公开(公告)号：US09023510B2

公开(公告)日：2015-05-05

申请号：US13635288

申请日：2011-03-11

Applicant: Kyotaro Goto ,  Naoto Hagiwara ,  Yuki Kawai ,  Katsuei Ishida

Inventor： Kyotaro Goto ,  Naoto Hagiwara ,  Yuki Kawai ,  Katsuei Ishida

IPC: H01M2/02 ,  H01G11/22 ,  H01G11/08 ,  H01G11/78 ,  H01M2/06 ,  H01M2/10 ,  H01M10/04 ,  H01G11/82 ,  H01M2/22 ,  H01M10/0525 ,  H01M10/0583 ,  H01M10/42

CPC classification number: H01M2/0277 ,  H01G11/08 ,  H01G11/22 ,  H01G11/78 ,  H01G11/82 ,  H01M2/021 ,  H01M2/0212 ,  H01M2/06 ,  H01M2/1094 ,  H01M2/22 ,  H01M10/0436 ,  H01M10/045 ,  H01M10/0525 ,  H01M10/0583 ,  H01M10/425 ,  Y02E60/13

Abstract: [Object] To provide an electrochemical device that permits a thin package, as well as securely prevents an electrolyte or gas in an internal space from leaking outside even when temperature rise occurs in the electrochemical device during the process where the electrochemical device is reflow soldered to a circuit board or encapsulated into an IC card.[Solution] In the electrochemical device RB1, the main body of the package PA includes first cover plate 15, first terminal plate 12, frame plate 14, second terminal plate 13, and second cover plate 16 stacked in this order and bonded at the facing surfaces. The electric storage element SD is encapsulated in internal space IS formed, between the cover plates 15, 16, by the through holes 12a1, 13a1 in the frame sections 12a, 13a of the terminal plates 12, 13 and the through hole 14a in the frame plate 14.

Abstract translation: 本发明提供允许薄封装的电化学装置，并且即使在电化学装置回流焊接到电化学装置期间在电化学装置中发生温度上升时，也可以可靠地防止内部空间中的电解质或气体泄漏到外部 电路板或封装在IC卡中。 [解决方案]在电化学装置RB1中，封装PA的主体包括依次层叠的第一盖板15，第一端子板12，框架板14，第二端子板13和第二盖板16， 表面。 蓄电元件SD被封装在通过端子板12,13的框架部分12a，13a中的通孔12a1，13a1和框架中的通孔14a之间形成在盖板15,16之间的内部空间IS中 板14。

公开(公告)号：US20110176254A1

公开(公告)日：2011-07-21

申请号：US13122139

申请日：2009-09-30

Applicant: Kazushi Yawata ,  Naoto Hagiwara ,  Katsuei Ishida

Inventor： Kazushi Yawata ,  Naoto Hagiwara ,  Katsuei Ishida

IPC: H01G9/00

CPC classification number: H01G9/0003 ,  H01G9/016 ,  H01G9/10 ,  H01G9/155 ,  H01G11/18 ,  H01G11/74 ,  H01G11/80 ,  H01M2/0212 ,  H01M2/06 ,  H01M2/30 ,  Y02E60/13

Abstract: Provided is an electrochemical device applicable to high-temperature reflow soldering wherein a lead-free solder is used. An electric double layer capacitor (10) is provided with a capacitor element (11), a package (14) having the capacitor element (11) sealed therein, and a positive electrode terminal (12) and a negative electrode terminal (13), each of which is led out from the capacitor element and is provided with a part sealed in the package (14) with the capacitor element and other part led out to the outside the package. On a part of the positive electrode terminal (12) and on a part of the negative electrode terminal (13), increased thermal resistance sections (HR1) for suppressing heat transfer to the capacitor element (11) via the terminals (12, 13) from other parts of the positive electrode terminal (12) and other parts of the negative electrode terminal (13) are arranged, respectively.

