公开(公告)号：US06692792B2

公开(公告)日：2004-02-17

申请号：US10425623

申请日：2003-04-30

申请人： Nozomu Takano ,  Shigeo Sase ,  Tomio Fukuda ,  Michitoshi Arata

发明人： Nozomu Takano ,  Shigeo Sase ,  Tomio Fukuda ,  Michitoshi Arata

IPC分类号： B05D136

CPC分类号： B32B27/04 ,  C03C25/40 ,  C08J5/06 ,  C08J5/08 ,  C08J5/24 ,  H05K1/0353 ,  Y02P20/582 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2962 ,  Y10T428/2995 ,  Y10T428/31612 ,  Y10T428/31663

摘要： Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.

摘要翻译： 通过用具有特定结构的硅酮低聚物，特别是三维交联的有机硅低聚物或使用通过混合制备的树脂清漆来处理基材或无机填料的表面，可以生产印刷布线板， 具有用于浸渍基材的树脂清漆的硅氧烷低聚物，或通过将无机填料浸渍在这种用于表面处理的硅氧烷低聚物的溶液中，然后将树脂材料与溶液直接混合。

公开(公告)号：US06329474B1

公开(公告)日：2001-12-11

申请号：US09541515

申请日：2000-04-03

申请人： Michitoshi Arata ,  Shigeo Sase ,  Nozomu Takano ,  Tomio Fukuda

发明人： Michitoshi Arata ,  Shigeo Sase ,  Nozomu Takano ,  Tomio Fukuda

IPC分类号： E32B2704

CPC分类号： H05K1/0373 ,  C08G59/3218 ,  C08G59/5073 ,  C08L61/06 ,  C08L61/12 ,  C08L63/00 ,  C08L63/04 ,  H01B3/40 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0326 ,  H05K2201/012 ,  Y10T428/2915 ,  C08L2666/22 ,  C08L61/04 ,  H01L2924/00

摘要： An epoxy resin composition for printed wiring boards which comprises as the essential components (a) an epoxy resin obtained by epoxidizing a condensation product of a phenol with hydroxybenzaldehyde, (b) a condensation product of bisphenol A with formaldehyde, (c) a flame retardant, and (d) a curing accelerator, and a laminate for printed wiring boards which has a low hygroscopicity, a high heat resistance, good high-temperature characteristics, a high resistance against electrolytic corrosion, a high resistance against color change due to heating, and a high Tg.

摘要翻译： 一种用于印刷线路板的环氧树脂组合物，其包含作为主要组分（a）通过苯酚与羟基苯甲醛的缩合产物环氧化获得的环氧树脂，（b）双酚A与甲醛的缩合产物，（c）阻燃剂 ，和（d）固化促进剂和印刷线路板的层压体，其具有低吸湿性，高耐热性，高温特性，高耐电腐蚀性，耐高温耐色变色性， 和高Tg。

公开(公告)号：US06696155B1

公开(公告)日：2004-02-24

申请号：US08981570

申请日：1997-12-23

申请人： Nozomu Takano ,  Shigeo Sase ,  Tomio Fukuda ,  Michitoshi Arata

发明人： Nozomu Takano ,  Shigeo Sase ,  Tomio Fukuda ,  Michitoshi Arata

IPC分类号： B32B900

CPC分类号： B32B27/04 ,  C03C25/40 ,  C08J5/06 ,  C08J5/08 ,  C08J5/24 ,  H05K1/0353 ,  Y02P20/582 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2962 ,  Y10T428/2995 ,  Y10T428/31612 ,  Y10T428/31663

摘要： Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.

摘要翻译： 通过用具有特定结构的硅酮低聚物，特别是三维交联的有机硅低聚物或使用通过混合制备的树脂清漆来处理基材或无机填料的表面，可以生产印刷布线板， 具有用于浸渍基材的树脂清漆的硅氧烷低聚物，或通过将无机填料浸渍在这种用于表面处理的硅氧烷低聚物的溶液中，然后将树脂材料与溶液直接混合。

公开(公告)号：US06572968B2

公开(公告)日：2003-06-03

申请号：US09849219

申请日：2001-05-07

申请人： Nozomu Takano ,  Shigeo Sase ,  Tomio Fukuda ,  Michitoshi Arata

发明人： Nozomu Takano ,  Shigeo Sase ,  Tomio Fukuda ,  Michitoshi Arata

IPC分类号： B32B900

CPC分类号： B32B27/04 ,  C03C25/40 ,  C08J5/06 ,  C08J5/08 ,  C08J5/24 ,  H05K1/0353 ,  Y02P20/582 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2962 ,  Y10T428/2995 ,  Y10T428/31612 ,  Y10T428/31663

摘要： Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.

