摘要:
A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.
摘要:
A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.
摘要:
A polyarylene sulfide resin composition contains 30% to 75% by weight of a polyarylene sulfide resin (A), 15% to 70% by weight of a fiber reinforcement (B) containing silic acid as a major component and having an average fiber diameter of 15 .mu.m or shorter and an average fiber length of 300 .mu.m or longer, and 1% to 25% by weight of a fiber reinforcement (C) containing Al.sub.2 O.sub.3 and SiO.sub.2 as major components in a ratio in weight of Al.sub.2 O.sub.3 to SiO.sub.2 ranging from 0.8 to 1 to 1.3 to 1 and having an average fiber diameter of 7 .mu.m or shorter and an average fiber length of 150 .mu.m or shorter. The composition is remarkable as molding material and a molded article resulting from the composition offers excellent mechanical strength and characteristics for metal plating. The metal-plated, molded article from the composition is particularly excellent in platability such as plate adhesion and plate gloss as well as short etching time.
摘要:
A polyarylene sulfide resin composition contains a polyarylene sulfide containing at least one group selected from a group consisting of an amino group and an amide group, a polyamide resin, an epoxy resin and, as needed, a filler. A further composition contains 100 parts by weight of the polyarylene sulfide, 0.05 to 5 parts of the epoxy resin, and 5 to 400 parts of the filler. Another type of the resin composition contains the polyarylene sulfide, the polyamide, a compound selected from an acid, an acid anhydride and an acid halide, each having in its molecule not less than two functional groups reactive with the amino group or the amide group, and, as needed, the filler. A further type of the resin composition contains the polyarylene sulfide, the compound and, as needed, an inorganic filler subjected to surface treatment with a silane type coupling agent. A still further type of the resin composition contains the polyarylene sulfide and the compound. A still further type of the resin composition contains the polyarylene sulfide and the inorganic filler subjected to surface treatment with an epoxysilane type coupling agent.
摘要:
An epoxy resin composition for semiconductor sealing, comprising as essential components:(A) an epoxy resin,(B) a phenolic resin curing agent comprising 30-100% by weight, based on the total amount of the phenolic resin curing agent, of a silicone-modified phenolic resin curing agent obtained by reacting a phenolic resin with at least one of silicone compounds represented by the following formulas [I] and [II] ##STR1## wherein ##STR2## A: --R--COOH, ##STR3## or H, R: a lower alkylene group,10.ltoreq.N=l+m+n+2.ltoreq.200,0.ltoreq.m/N.ltoreq.0.1, and 5.ltoreq.N/n.ltoreq.50,(C) an inorganic filler, and(D) a curing accelerator.
摘要:
To provide an insulating and thermally conductive resin composition from which a molded article having a high insulating properties and a high thermal conductivity can be produced and which is excellent in moldability, a molded article, and a method of producing the resin composition. The insulating and thermally conductive resin composition of the invention includes at least 30% by volume or more of a thermoplastic resin, 10 to 40% by volume of metallic aluminum type filler, and 5 to 25% by volume of a flame retardant. Particularly, addition of 1 to 10% by volume of a metal powder having a melting point of 500° C. or higher and 1 to 10% by volume of a low melting point alloy having a melting point of 500° C. or lower can provide more isotropic thermal conduction.
摘要:
A polyarylene sulfide resin composition contains a polyarylene sulfide containing at least one group selected from a group consisting of an amino group and an amide group, a polyamide resin, an epoxy resin and, as needed, a filler. A further composition contains 100 parts by weight of the polyarylene sulfide, 0.05 to 5 parts of the epoxy resin, and 5 to 400 parts of the filler. Another type of the resin composition contains the polyarylene sulfide, the polyamide, a compound selected from an acid, an acid anhydride and an acid halide, each having in its molecule not less than two functional groups reactive with the amino group or the amide group, and, as needed, the filler. A further type of the resin composition contains the polyarylene sulfide, the compound and, as needed, an inorganic filler subjected to surface treatment with a silane type coupling agent. A still further type of the resin composition contains the polyarylene sulfide and the compound. A still further type of the resin composition contains the polyarylene sulfide and the inorganic filler subjected to surface treatment with an epoxysilane type coupling agent.
摘要:
A polyarylene sulfide has an inherent viscosity [.eta..sub.i n h ] of 0.1 to 0.5 dl/g, a weight-average molecular weight of 1.times.10.sup.4 to 2.times.10.sup.5 ; a ratio of the inherent viscosity [.eta..sub.i n h ] to a calculated viscosity [.eta.].sub.calc ([.eta..sub.i n h /[.eta.].sub.calc) of 0.4/1 to 0.8/1; and a degree of whiteness of 50 or higher when measured in accordance with whiteness testing procedures (JIS P8123). The polyarylene sulfide is prepared by reaction by contacting at least one member of a metallic sulfide (A) selected from an alkali metal sulfide and an alkali metal hydrosulfide with a dihalogen aromatic compound (B) and an aromatic compound (C) having three or more than three functional groups in a polar solvent in a molar ratio of the dihalogen aromatic compound (B) to the metallic sulfide (A) [(B)/(A)] ranging from 1.035/1 to 1.300/1 and in a molar ratio of the aromatic compound (C) to the dihalogen aromatic compound (B) [(C)/(B)] ranging from 0.003/1 to 0.05/1.A polyarylene sulfide resin composition contains the polyarylene sulfide having the above properties and and at least one member of a filler selected from a fiber filler and a powdery or granular filler.The polyarylene sulfide resin composition has the mechanical strength, heat resistance, long-term stability, and chemical resistance superior to the polyarylene sulfide.