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159 条记录 (耗时 0.026 秒)

    Wireless IC device
    1.
    发明授权
    Wireless IC device 有权
    无线IC设备

    公开(公告)号：US07967216B2

    公开(公告)日：2011-06-28

    申请号：US12902174

    申请日：2010-10-12

    申请人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino ,  Katsumi Taniguchi

    发明人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino ,  Katsumi Taniguchi

    IPC分类号： G06K19/06

    CPC分类号： H01Q1/2225 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01Q1/38 ,  H01Q7/00 ,  H04B5/0081 ,  Y10T29/49124

    摘要： A wireless IC device prevents deviations of the resonant frequency from the desired value. An antenna coil has an end portion positioned in a connector provided on the negative-most side in the z-axis direction and an end portion positioned in a connector provided on the positive-most side in the z-axis direction. A wireless IC is electrically connected to the end portions. A via hole conductor is provided between the end portion and the wireless IC and penetrates through a plurality of insulator layers. A via hole conductor is provided in the antenna coil such that the length of a current path thereto from the end portion is the shortest among a plurality of via hole conductors. The distance between the via hole conductor and the via hole conductor is larger than the distances between the penetrating via hole conductor and the via hole conductors.

    摘要翻译： 无线IC器件防止谐振频率偏离期望值。 天线线圈具有位于设置在z轴方向最负侧的连接器中的端部和位于设置在z轴方向最正侧的连接器中的端部。 无线IC电连接到端部。 通孔导体设置在端部与无线IC之间并穿透多个绝缘体层。 在天线线圈中设置有通孔导体，使得从端部到其的电流路径的长度在多个通孔导体中是最短的。 通孔导体和通孔导体之间的距离大于穿透通孔导体和通孔导体之间的距离。

    Antenna module
    2.
    发明授权
    Antenna module 有权

    公开(公告)号：US09705194B2

    公开(公告)日：2017-07-11

    申请号：US13368358

    申请日：2012-02-08

    申请人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino ,  Katsumi Taniguchi

    发明人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino ,  Katsumi Taniguchi

    IPC分类号： H01Q9/04

    CPC分类号： H01Q9/0407

    摘要： In an antenna module, a main portion includes a plurality of insulating sheets made of a flexible material and laminated on each other. An antenna configured to transmit/receive a high-frequency signal is disposed in the main portion. A connection portion is disposed in the main portion and is connected to an electronic device that inputs/outputs the high-frequency signal. A signal transmission line is disposed in the main portion and has a strip line structure or a microstrip line structure to transmit the high-frequency signal. An impedance matching circuit is disposed in the main portion and between the antenna and end of a signal transmission line facing in a negative x direction. An impedance matching circuit is disposed in the main portion and between the connection portion and an end of the signal transmission line facing in a positive x direction.

    Signal line and circuit substrate
    4.
    发明授权
    Signal line and circuit substrate 有权

    公开(公告)号：US08592687B2

    公开(公告)日：2013-11-26

    申请号：US13343740

    申请日：2012-01-05

    申请人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino

    发明人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0298 ,  H01P3/081 ,  H01P3/088 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/028 ,  H05K2201/0715 ,  H05K2201/09618

    摘要： A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction.

    Multilayer substrate
    5.
    发明授权
    Multilayer substrate 有权
    多层基板

    公开(公告)号：US08692125B2

    公开(公告)日：2014-04-08

    申请号：US13369363

    申请日：2012-02-09

    申请人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino

    发明人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino

    IPC分类号： H05K1/00

    CPC分类号： H05K1/0281 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/09 ,  H05K2201/0141 ,  H05K2201/057 ,  H05K2201/0715 ,  H05K2201/09018 ,  H05K2201/09409

    摘要： A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.

    摘要翻译： 保持弯曲状态而不引起电特性波动的多层基板包括：主体，其包括要堆叠并由柔性材料制成的多个绝缘片。 信号线在主体中延伸。 接地导体相对于主体中的信号线在z轴方向的正方向侧设置，并且在从z轴方向看的俯视图中与信号线重叠。 接地导体相对于主体中的信号线在z轴方向的负方向侧设置，并且在从z轴方向观察的俯视图中与信号线重叠。 主体弯曲的状态使得信号线定义为电弧，由接地导体的塑性变形保持。

    ANTENNA DEVICE AND RADIO FREQUENCY IC DEVICE
    6.
    发明申请
    ANTENNA DEVICE AND RADIO FREQUENCY IC DEVICE 有权
    天线设备和无线电频率IC器件

