公开(公告)号：US07196512B2

公开(公告)日：2007-03-27

申请号：US10722823

申请日：2003-11-26

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Hiroshi Kobayashi ,  Katsutoshi Hirasawa ,  Takatoyo Yamakami ,  Masumi Katayama ,  Shinji Hiraoka

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Hiroshi Kobayashi ,  Katsutoshi Hirasawa ,  Takatoyo Yamakami ,  Masumi Katayama ,  Shinji Hiraoka

IPC分类号： G01R33/12

CPC分类号： G11B5/4555 ,  G11B5/455 ,  G11B5/4806 ,  G11B5/60 ,  G11B2005/001

摘要： The magnetic head tester of the present invention drives a medium for rotation to float a slider from the medium so as to test a magnetic head for its characteristics, and the tester includes a holder removably holding the slider opposed to the surface of the medium, and suspension means provided in the holder which has the same function as a suspension supporting the slider in a real apparatus. With this tester, tests can be executed by exchanging the slider alone, and it is unnecessary to discard the suspension even when the magnetic head is judged to be defective, thus the loss of production costs for the suspension and processing costs for assembling the slider in the suspension can be avoided.

摘要翻译： 本发明的磁头测试器驱动用于旋转的介质以从介质浮动滑动器，以便测试磁头的特性，并且测试仪包括可移除地保持与介质表面相对的滑块的保持架，以及 悬挂装置设置在保持器中，其具有与在实际装置中支撑滑块的悬架相同的功能。 使用该测试器，可以通过单独更换滑块来执行测试，即使当磁头被判断为有缺陷时也不必丢弃悬架，因此悬架的生产成本的损失和用于组装滑块的处理成本 可以避免悬浮液。

公开(公告)号：US07394163B2

公开(公告)日：2008-07-01

申请号：US10187843

申请日：2002-07-03

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/563 ,  H01L21/67092 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83951 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/05599

摘要： A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.

摘要翻译： 通过用作底层填充剂的粘合剂填充芯片和基板之间的间隙来安装半导体芯片的方法，其中安装IC芯片。 底部填充物的圆角被制成具有优选的形状。 为了实现这一点，将具有凸块的头IC芯片放置在被底部填充胶粘剂覆盖的悬挂上，并设置有垫。 接合工具按压头IC芯片并对头IC芯片施加超声波振荡，使得凸块适当地粘合到焊盘。 当头部IC芯片被按压并进行超声波振荡时，发射紫外线108以使在头IC芯片11和悬架12之间展开的粘合剂151的周边部分151a硬化。

公开(公告)号：US07347347B2

公开(公告)日：2008-03-25

申请号：US10972440

申请日：2004-10-26

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US20050196529A1

公开(公告)日：2005-09-08

申请号：US11117307

申请日：2005-04-29

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G03F7/16 ,  B05C5/02 ,  B05C11/10 ,  B05D3/00 ,  B05D7/00 ,  H01L21/56 ,  H01L21/60 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  B05D5/12

CPC分类号： B05C11/1034 ,  B05C5/0212 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/0091 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/163 ,  H01L2924/00 ,  H01L2224/05599

摘要： A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

公开(公告)号：US20050057856A1

公开(公告)日：2005-03-17

申请号：US10972440

申请日：2004-10-26

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： G11B5/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L29/06 ,  G11B21/20

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US20050196703A1

公开(公告)日：2005-09-08

申请号：US11117308

申请日：2005-04-29

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G03F7/16 ,  B05C5/02 ,  B05C11/10 ,  B05D3/00 ,  B05D7/00 ,  H01L21/56 ,  H01L21/60 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  G03C1/725

CPC分类号： B05C11/1034 ,  B05C5/0212 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/0091 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/163 ,  H01L2924/00 ,  H01L2224/05599

摘要： A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

摘要翻译： 将树脂涂布到布线板的预定区域的树脂涂布方法包括以下步骤：对从树脂施加装置挤出的树脂的外观进行成像; 并且基于在成像步骤中获得的树脂的外观自动调节从树脂施加装置挤出的树脂的量。

公开(公告)号：US06885522B1

公开(公告)日：2005-04-26

申请号：US09548313

申请日：2000-04-12

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： G11B5/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L29/06

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US06716665B2

公开(公告)日：2004-04-06

申请号：US09753570

申请日：2001-01-04

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： H01L2144

CPC分类号： H01L21/6836 ,  H01L21/56 ,  H01L21/563 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L24/94 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512

摘要： A wafer receiving conductive input/output bumps on the upward front side is placed on a platen. An underfill material sheet, adhered to the surface of the thin film tape, is superposed on the front side of the wafer. The underfill material sheet is forced to soften. When the underfill material sheet is urged against the wafer, the input/output bumps is allowed to penetrate through the underfill material sheet. After the underfill material is hardened, the thin film tape is peeled off from the hardened underfill material sheet. The underfill material can thus be supplied commonly to a large number of individual semiconductor chips included in the wafer. As compared with the case where the underfill material is supplied separately to the individual semiconductor chips, the working time can greatly be shortened.

摘要翻译： 将在前侧的导电输入/输出凸块接收的晶片放置在压板上。 附着在薄膜带表面上的底部填充材料片重叠在晶片的前侧。 底部填充材料片被强制软化。 当将底部填充材料片压向晶片时，允许输入/输出凸块穿过底部填充材料片。 在底部填充材料硬化之后，薄膜带从硬化的底部填充材料片剥离。 因此，底部填充材料可以共同地供应到包括在晶片中的大量单独的半导体芯片。 与将底部填充材料单独供给到各个半导体芯片的情况相比，可以大大缩短工作时间。

公开(公告)号：US06770319B2

公开(公告)日：2004-08-03

申请号：US09811605

申请日：2001-03-20

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： B05D512

CPC分类号： B05C11/1034 ,  B05C5/0212 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/0091 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/163 ,  H01L2924/00 ,  H01L2224/05599

摘要： A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

摘要翻译： 将树脂涂布到布线板的预定区域的树脂涂布方法包括以下步骤：对从树脂施加装置挤出的树脂的外观进行成像; 并且基于在成像步骤中获得的树脂的外观自动调节从树脂施加装置挤出的树脂的量。

公开(公告)号：US06437450B1

公开(公告)日：2002-08-20

申请号：US09614726

申请日：2000-07-12

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： H01R2348

CPC分类号： H01L21/563 ,  H01L21/67092 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83951 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/05599

摘要： A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.