公开(公告)号：US07348772B2

公开(公告)日：2008-03-25

申请号：US10975736

申请日：2004-10-28

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

IPC分类号： G01R33/04

CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

摘要： A Printed Circuit Board (PCB) having a weak magnetic field sensor of the present invention includes a base plate on which a first excitation circuit and a first detection circuit are formed on each of the sides thereof, soft magnetic core bodies laminated on the top and bottom of the base plate, respectively, and formed of a plurality of soft magnetic cores, and outer layers that are laminated on the soft magnetic core bodies, respectively, and on which a second excitation circuit and a second detection circuit connected to the first excitation circuit and the first detection circuit through via holes are formed so as to surround the soft magnetic cores, respectively. The present invention is characterized in that the soft magnetic cores, the excitation circuit and the detection circuit formed on one side of the base plate are perpendicular to the soft magnetic cores, the excitation circuit and the detection circuit formed on the other side of the base plate.

摘要翻译： 本发明的具有弱磁场传感器的印刷电路板（PCB）包括：基板，其基板在其基板上形成有第一激励电路和第一检测电路，软磁芯体层叠在顶板上， 底板分别由多个软磁芯和层叠在软磁体上的外层构成，第二激励电路和第二检测电路分别连接到第一激励 电路和通过通孔的第一检测电路分别形成为围绕软磁芯。 本发明的特征在于，形成在基板的一侧上的软磁芯，激励电路和检测电路垂直于软磁芯，激励电路和检测电路形成在基座的另一侧 盘子。

公开(公告)号：US20060017435A1

公开(公告)日：2006-01-26

申请号：US10975736

申请日：2004-10-28

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

IPC分类号： G01R33/02

CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

摘要： A Printed Circuit Board (PCB) having a weak magnetic field sensor of the present invention includes a base plate on which a first excitation circuit and a first detection circuit are formed on each of the sides thereof, soft magnetic core bodies laminated on the top and bottom of the base plate, respectively, and formed of a plurality of soft magnetic cores, and outer layers that are laminated on the soft magnetic core bodies, respectively, and on which a second excitation circuit and a second detection circuit connected to the first excitation circuit and the first detection circuit through via holes are formed so as to surround the soft magnetic cores, respectively. The present invention is characterized in that the soft magnetic cores, the excitation circuit and the detection circuit formed on one side of the base plate are perpendicular to the soft magnetic cores, the excitation circuit and the detection circuit formed on the other side of the base plate.

摘要翻译： 本发明的具有弱磁场传感器的印刷电路板（PCB）包括：基板，其基板在其基板上形成有第一激励电路和第一检测电路，软磁芯体层叠在顶板上， 底板分别由多个软磁芯和层叠在软磁体上的外层构成，第二激励电路和第二检测电路分别连接到第一激励 电路和通过通孔的第一检测电路分别形成为围绕软磁芯。 本发明的特征在于，形成在基板的一侧上的软磁芯，激励电路和检测电路垂直于软磁芯，激励电路和检测电路形成在基座的另一侧 盘子。

公开(公告)号：US07394249B2

公开(公告)日：2008-07-01

申请号：US10965613

申请日：2004-10-14

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC分类号： G01R33/04

CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

摘要： Disclosed is a printed circuit board with a weak magnetic field sensor according to the present invention, which includes a substrate having first excitation circuits and first detection circuits formed on both sides thereof. First laminates are layered on both sides of the substrate, and have soft magnetic cores with a predetermined shape formed thereon. Second laminates are layered on the first laminates, and have second excitation circuits and second detection circuits, connected through via holes to the first excitation circuits and first detection circuits, respectively, so that the first and second excitation circuits and first and second detection circuits are wound around the soft magnetic cores, formed thereon. The soft magnetic cores each include a magnetic core and non-magnetic metal layers formed on both sides of the magnetic core.

摘要翻译： 公开了根据本发明的具有弱磁场传感器的印刷电路板，其包括具有形成在其两侧上的第一激励电路和第一检测电路的基板。 第一层压体层叠在基板的两侧，并且具有形成在其上的预定形状的软磁芯。 第二层叠体层叠在第一层叠体上，并具有分别通过通孔与第一激励电路和第一检测电路连接的第二激励电路和第二检测电路，使得第一和第二激励电路以及第一和第二检测电路 缠绕在其上形成的软磁芯上。 软磁芯各自包括形成在磁芯两侧的磁芯和非磁性金属层。

公开(公告)号：US20060001422A1

公开(公告)日：2006-01-05

申请号：US10965613

申请日：2004-10-14

申请人： Myung-Sam kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

发明人： Myung-Sam kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC分类号： G01R33/00

CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

摘要： Disclosed is a printed circuit board with a weak magnetic field sensor according to the present invention, which includes a substrate having first excitation circuits and first detection circuits formed on both sides thereof. First laminates are layered on both sides of the substrate, and have soft magnetic cores with a predetermined shape formed thereon. Second laminates are layered on the first laminates, and have second excitation circuits and second detection circuits, connected through via holes to the first excitation circuits and first detection circuits, respectively, so that the first and second excitation circuits and first and second detection circuits are wound around the soft magnetic cores, formed thereon. The soft magnetic cores each include a magnetic core and non-magnetic metal layers formed on both sides of the magnetic core.

