公开(公告)号：US20070132536A1

公开(公告)日：2007-06-14

申请号：US11637664

申请日：2006-12-13

申请人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H01F5/00

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

摘要翻译： 公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US20100154210A1

公开(公告)日：2010-06-24

申请号：US12656781

申请日：2010-02-16

申请人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing a printed circuit board having embedded electronic components. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

摘要翻译： 一种具有嵌入式电子部件的印刷电路板的制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US07697301B2

公开(公告)日：2010-04-13

申请号：US11637664

申请日：2006-12-13

申请人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

摘要翻译： 公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US20080006942A1

公开(公告)日：2008-01-10

申请号：US11708568

申请日：2007-02-21

申请人： Jung-Hyun Park ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Hoe-Ku Jung ,  Ji-Eun Kim

发明人： Jung-Hyun Park ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A bottom substrate of package on package and manufacturing method thereof is disclosed. A bottom substrate of a package on package electrically connected to a top substrate by means of a solder ball, including a core board, a solder ball pad formed on a surface of the core board in correspondence with a location of the solder ball, an insulation layer laminated on the core board, a through hole formed by removing a part of the insulation layer such that the solder ball pad is exposed, and a metallic layer filled in the through hole and connected electrically with the solder ball, allows the number of ICs mounted on a bottom substrate to be increased without increasing the size of a solder ball, and allows the size and pitch of the solder balls to be made smaller by controlling the thickness of the insulation layer laminated on the bottom substrate, whereby more signal transmission is possible between a top substrate and a bottom substrate.

摘要翻译： 公开了一种封装的底部衬底及其制造方法。 封装的封装的底部衬底通过焊球电连接到顶部衬底，所述焊球包括芯板，与所述焊球的位置对应地形成在所述芯板的表面上的焊球焊盘，绝缘体 层叠在芯板上的通孔，通过去除绝缘层的一部分使得焊球焊盘露出而形成的通孔以及填充在通孔中并与焊球电连接的金属层允许IC的数量 安装在底部基板上以增加焊球的尺寸，并且通过控制层叠在底部基板上的绝缘层的厚度，可以使焊球的尺寸和间距变小，由此更多的信号传输是 可能在顶部基板和底部基板之间。

公开(公告)号：US20100255634A1

公开(公告)日：2010-10-07

申请号：US12801574

申请日：2010-06-15

申请人： Jung-Hyun Park ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Hoe-Ku Jung ,  Ji-Eun Kim

发明人： Jung-Hyun Park ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC分类号： H01L21/60 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A manufacturing method of bottom substrate of package. A bottom substrate of a package on package electrically connected to a top substrate by means of a solder ball, including a core board, a solder ball pad formed on a surface of the core board in correspondence with a location of the solder ball, an insulation layer laminated on the core board, a through hole formed by removing a part of the insulation layer such that the solder ball pad is exposed, and a metallic layer filled in the through hole and connected electrically with the solder ball, allows the number of ICs mounted on a bottom substrate to be increased without increasing the size of a solder ball, and allows the size and pitch of the solder balls to be made smaller by controlling the thickness of the insulation layer laminated on the bottom substrate, whereby more signal transmission is possible between a top substrate and a bottom substrate.

摘要翻译： 封装底部基板的制造方法。 封装的封装的底部衬底通过焊球电连接到顶部衬底，所述焊球包括芯板，与所述焊球的位置对应地形成在所述芯板的表面上的焊球焊盘，绝缘体 层叠在芯板上的通孔，通过去除绝缘层的一部分使得焊球焊盘露出而形成的通孔以及填充在通孔中并与焊球电连接的金属层允许IC的数量 安装在底部基板上以增加焊球的尺寸，并且通过控制层叠在底部基板上的绝缘层的厚度，可以使焊球的尺寸和间距变小，由此更多的信号传输是 可能在顶部基板和底部基板之间。

公开(公告)号：US20080251494A1

公开(公告)日：2008-10-16

申请号：US12078058

申请日：2008-03-26

申请人： Jung-Hyun Park ,  Byoung-Youl Min ,  Jeong-Woo Park ,  Jong-Gyu Choi ,  Ji-Eun Kim ,  Myung-Sam Kang

发明人： Jung-Hyun Park ,  Byoung-Youl Min ,  Jeong-Woo Park ,  Jong-Gyu Choi ,  Ji-Eun Kim ,  Myung-Sam Kang

IPC分类号： H01B13/00 ,  C25D5/34

CPC分类号： C25D7/123 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/205 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/108

摘要： A method of manufacturing a circuit board is disclosed. The method may include: forming a relievo pattern, which is in a corresponding relationship with a circuit pattern, on a metal layer that is stacked on a carrier; stacking and pressing the carrier onto an insulation layer with the relievo pattern facing the insulation layer; transcribing the metal layer and the relievo pattern into the insulation layer by removing the carrier; forming a via hole in the insulation layer on which the metal layer is transcribed; and filling the via hole and forming a plating layer over the metal layer by performing plating over the insulation layer on which the metal layer is transcribed. As the relievo pattern may be formed on the metal layer stacked on the carrier, and the relievo pattern may be transcribed into the insulation layer, high-density circuit patterns can be formed.