Abstract translation: 提供了适用于使用无铅焊料的高温回流焊接的电化学装置。 双电层电容器（10）具有电容器元件（11），密封有电容器元件（11）的封装（14）和正极端子（12）和负极端子（13）， 其中的每一个从电容器元件引出并且设置有密封在封装（14）中的部分，电容器元件和其它部分被引出到封装的外部。 在正极端子（12）的一部分和负极端子（13）的一部分上，经由端子（12,13）抑制向电容器元件（11）的热传递的增加的热阻部（HR1） 从正极端子（12）的其他部分和负极端子（13）的其他部分分别配置。

公开(公告)号：US08802268B2

公开(公告)日：2014-08-12

申请号：US13203663

申请日：2010-03-16

Applicant: Naoto Hagiwara ,  Katsuei Ishida ,  Kazushi Yawata

Inventor： Naoto Hagiwara ,  Katsuei Ishida ,  Kazushi Yawata

IPC: H01M2/18 ,  H01M10/0585 ,  H01M10/0525 ,  H01M4/70 ,  H01G11/76 ,  H01M10/04 ,  H01G9/02 ,  H01M14/00 ,  H01G9/008 ,  H01G9/04 ,  H01G9/00 ,  H01G11/72 ,  H01M2/02 ,  H01G11/52 ,  H01M10/0583 ,  H01G11/12 ,  H01G11/70 ,  H01G11/86 ,  H01G11/80

CPC classification number: H01G9/016 ,  H01G9/02 ,  H01G9/058 ,  H01G9/155 ,  H01G11/12 ,  H01G11/52 ,  H01G11/70 ,  H01G11/72 ,  H01G11/76 ,  H01G11/80 ,  H01G11/86 ,  H01M2/021 ,  H01M2/18 ,  H01M4/70 ,  H01M10/045 ,  H01M10/0459 ,  H01M10/0525 ,  H01M10/0583 ,  H01M14/00 ,  Y02E60/122 ,  Y02E60/13 ,  Y10T29/417 ,  Y10T29/49108 ,  Y10T29/49114

Abstract: Provide an electrochemical device offering a large capacity per current collector and a low internal resistance, which is also easy to assemble. Provided is a laminated sheet body 16S by inserting a negative-electrode continuous body 11BW between an adjacent pair of first current collectors 12a, 12a with their first current collector main units 12a1 connected together, and also between an adjacent pair of first current collectors 12a, 12a with their first tabs 12a2 connected together, with respect to a plurality of positive electrodes 11A arranged in the width direction apart from each other, after which the negative-electrode continuous body of the laminated sheet body is cut to the unit width dimension of an element to obtain a plurality of laminated bodies 16.

Abstract translation: 提供每个集电器提供大容量的电化学装置和低内部电阻，这也易于组装。 通过在相邻的一对第一集电体12a，12a之间插入负极连接体11BW，其第一集电体主体12a1连接在一起，以及相邻的一对第一集电体12a， 12a，其第一突片12a2相对于彼此沿宽度方向布置的多个正电极11A连接在一起，之后将层压片体的负极连续体切割成单位宽度尺寸 以获得多个层压体16。

公开(公告)号：US08619409B2

公开(公告)日：2013-12-31

申请号：US13122139

申请日：2009-09-30

Applicant: Kazushi Yawata ,  Naoto Hagiwara ,  Katsuei Ishida

Inventor： Kazushi Yawata ,  Naoto Hagiwara ,  Katsuei Ishida

IPC: H01G4/228 ,  H01G9/00 ,  H01G5/01 ,  H01G5/38 ,  H01G5/06 ,  H01M8/04 ,  H01M10/50

CPC classification number: H01G9/0003 ,  H01G9/016 ,  H01G9/10 ,  H01G9/155 ,  H01G11/18 ,  H01G11/74 ,  H01G11/80 ,  H01M2/0212 ,  H01M2/06 ,  H01M2/30 ,  Y02E60/13

Abstract: An electrochemical device, e.g., an electric double layer capacitor, is applicable to high-temperature reflow soldering wherein a lead-free solder is used, and is provided with an electric storage element, a package having the electric storage element sealed therein, and a positive electrode terminal and a negative electrode terminal, each of which is led out from the electric storage element and is provided with a part sealed in the package with the electric storage element and other part led out to the outside the package. On a part of the positive electrode terminal and on a part of the negative electrode terminal, increased thermal resistance sections for suppressing heat transfer to the electric storage element via the terminals from other parts of the positive electrode terminal and other parts of the negative electrode terminal are arranged, respectively.