摘要翻译： 公开了根据本发明的具有弱磁场传感器的印刷电路板，其包括具有形成在其两侧上的第一激励电路和第一检测电路的基板。 第一层压体层叠在基板的两侧，并且具有形成在其上的预定形状的软磁芯。 第二层叠体层叠在第一层叠体上，并具有分别通过通孔与第一激励电路和第一检测电路连接的第二激励电路和第二检测电路，使得第一和第二激励电路以及第一和第二检测电路 缠绕在其上形成的软磁芯上。 软磁芯各自包括形成在磁芯两侧的磁芯和非磁性金属层。

公开(公告)号：US08011086B2

公开(公告)日：2011-09-06

申请号：US11896105

申请日：2007-08-29

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

IPC分类号： H05K3/30 ,  H05K3/00 ,  H05K3/36 ,  H05K3/02 ,  H01R9/00

CPC分类号： H01L24/11 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 通过使用组件嵌入式印刷电路板的制造方法，该方法包括：将组件安装在其上形成图案的第一铜箔上，使得该部件与图案电连接; 在其上形成有至少一个导电突起的第二铜箔上堆叠具有形成在与所述部件相对应的位置的空腔的绝缘层; 将第一铜箔和第二铜箔堆叠在一起，使得该部件嵌入到空腔中，并且第一铜箔和第二铜箔通过导电突起电连接; 并且去除第一铜箔和第二铜箔的部分以形成电路图案，由第一铜箔形成的电路图案可以被埋置形式，使得可以制造薄的印刷电路板，当嵌入 倒装芯片类型组件。

公开(公告)号：US20080052906A1

公开(公告)日：2008-03-06

申请号：US11896105

申请日：2007-08-29

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

IPC分类号： H05K3/02

CPC分类号： H01L24/11 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 通过使用组件嵌入式印刷电路板的制造方法，该方法包括：将组件安装在其上形成图案的第一铜箔上，使得该部件与图案电连接; 在其上形成有至少一个导电突起的第二铜箔上堆叠具有形成在与所述部件相对应的位置的空腔的绝缘层; 将第一铜箔和第二铜箔堆叠在一起，使得该部件嵌入到空腔中，并且第一铜箔和第二铜箔通过导电突起电连接; 并且去除第一铜箔和第二铜箔的部分以形成电路图案，由第一铜箔形成的电路图案可以被埋置形式，使得可以制造薄的印刷电路板，当嵌入 倒装芯片类型组件。

公开(公告)号：US20070132536A1

公开(公告)日：2007-06-14

申请号：US11637664

申请日：2006-12-13

申请人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H01F5/00

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

摘要翻译： 公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US07697301B2

公开(公告)日：2010-04-13

申请号：US11637664

申请日：2006-12-13

申请人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

摘要翻译： 公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US20090124043A1

公开(公告)日：2009-05-14

申请号：US12149837

申请日：2008-05-08

申请人： Won-Cheol Bae ,  Young-Do Kweon ,  Doo-Hwan Lee

发明人： Won-Cheol Bae ,  Young-Do Kweon ,  Doo-Hwan Lee

IPC分类号： H01L21/52

CPC分类号： H05K1/187 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2224/92144 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H05K3/20 ,  H05K3/321 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/10674 ,  H05K2203/1469

摘要： A method of manufacturing a package board is disclosed. The method is for manufacturing a package board that has a pad electrically connected with a component, and includes: forming an indentation, which is in correspondence with the pad, in one side of a first insulating layer; filling a metal paste in the indentation; mounting the component on the first insulating layer in correspondence with a location of the indentation; and hardening the metal paste. Using this method, damage to the component can be prevented during the forming of vias, as the component is mounted after filling paste in an indentation formed in an insulating layer.

摘要翻译： 公开了一种制造封装板的方法。 该方法用于制造具有与部件电连接的焊盘的封装板，并且包括：在第一绝缘层的一侧形成与焊盘相对应的凹陷; 在压痕中填充金属膏; 将零件安装在与压痕位置对应的第一绝缘层上; 并硬化金属膏。 使用这种方法，在形成通孔期间可以防止部件的损坏，因为在将糊料填充在形成在绝缘层中的凹陷中之后安装部件。

公开(公告)号：US20100154210A1

公开(公告)日：2010-06-24

申请号：US12656781

申请日：2010-02-16

申请人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing a printed circuit board having embedded electronic components. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

摘要翻译： 一种具有嵌入式电子部件的印刷电路板的制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。