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    Method for forming solder pattern on board
    3.
    发明申请
    Method for forming solder pattern on board 审中-公开
    船上形成焊锡图案的方法

    公开(公告)号：US20070134434A1

    公开(公告)日：2007-06-14

    申请号：US11605034

    申请日：2006-11-28

    申请人： Hiroki Yokoyama ,  Yuichiro Minabe

    发明人： Hiroki Yokoyama ,  Yuichiro Minabe

    IPC分类号： C08J7/04

    CPC分类号： H05K3/3484 ,  H05K2201/0257 ,  H05K2203/013

    摘要： The present invention provides a method which enables to save the trouble to prepare alloys having required particular compositions responding to the purposes and to prepare solder ink made from the alloys, and which enables to produce various forms of solder pattern on the board by adjusting the composition freely at the point of printing. The method for forming a solder pattern on a board by ink jet printing comprises the step of injecting two or more kinds of respective metal pastes on a board independently, wherein a solder composition of a solder pattern to be formed is adjusted by the amount of injection of the respective metal pastes in the area that the metal pastes are injected thereto.

    摘要翻译： 本发明提供一种方法，其能够根据目的制备具有所需特定组成的合金，并且制备由合金制成的焊料油墨，并且能够通过调节组合物在板上产生各种形式的焊料图案 在打印点自由。 通过喷墨印刷在板上形成焊料图案的方法包括将独立地在板上注入两种或更多种各自的金属浆料的步骤，其中将通过注射量调节要形成的焊料图形的焊料组成 的金属糊料注入金属糊料的区域。

    Sintered Ceramics for Mounting Light-Emitting Element
    4.
    发明申请
    Sintered Ceramics for Mounting Light-Emitting Element 审中-公开
    用于安装发光元件的烧结陶瓷

    公开(公告)号：US20080269040A1

    公开(公告)日：2008-10-30

    申请号：US12067989

    申请日：2006-09-26

    申请人： Ken Sugawara ,  Yuichiro Minabe ,  Takehiko Yoneda ,  Masao Ariyuki

    发明人： Ken Sugawara ,  Yuichiro Minabe ,  Takehiko Yoneda ,  Masao Ariyuki

    IPC分类号： C04B35/00 ,  B32B3/00

    CPC分类号： C04B35/111 ,  C04B35/581 ,  C04B41/009 ,  C04B41/5031 ,  C04B41/87 ,  C04B2111/80 ,  H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  Y10T428/24479 ,  C04B41/0072 ,  C04B41/4556 ,  H01L2924/00

    摘要： A sintered ceramics for mounting a light-emitting element, which is capable of realizing high optical reflectance over the entire region from ultraviolet radiation to visible light. The sintered ceramics has a light-reflective face of which reflectance to light in each wavelength in the range of 250 nm˜750 nm is 70% or more. The light-reflective face satisfies following reaction: |RA−RB|≦20 when reflectance to light of 750 nm is defined as RA%, and reflectance to light of 300 nm is defined as RB. The sintered ceramics has not layer to be peeled from the light-reflective face when a Tape Peeling Test is carried out to the light-reflective face in accordance with the method described in JIS H8504 (1990).

    摘要翻译： 一种用于安装发光元件的烧结陶瓷，其能够在从紫外线到可见光的整个区域上实现高的光反射率。 烧结陶瓷具有在250nm〜750nm的范围内的各波长的光的反射率为70％以上的光反射面。 光反射面满足以下反应：<？in-line-formula description =“In-line formula”end =“lead”？> | R B 将300nm的光定义为R B B。 当根据JIS H8504（1990）中描述的方法对光反射面进行剥皮试验时，烧结陶瓷没有从光反射面剥离的层。