导电半导体层,所述第一导电半导体层包括GaN层,InGaN层和形成有选择性去除所述GaN和InGaN层的粗糙度; 以及第一导电半导体层上的电极层。