COPOLYMER-SILICA HYBRID AEROGELS AND METHODS FOR THE PREPARATION THEREOF

    公开(公告)号:US20220204718A1

    公开(公告)日:2022-06-30

    申请号:US17608210

    申请日:2020-05-01

    Abstract: The present application relates to copolymer-silica hybrid aerogels as well as methods for the preparation thereof. The methods comprise hydrolyzing a silica precursor in an organic solvent to obtain a partially polymerized silica wet gel, reacting the partially polymerized silica wet gel with a copolymer of Formula (II) to obtain a copolymer-silica hybrid wet gel, reacting the copolymer-silica hybrid wet gel with a surface passivation agent and removing solvent from the copolymer-silica hybrid wet gel to obtain the copolymer-silica hybrid aerogel. The mechanical properties of the copolymer-silica hybrid aerogels can be further improved by blending cellulose nanofibrils into the hybrid aerogels. (II)

    Voltage and current triggered switch, and step-down DC-DC converters containing such a switch

    公开(公告)号:US10476367B2

    公开(公告)日:2019-11-12

    申请号:US15933970

    申请日:2018-03-23

    Abstract: A voltage and current triggered switch that turns on when a voltage across the switch reaches a turn-on voltage and that turns off when a current through the switch drops below a holding current. The switch features a Zener diode having a breakdown voltage. The Zener diode is connected to set the turn-on voltage of the switch to be the breakdown voltage of the Zener diode. Also provided is a step-down DC-DC converter comprising such a switch. Also provided is a system that has a tribo-electricity source or a piezo-electricity source, the provided step-down DC-DC converter and a load connected to an output of the stepdown DC-DC converter.

    PROCESS FOR DEPOSITING METAL ON A SUBSTRATE
    10.
    发明申请
    PROCESS FOR DEPOSITING METAL ON A SUBSTRATE 有权
    在基材上沉积金属的工艺

    公开(公告)号:US20160160066A1

    公开(公告)日:2016-06-09

    申请号:US14906670

    申请日:2014-07-16

    Abstract: A process for depositing a metal on a substrate involves the use of two reduction reactions in a bottom-up based tandem manner starting from a substrate surface and working upward. A first reduction reaction starts on the substrate surface at ambient temperature, and a second reduction reaction, which is initiated by the reaction heat of the first reduction reaction, occurs in a reactive ink solution film coated on top, which becomes solid after the reaction. Gas and other small molecules generated from the reduction reactions, and the solvent, can readily escape through the upper surface of the film before the solid metal layer is formed or during post-treatment, with no or few voids left in the metal film. Thus, the process can be used to form highly conductive films and features at ambient temperature on various substrates.

    Abstract translation: 用于在基板上沉积金属的方法涉及以从底部向上串联的方式使用两个还原反应,从基板表面开始并向上工作。 第一还原反应在环境温度下在基材表面上开始,并且通过第一还原反应的反应热引发的第二还原反应发生在反应性油墨溶液膜上,反应性油墨溶液膜在反应后变成固体。 由还原反应产生的气体和其它小分子以及溶剂可以在形成固体金属层之前或在后处理期间容易地从薄膜的上表面逸出,而金属膜中没有留下或少量的空隙。 因此,该方法可用于在环境温度下在各种基材上形成高导电膜和特征。

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