Abstract translation: 诸如双电层电容器的电化学装置适用于使用无铅焊料的高温回流焊接，并且设置有蓄电元件，其中密封有蓄电元件的封装和 正极端子和负极端子，每个从蓄电元件引出，并且设置有封装在封装中的部分，其中蓄电元件和其它部分被引出到封装外部。 在正极端子的一部分和负极端子的一部分上，增加了用于抑制从正极端子的其他部分和负极端子的其他部分经由端子对蓄电元件的热传递的热阻部分 分别布置。

公开(公告)号：US08765277B2

公开(公告)日：2014-07-01

申请号：US12990633

申请日：2009-05-07

Applicant: Kazushi Yawata ,  Motoki Kobayashi ,  Katsuei Ishida ,  Naoto Hagiwara

Inventor： Kazushi Yawata ,  Motoki Kobayashi ,  Katsuei Ishida ,  Naoto Hagiwara

IPC: H01M2/12 ,  H01M2/30

CPC classification number: H01M2/1094 ,  H01G9/016 ,  H01G9/10 ,  H01G9/155 ,  H01G11/12 ,  H01G11/18 ,  H01G11/74 ,  H01G11/76 ,  H01G11/82 ,  H01M2/0257 ,  H01M2/0292 ,  H01M2/06 ,  H01M10/613 ,  H01M10/647 ,  H01M10/658 ,  Y02E60/13

Abstract: Provided is an electrochemical device which is compatible with high-temperature reflow soldering using lead-free solder. An electric double-layer capacitor 10-1 has a structure in which a positive terminal 12 and a negative terminal 13 are led out of a package 14 where an electric storage element 11 is sealed. The entire package 14 and the bases of led-out portions of the positive terminal 12 and the negative terminal 13 are covered by a thermal insulation material layer 16 having a thermal conductivity lower than that of the package 14.

Abstract translation: 提供了一种与使用无铅焊料的高温回流焊相容的电化学装置。 双电层电容器10-1具有将正极端子12和负极端子13从密封蓄电元件11的封装体14引出的结构。 整个封装14和正极端子12和负极端子13的引出部分的基底被导热率低于封装14的导热率的绝热材料层16覆盖。

公开(公告)号：US20130122350A1

公开(公告)日：2013-05-16

申请号：US13636302

申请日：2011-03-11

Applicant: Naoto Hagiwara ,  Katsuei Ishida

Inventor： Naoto Hagiwara ,  Katsuei Ishida

IPC: H01M4/139 ,  H01G9/15 ,  H01G9/00 ,  H01M4/13 ,  H01M10/0525

CPC classification number: H01M4/139 ,  H01G9/0029 ,  H01G9/15 ,  H01G11/02 ,  H01G11/04 ,  H01G11/12 ,  H01G11/84 ,  H01M2/08 ,  H01M2/266 ,  H01M4/13 ,  H01M10/0436 ,  H01M10/0525 ,  H01M10/0585 ,  Y02E60/122 ,  Y02E60/13 ,  Y02P70/54 ,  Y10T29/49117

Abstract: [Object] One object is to provide an electric storage element for electrochemical devices that can prevent fall of active material powder from an outer edge of an active material layer, thereby preventing functional disorders due to the fall of the active material powder.[Solution] In accordance with one aspect, an electric storage element SD11 has laminated structure wherein active material layers (first active material layer 13 and second active material layer 16) are placed between an ion permeable layer 12 and a first collector layer 15 and between the ion permeable layer 12 and a second collector layer 15. The active material layers have a smaller outline than the ion permeable layer 12 and are tightly enclosed with insulating layers (first insulating layer 14 and second insulating layer 17) filling the respective ambient regions corresponding to the difference in outlines from the ion permeable layer 12.

