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    Fabrication process for preparing recording head sliders made from silicon substrates with SiO2 overcoats
    3.
    发明申请
    Fabrication process for preparing recording head sliders made from silicon substrates with SiO2 overcoats 有权
    制备由SiO 2外涂层由硅衬底制成的记录头滑块的制造工艺

    公开(公告)号：US20050070118A1

    公开(公告)日：2005-03-31

    申请号：US10675203

    申请日：2003-09-29

    申请人： Nicholas Buchan ,  Timothy Reiley

    发明人： Nicholas Buchan ,  Timothy Reiley

    IPC分类号： G11B5/10 ,  H01L21/302 ,  H01L21/461

    CPC分类号： G11B5/3173 ,  G11B5/102

    摘要： A method for fabricating recording head sliders made from silicon substrates, is described. A Silicon wafer with a SiO2 overcoat is provided, and a layer of material which is resistant to Deep Reactive Ion Etching (DRIE) is deposited on the SiO2 overcoat. A patterned layer of material which is resistant to Reactive Ion Etching (RIE) is deposited on the layer of DRIE-resistant material to form a primary mask. RIE is used through the primary mask to pattern the SiO2 overcoat layer and the layer of DRIE-resistant material. The primary mask is then removing to expose the layer of DRIE-resistant material which has now been patterned to form a secondary mask. DRIE is then used through the secondary mask to cut the Si wafer into pieces. Finally, the secondary mask is removed.

    摘要翻译： 描述了由硅衬底制造记录头滑块的方法。 提供具有SiO 2外涂层的硅晶片，并且将耐受深反应离子蚀刻（DRIE）的材料层沉积在SiO 2外涂层上。 耐反应离子蚀刻（RIE）的图案化材料层沉积在抗DRIE材料层上以形成初级掩模。 通过初级掩模使用RIE来图案化SiO2覆盖层和DRIE抗性材料层。 然后去除主要掩模以暴露现在被图案化以形成二次掩模的耐DRIE材料层。 然后通过二次掩模使用DRIE将Si晶片切成片。 最后，二次掩模被去除。

    Method and apparatus for manufacturing silicon sliders with reduced susceptibility to fractures
    5.
    发明申请
    Method and apparatus for manufacturing silicon sliders with reduced susceptibility to fractures 审中-公开
    用于制造具有降低的断裂敏感性的硅滑块的方法和装置

    公开(公告)号：US20060044690A1

    公开(公告)日：2006-03-02

    申请号：US10930162

    申请日：2004-08-31

    申请人： Nicholas Buchan ,  Timothy Reiley

    发明人： Nicholas Buchan ,  Timothy Reiley

    IPC分类号： G11B5/60

    CPC分类号： G11B5/102 ,  G11B5/3173

    摘要： A method and apparatus for manufacturing silicon sliders with reduced susceptibility to fracture of the substrate from which they are manufactured is disclosed. A monocrystalline silicon wafer is formed having an orientation in the {100} crystallographic plane. The silicon wafer includes a notch for orienting the silicon wafer, wherein the notch is formed substantially in the direction. Sliders are formed from the silicon wafer.

    摘要翻译： 公开了一种用于制造硅基滑块的方法和装置，其具有降低的它们被制造的基板的断裂敏感性。 形成在{100}晶面中具有取向的单晶硅晶片。 硅晶片包括用于定向硅晶片的凹口，其中凹口基本上沿<100>方向形成。 滑块由硅晶片形成。

    Micromechanical component and method for producing the micromechanical component
    7.
    发明授权
    Micromechanical component and method for producing the micromechanical component 有权
    微机械部件的制造方法和微机电部件的制造方法

    公开(公告)号：US06318177B2

    公开(公告)日：2001-11-20

    申请号：US09302225

    申请日：1999-04-29

    申请人： Nicholas Buchan ,  Michael Fehrenbach ,  Dietrich Schubert

    发明人： Nicholas Buchan ,  Michael Fehrenbach ,  Dietrich Schubert

    IPC分类号： G01P15125

    CPC分类号： G01P15/125 ,  B81B2201/0235 ,  B81C1/00626 ,  B81C99/006 ,  G01P15/0802 ,  G01P2015/0814

    摘要： A method for producing a micromechanical component (e.g., a capacitive acceleration sensor) having one or several electrical or mechanical function variables dependent on at least one geometric design parameter. The micromechanical component is produced by an etching process via which a structure with bars and trenches is formed. The structure is formed by drafting a design for the micromechanical component in such a way that the geometric design parameter within the local area of the micromechanical component is subject to a predetermined process-related regularity. The design parameter is essentially constant in relation to function blocks in particular, so that in the etching process, the process tolerance of the design parameter within the micromechanical component essentially shows no locus dependency.

    摘要翻译： 具有取决于至少一个几何设计参数的具有一个或几个电或机械功能变量的微机械部件（例如，电容加速度传感器）的方法。 微机械部件通过蚀刻工艺产生，通过该工艺形成具有棒和沟槽的结构。 通过以微机电部件的局部区域内的几何设计参数受到预定的与工艺有关的规则性的方式来绘制微机械部件的设计而形成该结构。 设计参数特别是相对于功能块而言基本上是恒定的，因此在蚀刻工艺中，微机械组件内的设计参数的工艺公差基本上不显示轨迹依赖性。

    Photoresist transfer pads
    9.
    发明申请
    Photoresist transfer pads 失效
    光阻传输垫

    公开(公告)号：US20050219754A1

    公开(公告)日：2005-10-06

    申请号：US10814933

    申请日：2004-03-30

    申请人： Nicholas Buchan ,  Cherngye Hwang ,  Timothy Reiley ,  Li Zheng

    发明人： Nicholas Buchan ,  Cherngye Hwang ,  Timothy Reiley ,  Li Zheng

    IPC分类号： G11B5/127 ,  G11B5/31 ,  G11B5/33 ,  G11B5/60 ,  G11B15/64 ,  G11B17/32 ,  G11B21/20

    CPC分类号： G11B5/3163 ,  G11B5/313

    摘要： A resist transfer pad and method of use are described for forming a uniform photoresist on the surface of a workpiece such as a slider. The resist transfer pad includes a layer of cured polydimethylsiloxane (PDMS) on a cushioning layer, e.g. silicone rubber, and an optional stiffening layer. The sliders are preferably mounted on a carrier or pallet. In one preferred embodiment the loaded resist transfer pads are applied to the slider surface by roll lamination where the loaded resist transfer pad is transported by a roller system using a cover-tape and pressed against the slider surface. Subsequently the cover-tape and the resist transfer pad are lifted off and the photoresist remains on the transducer. An alternative embodiment uses a vacuum, piston laminator to press the loaded resist transfer pad onto the surface of the transducer.

    摘要翻译： 描述了用于在诸如滑块的工件的表面上形成均匀光致抗蚀剂的抗蚀剂转移垫和使用方法。 抗蚀剂传递垫包括缓冲层上固化的聚二甲基硅氧烷（PDMS）层， 硅橡胶和可选的加强层。 滑块优选地安装在托架或托盘上。 在一个优选实施例中，负载的抗蚀剂转移垫通过辊压层施加到滑块表面，其中负载的阻挡层传送垫通过辊系统使用覆盖带传送并压靠在滑块表面上。 随后，覆盖带和抗蚀剂传递垫被提起并且光致抗蚀剂保留在换能器上。 替代实施例使用真空活塞层压机将负载的抗蚀剂转移垫压到换能器的表面上。