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    LIGHT EMITTING DEVICE
    3.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20160079486A1

    公开(公告)日：2016-03-17

    申请号：US14785027

    申请日：2014-03-26

    Applicant: NICHIA CORPORATION ,  KOITO MANUFACTURING CO., LTD.

    Inventor： Kunihito SUGIMOTO ,  Keisuke SEJIKI ,  Tsukasa TOKIDA ,  Shinpei MAEDA

    IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

    CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light emitting device includes a light emitting element whose upper surface is a light extraction surface, and a light-transmissive member that has an upper surface and a lower surface, and covers the light extraction surface of the light emitting element. The light-transmissive member contains a phosphor. The upper surface and the lower surface of the light-transmissive member are both flat surfaces and parallel to each other. A side surface of the light-transmissive member has a protruding portion that protrudes to the side and has contact with the lower surface.

    Abstract translation: 发光器件包括上表面是光提取表面的发光元件和具有上表面和下表面的透光元件，并且覆盖发光元件的光提取表面。 透光部件含有荧光体。 透光性构件的上表面和下表面均为平坦表面并且彼此平行。 透光部件的侧面具有向侧面突出并与下表面接触的突出部。

    LIGHT-EMITTING DEVICE
    4.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20170054064A1

    公开(公告)日：2017-02-23

    申请号：US15239914

    申请日：2016-08-18

    Applicant: NICHIA CORPORATION

    Inventor： Satoshi SHICHIJO ,  Kunihito SUGIMOTO ,  Kenji OZEKI

    IPC: H01L33/60 ,  H01L33/50

    CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L33/502 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58

    Abstract: A light-emitting device includes a light-emitting element; a first light transmissive member that is disposed over the light-emitting element and that includes a first upper surface, a lower surface, a first lateral surface; and a second lateral surface positioned outside the first lateral surface, a second light transmissive member that covers at least a part of the first lateral surface; and a light reflective member that is disposed on a lateral surface of the second light transmissive member, the second lateral surface of the first light transmissive member, and a lateral surface of the light-emitting element.

    Abstract translation: 发光装置包括发光元件; 第一透光构件，其设置在所述发光元件上方，并且包括第一上表面，下表面，第一侧表面; 以及位于所述第一侧表面外侧的第二侧表面，覆盖所述第一侧表面的至少一部分的第二透光构件; 以及设置在第二透光构件的侧面，第一透光构件的第二侧面和发光元件的侧面的光反射构件。

    LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
    5.
    发明申请
    LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20190097086A1

    公开(公告)日：2019-03-28

    申请号：US16123274

    申请日：2018-09-06

    Applicant: NICHIA CORPORATION

    Inventor： Satoshi SHICHIJO ,  Hiroki FUKUTA ,  Kunihito SUGIMOTO

    IPC: H01L33/38 ,  H01L33/62 ,  H01L33/10 ,  H01L23/532

    Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, and first and second external connection parts. The first semiconductor layer is exposed from the light emitting layer and the second semiconductor layer at exposed portions arranged in columns each extending in a first direction. The insulating film defines openings respectively located above the exposed portions. The first electrode is connected to the first semiconductor layer through the openings and covers a part of the second semiconductor layer via the insulating film. The first external connection part is connected to the first electrode and spaced apart from the exposed portions in the plan view. The first external connection part has a shape elongated in the first direction between adjacent ones of the columns of the exposed portions. The second external connection part is connected to the second semiconductor layer via the second electrode.

    LIGHT EMITTING DEVICE
    7.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20170358724A1

    公开(公告)日：2017-12-14

    申请号：US15620730

    申请日：2017-06-12

    Applicant: NICHIA CORPORATION

    Inventor： Satoshi SHICHIJO ,  Kunihito SUGIMOTO

    IPC: H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H01L33/48 ,  H01L27/15

    CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/486 ,  H01L33/502 ,  H01L33/507 ,  H01L33/60

    Abstract: A light emitting device includes a mounting board including: a base part, and one or more wiring structures, each of which includes one or more first wiring parts, and one or more second wiring parts, in that order, from a base part side, wherein, in a plan view, an area of each of the one or more second wiring parts is smaller than an area of each of the one or more first wiring parts; one or more light emitting elements bonded to the second wiring parts via bonding members; and a reflective member covering at least a portion of the bonding members and at least a portion of the one or more wiring structures. A reflectance of the one or more first wiring parts is higher than a reflectance of the bonding members. The one or more second wiring parts and the bonding members comprise the same material at their outermost surfaces.

    MOLDED PACKAGE FOR LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE USING THE SAME
    8.
    发明申请
    MOLDED PACKAGE FOR LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE USING THE SAME 有权
    用于发光装置的模制包装和使用该发光装置的发光装置

    公开(公告)号：US20140008692A1

    公开(公告)日：2014-01-09

    申请号：US13932096

    申请日：2013-07-01

    Applicant: NICHIA CORPORATION

    Inventor： Kunihito SUGIMOTO ,  Keisuke SEJIKI

    IPC: H01L33/54 ,  H01L21/56

    CPC classification number: H01L33/54 ,  H01L21/565 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/502 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/19107

    Abstract: A molded package, comprising: a molded resin having a recess for accommodating a light emitting element; a ceramic substrate disposed in a bottom of the recess, the ceramic substrate having one surface exposed from the bottom of the recess and the other surface exposed from a rear surface of the molded resin; and a lead disposed at a lower part of the molded resin, the light emitting element being mounted on the one surface of the ceramic substrate, the lead being in contact with at least one side surface of the ceramic substrate to hold the ceramic substrate.

    Abstract translation: 一种模制包装，包括：模制树脂，具有用于容纳发光元件的凹部; 设置在所述凹部的底部的陶瓷基板，所述陶瓷基板具有从所述凹部的底部露出的一个表面，从所述模制树脂的后表面露出的另一个表面; 以及设置在所述模制树脂的下部的引线，所述发光元件安装在所述陶瓷基板的一个表面上，所述引线与所述陶瓷基板的至少一个侧表面接触以保持所述陶瓷基板。

    LIGHT-EMITTING DEVICE
    9.
    发明申请
    LIGHT-EMITTING DEVICE 审中-公开

    公开(公告)号：US20200020824A1

    公开(公告)日：2020-01-16

    申请号：US16579422

    申请日：2019-09-23

    Applicant: NICHIA CORPORATION

    Inventor： Takeshi KUSUSE ,  Satoshi SHICHIJO ,  Kunihito SUGIMOTO

    IPC: H01L33/00 ,  H01L21/56 ,  H01L33/62 ,  H01L25/075 ,  H01L33/32

    Abstract: A light-emitting device includes: a mounting base; a plurality of light-emitting elements mounted on or above the mounting base; a plurality of light-transmissive members respectively disposed on upper surfaces of the plurality of light-emitting elements; a plurality of light guide members respectively covering lateral surfaces of the plurality of light-emitting elements; a plurality of antireflective films respectively disposed on upper surfaces of the plurality of the light-transmissive members; and a covering member covering lateral surfaces of the plurality of antireflective films.

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