Abstract translation: 一个目的是提供一种用于电化学装置的蓄电元件，其能够防止活性物质粉末从活性物质层的外边缘掉落，从而防止由于活性物质粉末的下降而导致的功能障碍。 [方案]根据一个方面，蓄电元件SD11具有层叠结构，其中活性材料层（第一活性物质层13和第二活性物质层16）设置在离子可渗透层12和第一集电体层15之间以及 离子透过层12和第二集电层15.活性物质层的外形比离子透过层12小，并且被绝缘层（第一绝缘层14和第二绝缘层17）紧密地封闭，绝缘层填充相应的环境区域 与离子渗透层12的轮廓的差异。

公开(公告)号：US20120257357A1

公开(公告)日：2012-10-11

申请号：US13500272

申请日：2010-08-31

Applicant: Kyotaro Goto ,  Naoto Hagiwara ,  Katsuei Ishida

Inventor： Kyotaro Goto ,  Naoto Hagiwara ,  Katsuei Ishida

IPC: H05K7/00

CPC classification number: H01G9/10 ,  H01G11/12 ,  H01G11/72 ,  H01G11/80 ,  Y02E60/13 ,  Y10T29/417 ,  Y10T29/43

Abstract: Disclosed is an electrochemical capacitor that can be reflow soldered, and wherein film package is used on the capacitor body. The container (20) of the electrochemical capacitor (ECC) stores the film package (11) of the capacitor body (10) within a storage space (SR) such that sealing sections (11a-11c) do not contact the inner surface of the storage space (SR). Inner material (30), which cover the sealing sections (11a-11c) and rear edge of the film package 11 and are adhered to the inner surface of the storage space (SR), affixing the film package (11) within the storage space (SR), are provided in a rectangular framework to the regions in the storage space (SR) of the container (20) that correspond to said sealing sections (11a-11c) and rear edge.

Abstract translation: 公开了可以回流焊接的电化学电容器，并且其中在电容器主体上使用膜封装。 电化学电容器（ECC）的容器（20）将电容器主体（10）的薄膜封装（11）存储在存储空间（SR）内，使得密封部分（11a-11c）不接触 存储空间（SR）。 覆盖密封部分（11a-11c）和胶片包装11的后边缘并粘附到存储空间（SR）的内表面的内部材料（30），将胶卷包装（11）固定在存储空间 （SR）设置在与所述密封部分（11a-11c）和后边缘相对应的容器（20）的存储空间（SR）中的区域中的矩形框架中。

公开(公告)号：US20120040231A1

公开(公告)日：2012-02-16

申请号：US13203663

申请日：2010-03-16

Applicant: Naoto Hagiwara ,  Katsuei Ishida ,  Kazushi Yawata

Inventor： Naoto Hagiwara ,  Katsuei Ishida ,  Kazushi Yawata

IPC: H01M2/18 ,  H01M10/0585 ,  H01G9/155 ,  H01G9/02 ,  H01G9/15

CPC classification number: H01G9/016 ,  H01G9/02 ,  H01G9/058 ,  H01G9/155 ,  H01G11/12 ,  H01G11/52 ,  H01G11/70 ,  H01G11/72 ,  H01G11/76 ,  H01G11/80 ,  H01G11/86 ,  H01M2/021 ,  H01M2/18 ,  H01M4/70 ,  H01M10/045 ,  H01M10/0459 ,  H01M10/0525 ,  H01M10/0583 ,  H01M14/00 ,  Y02E60/122 ,  Y02E60/13 ,  Y10T29/417 ,  Y10T29/49108 ,  Y10T29/49114

Abstract: Provide an electrochemical device offering a large capacity per current collector and a low internal resistance, which is also easy to assemble. Provided is a laminated sheet body 16S by inserting a negative-electrode continuous body 11BW between an adjacent pair of first current collectors 12a, 12a with their first current collector main units 12a1 connected together, and also between an adjacent pair of first current collectors 12a, 12a with their first tabs 12a2 connected together, with respect to a plurality of positive electrodes 11A arranged in the width direction apart from each other, after which the negative-electrode continuous body of the laminated sheet body is cut to the unit width dimension of an element to obtain a plurality of laminated bodies 16.