摘要翻译： 通过用具有特定结构的硅酮低聚物，特别是三维交联的有机硅低聚物或使用通过混合制备的树脂清漆来处理基材或无机填料的表面，可以生产印刷布线板， 具有用于浸渍基材的树脂清漆的硅氧烷低聚物，或通过将无机填料浸渍在这种用于表面处理的硅氧烷低聚物的溶液中，然后将树脂材料与溶液直接混合。

公开(公告)号：US06180250B2

公开(公告)日：2001-01-30

申请号：US08994967

申请日：1997-12-19

申请人： Michitoshi Arata ,  Shigeo Sase ,  Nozomu Takano ,  Tomio Fukuda

发明人： Michitoshi Arata ,  Shigeo Sase ,  Nozomu Takano ,  Tomio Fukuda

IPC分类号： B32B1504

CPC分类号： H05K1/0373 ,  B32B15/08 ,  C08G59/08 ,  C08G59/3218 ,  C08K5/0008 ,  C08L63/04 ,  H01L23/145 ,  H01L2924/0002 ,  H05K2201/012 ,  H05K2203/122 ,  Y10T428/31678 ,  C08L61/04 ,  H01L2924/00

摘要： To provide an epoxy resin composition for printed circuit boards which demonstrates little tendency to absorb moisture, high heat-resistance, favorable high temperature properties, resistance to metal migration, favorable anti-fade property at high temperatures, high Tg, high electric insulating performance and resistance against peeling of the copper foil when formed into a printed circuit board, there is provided epoxy resin composition for printed circuit boards, comprising: (a) epoxy resin obtained by glycidyl etherifying a condensation product of a phenol and hydroxybenzaldehyde; (b) a condensation product of bisphenol A and formaldehyde; (c) a flame retardant; (d) a curing agent; (e) one or both of a phenol antioxidant and an organic sulfur compound antioxidant; and (f) a urea derivative. This composition is highly suitable as a material for manufacturing epoxy resin prepreg in general and printed circuit boards.

摘要翻译： 本发明提供一种印刷电路板用环氧树脂组合物，其耐湿性，耐热性，耐高温性，耐金属迁移性，耐高温下的抗褪色性，高Tg，高绝缘性， 提供了形成印刷电路板时的铜箔的剥离性，提供了用于印刷电路板的环氧树脂组合物，其包含：（a）通过缩水甘油醚醚化苯酚和羟基苯甲醛的缩合产物得到的环氧树脂; （b）双酚A和甲醛的缩合产物; （c）阻燃剂; （d）固化剂; （e）苯酚抗氧化剂和有机硫化合物抗氧化剂中的一种或两种; 和（f）尿素衍生物。 该组合物作为一般制造环氧树脂预浸料和印刷电路板的材料是非常适合的。

公开(公告)号：US06462147B1

公开(公告)日：2002-10-08

申请号：US09274100

申请日：1999-03-23

申请人： Michitoshi Arata ,  Nozomu Takano ,  Tomio Fukuda ,  Kenichi Tomioka

发明人： Michitoshi Arata ,  Nozomu Takano ,  Tomio Fukuda ,  Kenichi Tomioka

IPC分类号： C08F28300

CPC分类号： H05K1/0326 ,  C08G59/4028 ,  C08G59/5086 ,  C08G59/621 ,  C08L63/00 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31522 ,  C08L2666/16 ,  C08L2666/20

摘要： An epoxy resin composition for a printed circuit board includes an epoxy resin; a multi-functional phenol group; a hardening accelerator; and at least one of a compound having a triazine or isocyanurate ring, and a compound containing less than 60 weight percent nitrogen, but not containing a urea derivative. A printed circuit board comprising the epoxy resin composition has low water absorption, excellent heat endurance, and a good adhesion with copper foil.

摘要翻译： 用于印刷电路板的环氧树脂组合物包括环氧树脂; 多功能酚基; 硬化促进剂; 和具有三嗪或异氰脲酸酯环的化合物和含有少于60重量％的氮但不含脲衍生物的化合物中的至少一种。 包含该环氧树脂组合物的印刷电路板具有低吸水性，优异的耐热性和与铜箔的良好粘合性。

公开(公告)号：US06214468B1

公开(公告)日：2001-04-10

申请号：US09238734

申请日：1999-01-28

申请人： Nozomu Takano ,  Michitoshi Arata ,  Hikari Murai ,  Yoshiyuki Takeda

发明人： Nozomu Takano ,  Michitoshi Arata ,  Hikari Murai ,  Yoshiyuki Takeda

IPC分类号： B32B2738

CPC分类号： H05K1/0326 ,  C08G59/08 ,  C08L63/04 ,  Y10T428/31529 ,  C08L61/04

摘要： A flame retardant epoxy resin composition which can improve heat resistance and exhibit an excellent adhesion strength and insulation reliability when applied to a printed circuit board or to a multilayered interconnection laminate is provided, and a prepreg and a metal foil clad laminate using the same composition are manufactured. This flame retardant epoxy resin composition consists of: (a) an epoxy resin containing a glicidylether compound which is a condensate of bisphenol A or bisphenol F with formaldehyde; (b) a condensate of bisphenol A with formaldehyde; (c) haloganated bisphenol A as a flame retardant agent; and (d) a hardening accelerator, wherein the haloganated bisphenol A is contained in 45 weight % or less of a total solid resin weight. A metal foil clad laminate is provided using this composition as a varnish, impregnating the same into a base material to obtain the prepreg, laminating the prepreg, depositing a metal foil on one or both surfaces thereof, and heating under pressure.

