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公开(公告)号：US20180097165A1
公开(公告)日：2018-04-05
申请号：US15719795
申请日：2017-09-29
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI
CPC classification number: H01L33/62 , H01L23/5387 , H01L25/0753 , H01L33/486 , H01L33/502 , H01L33/58 , H01L33/60 , H01L33/641 , H01L2224/16225
Abstract: A light emitting device includes a flexible substrate, a light emitting element, a conductive connecting material, and a holding member. The flexible substrate includes a flexible base and a wire arranged on the flexible base. The light emitting element is mounted on the substrate. The conductive connecting material connects the light emitting element to the wire. The holding member surrounds a region on the substrate including the light emitting element and the conductive connecting material, on a surface of the substrate on which the light emitting element is mounted. The holding member is arranged adjacent to the wire. The holding member includes a first region arranged on an inner side of the holding member, and having higher rigidity than rigidity of the flexible base, and a second region arranged adjacent to the first region outside the first region, and having lower rigidity than rigidity of the first region.
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公开(公告)号：US20180019231A1
公开(公告)日：2018-01-18
申请号：US15705263
申请日：2017-09-15
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI
IPC: H01L25/075 , H01L33/20
CPC classification number: H01L25/0753 , H01L33/20 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting element includes a semiconductor including an active layer, and a planar shape of the light emitting elements including a concave polygon. The planar shape of the concave polygon has interior angles including at least one acute angle.
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公开(公告)号：US20170288105A1
公开(公告)日：2017-10-05
申请号：US15475161
申请日：2017-03-31
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI
CPC classification number: H01L33/62 , H01L25/13 , H01L33/52 , H01L33/58 , H01L33/60 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: A method of manufacturing a light emitting element mounting base member includes: arranging a plurality of core members each including an electrical conductor core and a light-reflecting insulating member provided on a surface of the electrical conductor core; cutting the arranged core members to form a base member preparatory body including at least one cut surface on which at least one of the electrical conductor cores and the insulating members are exposed; and insert molding by placing the base member preparatory body in a set of mold, and injecting a light blocking resin composition into the set of mold such that at least one of the electrical conductor cores or at least one metal film formed on at least one of the electrical conductor cores are exposed on at least one outer surface of the light emitting element mounting base member.
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公开(公告)号：US20200328334A1
公开(公告)日：2020-10-15
申请号：US16911401
申请日：2020-06-25
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI
Abstract: A wiring board according to one embodiment of the present disclosure includes: partitions each having insulating property; and conductive members that are respectively disposed in at least two adjacent regions among a plurality of regions partitioned by the partitions. Two of the conductive members respectively disposed in the adjacent regions are joined to each other through an opening formed on one of the partitions interposed between the two of the conductive members, to serve as part of a wiring.
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5.发明申请公开(公告)号：US20190148610A1
公开(公告)日：2019-05-16
申请号：US16223229
申请日：2018-12-18
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI
Abstract: A method of manufacturing a light emitting element mounting base member includes: arranging a plurality of core members each including an electrical conductor core and a light-reflecting insulating member provided on a surface of the electrical conductor core; cutting the arranged core members to form a base member preparatory body including at least one cut surface on which at least one of the electrical conductor cores and the insulating members are exposed; and insert molding by placing the base member preparatory body in a set of mold, and injecting a light blocking resin composition into the set of mold such that at least one of the electrical conductor cores or at least one metal film formed on at least one of the electrical conductor cores are exposed on at least one outer surface of the light emitting element mounting base member.
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Patent Agency Ranking
公开(公告)号：US20170358725A1
公开(公告)日：2017-12-14
申请号：US15599543
申请日：2017-05-19
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI
Abstract: A method of manufacturing a wiring board according to one embodiment of the present disclosure includes: providing at least one first conductive member that serves as part of a wiring; covering the at least one first conductive member with an insulating member that has at least one opening; disposing at least one second conductive member on the opening of the insulating member, the second conductive member serving as part of the wiring; electrically joining the at least one first conductive member and the at least one second conductive member to each other at the opening; and cutting a region including the at least one first conductive member, the insulating member, and the at least one second conductive member, to form an element mounting surface.
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公开(公告)号：US20170287883A1
公开(公告)日：2017-10-05
申请号：US15623211
申请日：2017-06-14
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI , Hiroto TAMAKI , Tadaaki MIYATA
IPC: H01L25/075
CPC classification number: H01L25/0753 , F21K9/27 , F21Y2103/10 , F21Y2115/10 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/16
Abstract: A method of manufacturing a light-emitting device includes steps of: preparing at least one substrate having a plurality of through holes; providing an electric wire on a rear surface side of the substrate so that a plurality of portions of the electric wire communicates with a front surface side of the substrate at the plurality of through holes of the substrate; and respectively mounting a plurality of light-emitting diodes to the respective portions of the electric wire that communicate with the front surface side of the substrate.
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公开(公告)号：US20150137152A1
公开(公告)日：2015-05-21
申请号：US14541199
申请日：2014-11-14
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI
IPC: H01L25/075 , H01L33/20
CPC classification number: H01L25/0753 , H01L33/20 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting element includes a semiconductor including an active layer, and a planar shape of the light emitting elements including a concave polygon. The planar shape of the concave polygon has interior angles including at least one acute angle.
Abstract translation: 发光元件包括包括有源层的半导体和包括凹多边形的发光元件的平面形状。 凹多边形的平面形状具有包括至少一个锐角的内角。
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公开(公告)号：US20220302356A1
公开(公告)日：2022-09-22
申请号：US17832304
申请日：2022-06-03
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI
Abstract: A display device includes: a mounting substrate; and a plurality of light-emitting devices arranged on the mounting substrate. The mounting substrate includes: a plurality of thin-film transistor (TFT) elements, and a plurality of conductive pads, each of which is connected to one of the plurality of TFT elements. Each of the plurality of light-emitting devices includes: a semiconductor stacked body, a first metallic section electrically connected to the semiconductor stacked body, and a second metallic section electrically connected to the semiconductor stacked body. The plurality of conductive pads include: a plurality of first conductive pads, each electrically connected to the first metallic section of a respective light-emitting device, and a plurality of second conductive pads, each electrically connected to the second metallic section of the respective light-emitting device. The TFT elements are disposed in regions other than underneath the first metallic sections and the second metallic sections.
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10.发明申请公开(公告)号：US20210239888A1
公开(公告)日：2021-08-05
申请号：US17214122
申请日：2021-03-26
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI
Abstract: A method of producing a transmission grating includes: providing first and second glass plates, each having a first main surface defining a plurality of elongated reverse trapezoidal grooves, each having a reverse trapezoidal shape in a vertical cross-section and being defined by a first wall, a second wall, and a bottom surface, wherein the elongated reverse trapezoidal grooves are formed at an uniform interval, thus defining a plurality of elongated trapezoidal protrusions, each having a first wall, a second wall, and an upper surface; engaging the elongated trapezoidal protrusions of the first glass plate with the elongated reverse trapezoidal grooves of the second glass plate; and fitting the first walls of the protrusions with the first walls of the grooves and closely fitting the upper surfaces of the protrusions with the bottom surfaces of the grooves, and bonding the first glass plate to the second glass plate.
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