公开(公告)号：US09537071B2

公开(公告)日：2017-01-03

申请号：US14928550

申请日：2015-10-30

Applicant: NICHIA CORPORATION

Inventor： Hirofumi Ichikawa ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/48 ,  B29C45/00 ,  B29C45/14 ,  H01L23/00 ,  H01L33/64

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

Abstract translation: 一种制造具有树脂封装的发光器件的方法，所述树脂封装在热固化之后在350nm和800nm之间的波长处提供等于或大于70％的光学反射率，并且其中树脂部分和引线形成在 在外侧表面上具有大致相同的平面，包括通过上模和下模夹着设置有切口部的引线框架的步骤，将含有光反射材料的热固性树脂转印成型 模具夹在上模具和下模具之间以在引线框架中形成树脂模制体，以及沿切口部分切割树脂模制体和引线框架的步骤。

公开(公告)号：US10700241B2

公开(公告)日：2020-06-30

申请号：US16150259

申请日：2018-10-02

Applicant: NICHIA CORPORATION

Inventor： Hirofumi Ichikawa ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L33/48 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L23/00 ,  H01L33/00 ,  H01L33/62 ,  H01L33/64 ,  H01L33/50 ,  H01L33/56

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US09287476B2

公开(公告)日：2016-03-15

申请号：US13969182

申请日：2013-08-16

Applicant: NICHIA CORPORATION

Inventor： Hirofumi Ichikawa ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L21/00 ,  H01L23/495 ,  H01L33/62 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L33/48 ,  H01L23/00

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

Abstract translation: 一种制造具有树脂封装的发光器件的方法，所述树脂封装在热固化之后在350nm和800nm之间的波长处提供等于或大于70％的光学反射率，并且其中树脂部分和引线形成在 在外侧表面上具有大致相同的平面，包括通过上模和下模夹着设置有切口部的引线框架的步骤，将含有光反射材料的热固性树脂转印成型 模具夹在上模具和下模具之间以在引线框架中形成树脂模制体，以及沿切口部分切割树脂模制体和引线框架的步骤。

公开(公告)号：US12211959B2

公开(公告)日：2025-01-28

申请号：US17371943

申请日：2021-07-09

Applicant: NICHIA CORPORATION

Inventor： Hirofumi Ichikawa ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L33/48 ,  B29C45/00 ,  B29C45/14 ,  H01L23/00 ,  H01L23/495 ,  H01L33/00 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

Abstract: A light emitting device includes: a resin package including: a resin part, and a plurality of leads including a first lead and a second lead, wherein the resin package has a concave portion having a bottom face at which a part of an upper surface of the first lead and a part of an upper surface of the second lead are exposed from the resin part; a light emitting element mounted on the bottom face of the concave portion; and a sealing member covering the light emitting element in the concave portion. The plurality of leads comprise a plurality of notch parts including a first notch part on a first side corresponding to a first outer side surface of the resin package and a second notch part on a second side corresponding to a second outer side surface of the resin package.

公开(公告)号：US11094854B2

公开(公告)日：2021-08-17

申请号：US16883714

申请日：2020-05-26

Applicant: NICHIA CORPORATION

Inventor： Hirofumi Ichikawa ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L33/00 ,  H01L23/00 ,  B29C45/14 ,  H01L33/48 ,  B29C45/00 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/50 ,  H01L33/56

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US09960326B2

公开(公告)日：2018-05-01

申请号：US15435710

申请日：2017-02-17

Applicant: NICHIA CORPORATION

Inventor： Masafumi Kuramoto ,  Akiko Yamasaki ,  Hirofumi Ichikawa ,  Yasunori Shimizu ,  Akihiro Ota

IPC: H01L33/00 ,  H01L33/56 ,  H01L33/54 ,  H01L33/50 ,  C09K11/02 ,  C09K11/77 ,  H01L33/62

CPC classification number: H01L33/56 ,  C09K11/025 ,  C09K11/7774 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a base substrate having a recessed portion at a flat upper surface thereof. The recessed portion has an inner wall. A sealing member is provided in the recessed portion. The sealing member contains surface-treated particles, or particles coexisting with a dispersing agent. The particles have a particle diameter of 1 nm or more and 100 μm or less. The particles are made of an organic material or an inorganic material. The organic material and the inorganic material are free of a phosphor. The at least a part of an edge portion of the sealing member is a region located in the vicinity of an edge of the recessed portion which is a boundary between a surface of the inner wall and the flat upper surface. The at least one of the particles and aggregates of particles are unevenly distributed in the region.