摘要翻译： 公开了一种制造电路板的方法。 该方法可以包括：在层叠在载体上的金属层上形成与电路图案对应关系的释放图案; 将载体堆叠并压制到绝缘层上，其中减震图案面向绝缘层; 通过移除载体将金属层和释放图案转印到绝缘层中; 在所述绝缘层上形成通孔，所述绝缘层中所述金属层被转录到所述绝缘层上; 并通过在其上转印有金属层的绝缘层上进行电镀来填充通孔并在金属层上形成镀层。 由于可以在堆叠在载体上的金属层上形成缓和图案，并且可以将缓冲图案转录到绝缘层中，可以形成高密度电路图案。

公开(公告)号：US20080115355A1

公开(公告)日：2008-05-22

申请号：US11984209

申请日：2007-11-14

申请人： Jung-Hyun Park ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Myung-Sam Kang

发明人： Jung-Hyun Park ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Myung-Sam Kang

IPC分类号： H05K3/10 ,  H01K3/10

CPC分类号： H05K3/421 ,  H05K1/115 ,  H05K3/205 ,  H05K2201/0394 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2203/0353 ,  H05K2203/0542 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of manufacturing a printed circuit board is disclosed. Using the method, which includes embedding a first circuit pattern and a second circuit pattern in one side and the other side of an insulation substrate, forming a via hole by removing portions of the insulation substrate and the first circuit pattern, and electrically connecting the first circuit pattern and the second circuit pattern by forming a plating layer in the via hole, it is possible to form high-density circuits, as circuitry may be formed in portions that might have been occupied by lands, and more circuitry may be implemented for a given area of insulation substrate, whereby a fine-patterned printed circuit board may be implemented that has a high degree of integration. Also, a printed circuit board can be produced which allows good signal transfers between layers and with which fine circuit patterns can be implemented with inexpensive costs.

摘要翻译： 公开了一种制造印刷电路板的方法。 使用该方法，其包括在绝缘基板的一侧和另一侧嵌入第一电路图案和第二电路图案，通过去除绝缘基板和第一电路图案的部分而形成通孔，并且将第一 电路图案和第二电路图案，通过在通孔中形成镀层，可以形成高密度电路，因为电路可以形成为可能已经被焊盘占据的部分，并且可以实现更多的电路用于 可以实现具有高度集成度的精细图案化印刷电路板。 此外，可以制造印刷电路板，其可以在层之间进行良好的信号传输，并且可以以廉价的成本实现精细的电路图案。

公开(公告)号：US20070290344A1

公开(公告)日：2007-12-20

申请号：US11783871

申请日：2007-04-12

申请人： Myung-Sam Kang ,  Byoung-Youl Min ,  Joon-Sung Kim ,  Je-Gwang Yoo ,  Jong-Gyu Choi

发明人： Myung-Sam Kang ,  Byoung-Youl Min ,  Joon-Sung Kim ,  Je-Gwang Yoo ,  Jong-Gyu Choi

IPC分类号： H01L23/488 ,  H01L21/44

CPC分类号： H01L23/13 ,  H01L21/4857 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K1/111 ,  H05K3/0023 ,  H05K3/108 ,  H05K3/205 ,  H05K3/243 ,  H05K3/28 ,  H05K2201/0394 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to a printed circuit board, and in particular, to a printed circuit board for a package of electronic components and manufacturing method thereof. One aspect of present invention provides a manufacturing method of a printed circuit board for an electronic component package, which includes: forming a circuit pattern including bonding pads on one side of a first insulation layer, laminating a second insulation layer onto one side of the first insulation layer, and exposing the bonding pads by removing a part of the first insulation layer and the second insulation layer corresponding to the location in which the bonding pads is formed.

摘要翻译： 印刷电路板技术领域本发明涉及一种印刷电路板，特别涉及一种电子元件封装用印刷电路板及其制造方法。 本发明的一个方面提供了一种用于电子部件封装的印刷电路板的制造方法，其包括：形成包括在第一绝缘层的一侧上的焊盘的电路图案，将第二绝缘层层压到第一绝缘层的一侧上 绝缘层，并且通过去除与形成接合焊盘的位置相对应的第一绝缘层和第二绝缘层的一部分来暴露接合焊盘。

公开(公告)号：US5841291A

公开(公告)日：1998-11-24

申请号：US764511

申请日：1996-12-12

申请人： Ken Kuang-Fu Liu ,  Byoung-Youl Min ,  Robert John Moti ,  Syed A. Husain

发明人： Ken Kuang-Fu Liu ,  Byoung-Youl Min ,  Robert John Moti ,  Syed A. Husain

IPC分类号： G01R1/073 ,  H01L21/66 ,  G01R31/02

CPC分类号： G01R1/0735

摘要： First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester structure. Second and third conductive regions are electrically connected respectively to the power and ground terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region to filter high-frequency noise components from power and ground potentials provided by the power source.

摘要翻译： 沿着沿着由柔性基板传导的导电的第一和第二位置电连接的第一和第二凸起分别被定向成与被测试的模具的焊盘和测试器结构的焊盘接触。 第二和第三导电区域分别电连接到电源和电气设备的电源和接地端子。 第二和第三区域与第一导电区域间隔开，以将高频噪声分量与由电源提供的功率和地电位进行滤波。

公开(公告)号：US07326858B2

公开(公告)日：2008-02-05

申请号：US10731246

申请日：2003-12-10

申请人： Seok-Kyu Lee ,  Byoung-Youl Min ,  Hyun-Ju Jin ,  Jang-Kyu Kang

发明人： Seok-Kyu Lee ,  Byoung-Youl Min ,  Hyun-Ju Jin ,  Jang-Kyu Kang

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H05K3/382 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/09718

摘要： Disclosed is a printed circuit board which is advantageous in terms of high capacitance by embedding capacitors comprising polymer capacitor pastes with high-dielectric constant coated on an inner layer of the printed circuit board and then semi-dried to a state of B-stage.

摘要翻译： 公开了一种印刷电路板，其通过将包含高介电常数的聚合物电容器浆料的电容器包埋在印刷电路板的内层上，然后半干燥至B级的状态而在高容量方面是有利的。