公开(公告)号：US20240400464A1

公开(公告)日：2024-12-05

申请号：US18698385

申请日：2022-10-05

Applicant: NITTO DENKO CORPORATION

Inventor： Maho KAWAKAMI ,  Shu SASAKI ,  Kazuhiro FUKE

IPC: C04B35/82 ,  C04B35/622 ,  C04B35/626 ,  C04B41/48 ,  C04B41/52 ,  C04B41/83 ,  C04B41/89 ,  F16L59/02 ,  H01M10/651 ,  H01M10/658

Abstract: An object is to provide a thermal insulation material excellent in both thermal insulation property and mechanical strength. A thermal insulation material includes a thermal insulation layer containing silicon dioxide particles and inorganic fibers, and is excellent in both thermal insulation property and mechanical strength, because density ρ [g/cm3] of thermal insulation layer, and a cumulative proportion R1 for a fiber length of >0 mm and

公开(公告)号：US20210345457A1

公开(公告)日：2021-11-04

申请号：US17273493

申请日：2019-09-06

Applicant: NITTO DENKO CORPORATION

Inventor： Tetsuro HORI ,  Shu SASAKI ,  Naoko KATO ,  Toshihiro TSURUSAWA ,  Kyotaro YAMADA

IPC: H05B3/26 ,  H05B3/03 ,  H05B3/16

Abstract: A heater (1a) includes: a substrate (10); a heat-generation layer (20) that is a conductive metal oxide layer (22); a pair of power supply electrodes (30); and a pressure-sensitive adhesive bonding laminate (40). The substrate (10) is formed of an organic polymer. The heat-generation layer (20) is disposed in contact with the substrate (10) in the thickness direction of the substrate (10). The pair of power supply electrodes (30) are electrically connected to the heat-generation layer (20). The pressure-sensitive adhesive bonding laminate (40) has a pressure-sensitive adhesive surface (41a) used for pressure-sensitive adhesive bonding with an adherend. In the pressure-sensitive adhesive bonding laminate (40), a plurality of pressure-sensitive adhesive layers (41, 42) and at least one support (45) for the plurality of pressure-sensitive adhesive layers are alternately laminated between the pressure-sensitive adhesive surface (41a) and the heat-generating layer (20).

公开(公告)号：US20160121576A1

公开(公告)日：2016-05-05

申请号：US14927870

申请日：2015-10-30

Applicant: NITTO DENKO CORPORATION

Inventor： Shu SASAKI ,  Makoto SAITOU ,  Kiyoaki KODAMA ,  Masato FUJITA

IPC: B32B5/18 ,  B32B15/08 ,  B32B27/06 ,  B32B5/02

CPC classification number: B32B5/18 ,  B32B3/30 ,  B32B5/022 ,  B32B5/22 ,  B32B5/245 ,  B32B5/26 ,  B32B7/06 ,  B32B7/12 ,  B32B15/046 ,  B32B15/08 ,  B32B15/12 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/12 ,  B32B27/281 ,  B32B27/304 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/365 ,  B32B29/02 ,  B32B2262/106 ,  B32B2264/108 ,  B32B2266/02 ,  B32B2266/0214 ,  B32B2266/0228 ,  B32B2266/025 ,  B32B2266/0257 ,  B32B2266/0264 ,  B32B2266/0278 ,  B32B2266/0292 ,  B32B2266/06 ,  B32B2266/08 ,  B32B2266/104 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/212 ,  B32B2307/514 ,  B32B2307/56 ,  B32B2307/72 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2457/208

Abstract: An electroconductive pressure-sensitive adhesive cushioning member includes an electroconductive resin foam layer, an electroconductive composite layer, and an electroconductive intermediate layer disposed between the electroconductive resin foam layer and the electroconductive composite layer. The electroconductive composite layer includes an electroconductive base layer and an electroconductive attachment layer disposed on a surface of the electroconductive base layer and having an attachment surface to be attached to an obstacle. Thus, the electroconductive cushioning member is excellent in conductivity, an electromagnetic waves shieling property, and a cushioning property.