公开(公告)号：US09559274B2

公开(公告)日：2017-01-31

申请号：US15132886

申请日：2016-04-19

Applicant: NICHIA CORPORATION

Inventor： Akihiro Ota ,  Seitaro Akagawa ,  Hirofumi Ichikawa ,  Yasunori Shimizu

IPC: H01L23/29 ,  H01L21/00 ,  H01L33/56 ,  C09K11/61 ,  C09K11/77 ,  C09K11/02 ,  C08K3/34 ,  C08K3/36 ,  C08K3/22 ,  H01L33/50 ,  H01L33/62 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L33/56 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C08K2003/2227 ,  C08K2003/2237 ,  C08K2003/2244 ,  C08K2003/2296 ,  C09K11/025 ,  C09K11/617 ,  C09K11/7734 ,  H01L33/486 ,  H01L33/502 ,  H01L33/504 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Provided a light emitting device comprising: a package; a light emitting element disposed in the package; an encapsulation member that covers the light emitting element, the encapsulation member being formed from a resin composition that contains a fluorescent material, a resin, and nanoparticles selected from at least one of the group consisting of aluminum oxide nanoparticles, titanium oxide nanoparticles, zinc oxide nanoparticles, zirconium oxide nanoparticles, and silicon oxide nanoparticles, wherein when the resin composition includes silicon oxide nanoparticles, the content of the silicon oxide nanoparticles is 0.02 to 5 mass parts relative to 100 mass parts of the resin; and wherein the fluorescent material is a red-light emitting fluorescent material including a fluoride material having a chemical composition that includes tetravalent manganese, at least one selected from the group consisting of alkali metal elements and NH4+, and at least one selected from the group consisting of elements from Group 4 of the periodic table and elements from Group 14 of the periodic table.

Abstract translation: 提供一种发光器件，包括：封装; 设置在所述封装中的发光元件; 覆盖所述发光元件的封装构件，所述封装构件由含有荧光材料的树脂组合物，树脂和选自氧化铝纳米颗粒，氧化钛纳米颗粒，氧化锌中的至少一种的纳米颗粒形成 纳米颗粒，氧化锆纳米颗粒和氧化硅纳米颗粒，其中当树脂组合物包含氧化硅纳米颗粒时，氧化硅纳米颗粒的含量相对于100质量份树脂为0.02〜5质量份; 并且其中所述荧光材料是包括具有化学组成的氟化物材料的红色发光荧光材料，所述化学组成包括四价锰，选自碱金属元素和NH 4 +的至少一种，以及选自以下的至少一种： 周期表第4组元素和元素周期表第14组元素。

公开(公告)号：US10115870B2

公开(公告)日：2018-10-30

申请号：US15360316

申请日：2016-11-23

Applicant: NICHIA CORPORATION

Inventor： Hirofumi Ichikawa ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  B29C45/00 ,  B29C45/14 ,  H01L23/00 ,  H01L33/64 ,  H01L33/56

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US09490411B2

公开(公告)日：2016-11-08

申请号：US14928570

申请日：2015-10-30

Applicant: NICHIA CORPORATION

Inventor： Hirofumi Ichikawa ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L21/00 ,  H01L21/283 ,  H01L29/66 ,  H01L33/62 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L33/48 ,  H01L23/00 ,  H01L33/64

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US09397276B2

公开(公告)日：2016-07-19

申请号：US14600372

申请日：2015-01-20

Applicant: NICHIA CORPORATION

Inventor： Akihiro Ota ,  Seitaro Akagawa ,  Hirofumi Ichikawa ,  Yasunori Shimizu

IPC: H01L23/29 ,  H01L21/00 ,  H01L33/56 ,  H01L21/02

CPC classification number: H01L33/56 ,  H01L21/02601 ,  H01L33/486 ,  H01L33/502 ,  H01L33/504 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2251/5369 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Provided a light emitting device comprising: a package; a light emitting element disposed in the package; an encapsulation member that covers the light emitting element, the encapsulation member being formed from a resin composition that contains a fluorescent material, a resin, and nanoparticles selected from at least one of the group consisting of aluminum oxide nanoparticles, titanium oxide nanoparticles, zinc oxide nanoparticles, zirconium oxide nanoparticles, and silicon oxide nanoparticles, wherein when the resin composition includes silicon oxide nanoparticles, the content of the silicon oxide nanoparticles is 0.02 to 5 mass parts relative to 100 mass parts of the resin; and wherein the fluorescent material includes a Mn4+ activated red-light emitting fluorescent material having a chemical composition represented by the formula (I): A2[M1−xMn4+xF6]  (I) wherein A is at least one cation selected from the group consisting of K+, Li+, Na+, Rb+, Cs+, and NH4+; M is at least one element selected from the group consisting of elements from Group 4 of the periodic table and elements from Group 14 of the periodic table, and x satisfies 0

Abstract translation: 提供一种发光器件，包括：封装; 设置在所述封装中的发光元件; 覆盖所述发光元件的封装构件，所述封装构件由含有荧光材料的树脂组合物，树脂和选自氧化铝纳米颗粒，氧化钛纳米颗粒，氧化锌中的至少一种的纳米颗粒形成 纳米颗粒，氧化锆纳米颗粒和氧化硅纳米颗粒，其中当树脂组合物包含氧化硅纳米颗粒时，氧化硅纳米颗粒的含量相对于100质量份树脂为0.02〜5质量份; 并且其中所述荧光材料包括具有由式（I）表示的化学组成的Mn4 +活化的红色发光荧光材料：A2 [M1-xMn4 + xF6]（I）其中A是至少一种选自以下的阳离子： 的K +，Li +，Na +，Rb +，Cs +和NH4 +; M是选自元素周期表第4族元素和元素周期表第14族元素中的至少一种元素，x满足0