摘要翻译： 提供一种阻燃环氧树脂组合物，其可以提高耐热性并且当应用于印刷电路板或多层互连层压体时具有优异的粘合强度和绝缘可靠性，并且使用相同组成的预浸料坯和覆盖金属箔的层压板 制造。 该阻燃环氧树脂组合物由以下组成：（a）含有双酚A或双酚F与甲醛的缩合物的缩水甘油醚化合物的环氧树脂; （b）双酚A与甲醛的缩合物; （c）作为阻燃剂的卤化双酚A; 和（d）硬化促进剂，其中所述卤素双酚A的含量为总固体树脂重量的45重量％以下。 使用该组合物作为清漆，将其浸渍到基材中以获得预浸料，层压预浸料，在其一个或两个表面上沉积金属箔，并在加压下进行加热来提供覆盖金属箔的层压板。

公开(公告)号：US06558797B1

公开(公告)日：2003-05-06

申请号：US09869050

申请日：2001-06-22

申请人： Michitoshi Arata ,  Nozomu Takano ,  Kazuhito Kobayashi

发明人： Michitoshi Arata ,  Nozomu Takano ,  Kazuhito Kobayashi

IPC分类号： B32B2738

CPC分类号： H05K3/4655 ,  C08G59/621 ,  C08L61/04 ,  C08L2666/36 ,  C09J7/28 ,  C09J163/00 ,  C09J2463/00 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/124 ,  Y10S428/901 ,  Y10T428/24331 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31547

摘要： An adhesive-coated copper foil which comprises a copper foil and disposed on one side thereof a layer of an adhesive composition comprising (a) an epoxy resin, (b) a polyfunctional phenol, (c) a curing accelerator as an optional ingredient, and (d) a compound having a triazine ring or isocyanuric ring. The adhesive layer has low hygroscopicity, excellent heat resistance, and satisfactory adhesion to copper foils. By using the adhesive-coated copper foil, a copper-clad laminate and a printed circuit board both having excellent properties can be obtained.

摘要翻译： 一种粘合剂涂覆的铜箔，其包括铜箔，并且在其一侧上设置一层粘合剂组合物，所述粘合剂组合物包含（a）环氧树脂，（b）多官能酚，（c）作为任选成分的固化促进剂和 （d）具有三嗪环或异氰脲酸环的化合物。 粘合剂层具有低吸湿性，优异的耐热性和对铜箔的令人满意的粘合性。 通过使用粘合剂涂覆的铜箔，可以获得具有优异性能的覆铜层压板和印刷电路板。

公开(公告)号：US06706409B2

公开(公告)日：2004-03-16

申请号：US09973719

申请日：2001-10-11

申请人： Nozomu Takano ,  Tomio Fukuda ,  Masato Miyatake

发明人： Nozomu Takano ,  Tomio Fukuda ,  Masato Miyatake

IPC分类号： B32B2704

CPC分类号： B32B15/08 ,  C08K9/06 ,  H01L23/145 ,  H01L23/296 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0162 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31862 ,  H01L2924/00

摘要： An incombustible resin composition in which a silicone oligomer, a metal hydrate and a resin material are contained as essential components, the metal hydrate is 20% by weight or more in the total solids of the resin composition is provided.

摘要翻译： 提供其中含有硅氧烷低聚物，金属水合物和树脂材料作为必要组分的不燃性树脂组合物，其中所述金属水合物的总固体量为树脂组合物的20重量％以上。

公开(公告)号：US06524717B1

公开(公告)日：2003-02-25

申请号：US09913726

申请日：2001-08-17

申请人： Nozomu Takano ,  Tomio Fukuda ,  Masato Miyatake ,  Masahisa Ose

发明人： Nozomu Takano ,  Tomio Fukuda ,  Masato Miyatake ,  Masahisa Ose

IPC分类号： B32B1508

CPC分类号： H05K1/0373 ,  C08J5/24 ,  H05K2201/0162 ,  H05K2201/0209 ,  Y10T428/31663

摘要： This invention relates to a prepreg which comprises a substrate and a resin composition containing a resin, an inorganic filler in an amount of 25% by volume based on the total volume of a solid component of the resin composition and a silicone polymer, which resin composition being impregnated into the substrate, and to a metal-clad-laminated board which comprises at least one metal foil being laminated on both surfaces or one surface of the prepreg mentioned above, or a laminated board of the prepregs under heating and pressure.

摘要翻译： 本发明涉及一种预浸料，其包括基材和含有树脂的树脂组合物，相对于树脂组合物的固体成分的总体积为25体积％的无机填料和硅氧烷聚合物，该树脂组合物 浸渍在基材中，以及包含层叠在上述预浸料坯的两面或一个表面上的至少一层金属箔的金属包覆层压板或加热和压力下的预浸料坯的层压板。