Abstract translation: 导电压敏粘合剂缓冲构件包括导电树脂发泡层，导电复合层和设置在导电树脂泡沫层和导电复合层之间的导电中间层。 导电性复合层包括导电性基底层和导电性附着层，该导电性基底层和导电性附着层配置在导电性基底层的表面上，具有附着在障碍物上的附着面。 因此，导电性缓冲部件的导电性，电磁波隔离性和缓冲性优异。

公开(公告)号：US20150147556A1

公开(公告)日：2015-05-28

申请号：US14553532

申请日：2014-11-25

Applicant: NITTO DENKO CORPORATION

Inventor： Shu SASAKI ,  Jyunichi NAKAYAMA ,  Rie YUTO ,  Yoshio TERADA

IPC: C09J9/02 ,  C08K9/10 ,  C09J11/04 ,  C09J7/00 ,  C09J11/06

CPC classification number: C09J9/02 ,  C08K7/16 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/005 ,  C09J7/00 ,  C09J7/10 ,  C09J11/00 ,  C09J133/08 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  G02F2202/16 ,  G02F2202/28 ,  H05K3/323 ,  Y10T428/25 ,  Y10T428/256

Abstract: An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 μm or more to about 50 μm or less and at least one further peak top existing in a particle size range from about 1 μm or more to about 12 μm or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm3.

Abstract translation: 导电性粘合带包含含有树脂成分和导电性粒子的粘合剂层。 导电颗粒具有至少一个峰顶，其存在于约15μm或更多至约50μm或更小的粒度范围内，并且至少一个另外的峰顶存在于约1μm或更大至约 其粒度分布曲线为12μm以下。 导电性颗粒以40质量％以上且80质量％以下的量包含在粘合剂层中，并且具有大于零但小于8g / cm 3的真实密度。

公开(公告)号：US20240405328A1

公开(公告)日：2024-12-05

申请号：US18695932

申请日：2022-09-27

Applicant: NITTO DENKO CORPORATION

Inventor： Takehiro UI ,  Shu SASAKI ,  Kazuhiro FUKE ,  Maho KAWAKAMI

IPC: H01M10/658 ,  H01M10/6555 ,  H01M50/293

Abstract: A thermal insulation material for a battery of the present invention includes a compression adjustment layer and a thermal insulation layer laminated to each other. A ratio of a thickness of the compression adjustment layer to a thickness of the thermal insulation layer is more than 0.5 and less than 4.5, and a compressive stress is from 0.34 MPa through 3.45 MPa when the compression adjustment layer is compressed and deformed at any rate within a range of from 25% through 70% in a thickness direction with respect to a thickness before compression.

公开(公告)号：US20230140996A1

公开(公告)日：2023-05-11

申请号：US17915317

申请日：2021-02-25

Applicant: NITTO DENKO CORPORATION

Inventor： Koji SAKAMOTO ,  Takahiko ITO ,  Naoki NAGAOKA ,  Shu SASAKI ,  Daiki KATO

IPC: B32B5/18 ,  B32B27/08 ,  B32B27/32 ,  B32B25/08 ,  B32B27/34

CPC classification number: B32B5/18 ,  B32B27/08 ,  B32B27/32 ,  B32B25/08 ,  B32B27/34 ,  B32B2266/025 ,  B32B2266/0257 ,  B32B2250/04 ,  B32B2250/24 ,  B32B2250/22 ,  B32B2307/206 ,  B32B2305/026 ,  B32B2266/104 ,  B32B2457/00

Abstract: A resin sheet includes a porous structure. The porous structure is configured to adjust transmission of a millimeter wave. The porous structure has a relative permittivity varying in stages in a thickness direction of the resin sheet from a plane on which the millimeter wave is incident, the relative permittivity varying such that a difference between average relative permittivities in two adjacent layer portions is a predetermined value or less, the layer portions each having a particular thickness smaller than a wavelength of the millimeter wave. The porous structure has, as pores, only pores each having a pore diameter equal to or less than 10% of the wavelength of the millimeter wave.

公开(公告)号：US20190039208A1

公开(公告)日：2019-02-07

申请号：US16073368

申请日：2017-01-10

Applicant: NITTO DENKO CORPORATION

Inventor： Takafumi HIDA ,  Kazuhiro KITAYAMA ,  Shu SASAKI

IPC: B24C1/04 ,  B24C1/10 ,  C09J7/24 ,  C09J7/38 ,  C09J7/20 ,  C09J5/00

Abstract: Provided is a masking tape for a shot peening process, including: a substrate having a first surface and a second surface; and a pressure-sensitive adhesive layer disposed on the first surface of the substrate. The masking tape has a breaking strength of 55 N/15 mm or more and exhibits an impact absorption rate of 20% or more in a falling ball impact test. Further, the masking tape has a displacement distance of 2 mm or less after 1 h from an initial position in a holding power test at 40° C. which is performed by applying a load of 500 g.