Abstract translation: 提供每个集电器提供大容量的电化学装置和低内部电阻，这也易于组装。 通过在相邻的一对第一集电体12a，12a之间插入负极连接体11BW，其第一集电体主体12a1连接在一起，以及相邻的一对第一集电体12a， 12a，其第一突片12a2相对于彼此沿宽度方向布置的多个正电极11A连接在一起，之后将层压片体的负极连续体切割成单位宽度尺寸 以获得多个层压体16。

公开(公告)号：US20110045327A1

公开(公告)日：2011-02-24

申请号：US12990633

申请日：2009-05-07

Applicant: Kazushi Yawata ,  Motoki Kobayashi ,  Katsuei Ishida ,  Naoto Hagiwara

Inventor： Kazushi Yawata ,  Motoki Kobayashi ,  Katsuei Ishida ,  Naoto Hagiwara

IPC: H01M2/12 ,  H01M2/30

CPC classification number: H01M2/1094 ,  H01G9/016 ,  H01G9/10 ,  H01G9/155 ,  H01G11/12 ,  H01G11/18 ,  H01G11/74 ,  H01G11/76 ,  H01G11/82 ,  H01M2/0257 ,  H01M2/0292 ,  H01M2/06 ,  H01M10/613 ,  H01M10/647 ,  H01M10/658 ,  Y02E60/13

Abstract: Provided is an electrochemical device which is compatible with high-temperature reflow soldering using lead-free solder. An electric double-layer capacitor 10-1 has a structure in which a positive terminal 12 and a negative terminal 13 are led out of a package 14 where an electric storage element 11 is sealed. The entire package 14 and the bases of led-out portions of the positive terminal 12 and the negative terminal 13 are covered by a thermal insulation material layer 16 having a thermal conductivity lower than that of the package 14.

Abstract translation: 提供了一种与使用无铅焊料的高温回流焊相容的电化学装置。 双电层电容器10-1具有将正极端子12和负极端子13从密封蓄电元件11的封装体14引出的结构。 整个封装14和正极端子12和负极端子13的引出部分的基底被导热率低于封装14的导热率的绝热材料层16覆盖。

公开(公告)号：US08902594B2

公开(公告)日：2014-12-02

申请号：US13500272

申请日：2010-08-31

Applicant: Kyotaro Goto ,  Naoto Hagiwara ,  Katsuei Ishida

Inventor： Kyotaro Goto ,  Naoto Hagiwara ,  Katsuei Ishida

IPC: H05K7/00 ,  H01G11/72 ,  H01G11/12 ,  H01G11/80 ,  H01G9/10

CPC classification number: H01G9/10 ,  H01G11/12 ,  H01G11/72 ,  H01G11/80 ,  Y02E60/13 ,  Y10T29/417 ,  Y10T29/43

Abstract: Disclosed is an electrochemical capacitor that can be reflow soldered, and wherein film package is used on the capacitor body. The container (20) of the electrochemical capacitor (ECC) stores the film package (11) of the capacitor body (10) within a storage space (SR) such that sealing sections (11a-11c) do not contact the inner surface of the storage space (SR). Inner material (30), which cover the sealing sections (11a-11c) and rear edge of the film package 11 and are adhered to the inner surface of the storage space (SR), affixing the film package (11) within the storage space (SR), are provided in a rectangular framework to the regions in the storage space (SR) of the container (20) that correspond to said sealing sections (11a-11c) and rear edge.

Abstract translation: 公开了可以回流焊接的电化学电容器，并且其中在电容器主体上使用膜封装。 电化学电容器（ECC）的容器（20）将电容器主体（10）的薄膜封装（11）存储在存储空间（SR）内，使得密封部分（11a-11c）不接触 存储空间（SR）。 覆盖密封部分（11a-11c）和胶片包装11的后边缘并粘附到存储空间（SR）的内表面的内部材料（30），将胶卷包装（11）固定在存储空间 （SR）设置在与所述密封部分（11a-11c）和后边缘相对应的容器（20）的存储空间（SR）中的区域中的矩形框架中。