    公开(公告)号：US20090166434A1

    公开(公告)日：2009-07-02

    申请号：US12326117

    申请日：2008-12-02

    申请人： Katsumi Taniguchi ,  Jun Sasaki ,  Noboru Kato

    发明人： Katsumi Taniguchi ,  Jun Sasaki ,  Noboru Kato

    IPC分类号： G06K19/06

    CPC分类号： G06K19/0723 ,  G06K19/0726 ,  H01Q1/2208 ,  H01Q1/52 ,  H01Q7/00

    摘要： An antenna device is arranged to transmit or receive a radio frequency communication signal to or from an external device such as a reader/writer, and is arranged such that an antenna resonance circuit including an antenna coil and a capacitor is connected to an additional resonance circuit including an inductor and a capacitor. A radio frequency IC device preferably includes the antenna device and a radio frequency IC. The antenna device is constructed such that a change in characteristics thereof caused by a change in the distance between a radio frequency IC device and a reader/writer is minimized, and the radio frequency IC device performs communication with high reliability.

    摘要翻译： 天线装置被布置为向诸如读取器/写入器的外部设备发送或接收射频通信信号，并且被布置为使得包括天线线圈和电容器的天线谐振电路连接到附加谐振电路 包括电感和电容。 射频IC装置优选地包括天线装置和射频IC。 天线装置被构造为使得由射频IC器件和读取器/写入器之间的距离的变化引起的特性变化最小化，并且射频IC器件以高可靠性进行通信。

    Antenna device and radio frequency IC device
    7.
    发明授权
    Antenna device and radio frequency IC device 有权
    天线装置和射频IC装置

    公开(公告)号：US08915448B2

    公开(公告)日：2014-12-23

    申请号：US13232102

    申请日：2011-09-14

    申请人： Katsumi Taniguchi ,  Jun Sasaki ,  Noboru Kato

    发明人： Katsumi Taniguchi ,  Jun Sasaki ,  Noboru Kato

    IPC分类号： G06K19/06 ,  G06K19/07 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q7/00

    CPC分类号： G06K19/0723 ,  G06K19/0726 ,  H01Q1/2208 ,  H01Q1/52 ,  H01Q7/00

    摘要： An antenna device is arranged to transmit or receive a radio frequency communication signal to or from an external device such as a reader/writer, and is arranged such that an antenna resonance circuit including an antenna coil and a capacitor is connected to an additional resonance circuit including an inductor and a capacitor. A radio frequency IC device preferably includes the antenna device and a radio frequency IC. The antenna device is constructed such that a change in characteristics thereof caused by a change in the distance between a radio frequency IC device and a reader/writer is minimized, and the radio frequency IC device performs communication with high reliability.

    摘要翻译： 天线装置被布置为向诸如读取器/写入器的外部设备发送或接收射频通信信号，并且被布置为使得包括天线线圈和电容器的天线谐振电路连接到附加谐振电路 包括电感和电容。 射频IC装置优选地包括天线装置和射频IC。 天线装置被构造为使得由射频IC器件和读取器/写入器之间的距离的变化引起的特性变化最小化，并且射频IC器件以高可靠性进行通信。

    Composite module
    8.
    发明授权
    Composite module 有权
    复合模块

    公开(公告)号：US08461463B2

    公开(公告)日：2013-06-11

    申请号：US13080783

    申请日：2011-04-06

    申请人： Noboru Kato ,  Jun Sasaki ,  Katsumi Taniguchi

    发明人： Noboru Kato ,  Jun Sasaki ,  Katsumi Taniguchi

    IPC分类号： H05K1/16

    CPC分类号： H05K1/186 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/19106 ,  H05K1/141 ,  H05K1/165 ,  H05K3/284 ,  H05K2201/09481 ,  H05K2201/10045 ,  H05K2203/1316

    摘要： A composite module is obtained which enables high-density mounting of components without increasing its size. A composite module includes a main substrate which is a multilayer circuit board, a sub-substrate mounted on a lower surface of the main substrate, a sealing layer arranged on the lower surface of the main substrate to cover the sub-substrate, the sealing layer defining a mount surface arranged to be mounted on a mount board, and terminal electrodes disposed on the mount surface. The terminal electrodes include at least one first terminal electrode drawn directly from the main substrate and at least one second terminal electrode drawn directly from the sub-substrate.

    摘要翻译： 获得了组合模块，其可以在不增加其尺寸的情况下实现组件的高密度安装。 复合模块包括作为多层电路板的主衬底，安装在主衬底的下表面上的子衬底，设置在主衬底的下表面以覆盖副衬底的密封层，密封层 限定安装在安装板上的安装表面和设置在安装表面上的端子电极。 端子电极包括从主衬底直接绘制的至少一个第一端子电极和直接从该辅助衬底引出的至少一个第二端子电极。