公开(公告)号：US20240264201A1

公开(公告)日：2024-08-08

申请号：US18435029

申请日：2024-02-07

Applicant: OKINS ELECTRONICS CO., LTD

Inventor： Jin Kook JUN ,  Sang Hoon CHA

IPC: G01R1/067

CPC classification number: G01R1/06722

Abstract: A pogo pin whose elastic force can be adjusted according to a contacting direction is disclosed. According to an aspect of the present invention, provided is a pogo pin with adjustable elastic force, including: a housing; plunger pins mounted on ends of the housing to directly contact a measurement object; and a spring installed inside the housing to provide elastic force so that the plunger pin contacts the measurement object, wherein a local fixing part protruding inward is formed on one side of the housing so that a first position of the spring can be pressed and fixed.

公开(公告)号：US20240194509A1

公开(公告)日：2024-06-13

申请号：US18583621

申请日：2024-02-21

Applicant: OKINS ELECTRONICS CO., LTD

Inventor： Jin Kook JUN ,  Sung Gye PARK ,  Soung Hun CHOI

IPC: H01L21/677 ,  H01F7/02

CPC classification number: H01L21/67721 ,  H01F7/0252

Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.

公开(公告)号：US20240361352A1

公开(公告)日：2024-10-31

申请号：US18644107

申请日：2024-04-24

Applicant: okins electronics Co.,Ltd

Inventor： Jin Kook JUN ,  Chan Ho Lee ,  Seung Hyun NOH

IPC: G01R1/04 ,  G01R31/28

CPC classification number: G01R1/0466 ,  G01R31/2863

Abstract: A test socket for testing the electrical characteristics of a semiconductor device provides a test socket, including a housing in which a plurality of first through holes are formed; a cover in which a plurality of second through holes are formed; and a plurality of contact pins inserted into the plurality of first and second through holes, wherein the plurality of contact pins include an elastic part capable of elastic deformation in the longitudinal direction; a first contact part comprising: a first support part extending from one end of the elastic part, a stroke part connected to an end of the first support part and movable in the longitudinal direction, and a first contact tip connected to an end of the stroke part and exposed in the first through hole.

公开(公告)号：US20220337008A1

公开(公告)日：2022-10-20

申请号：US17723605

申请日：2022-04-19

Applicant: Hyun Duk KIM ,  SENSORVIEW CO., LTD. ,  okins electronics Co.,Ltd

Inventor： Byoung Nam KIM ,  Kyoung Il KANG ,  Jin Woo LEE ,  Jin Kook JUN ,  Sung Gyu PARK ,  Hyun Duk KIM ,  Jong Wook HAM ,  Sang Woo HAN

IPC: H01R31/06 ,  H01R24/00

Abstract: Disclosed is a cable adaptor which is connected to a cable including an outer conductor. The adaptor includes a contact pin which comes into contact with a signal pin of the cable, a first member which is conductive and disposed inside and coupled to the contact pin, a second member disposed outside and coupled to the contact pin, and a third member which is conductive and disposed outside the second member. Here, the contact pin includes a first body coupled to the second member, a first contact portion which is conductive and extends from one side of the first body to come into contact with the signal pin, and a second contact portion which extends from the other side of the first body and comes into contact with an object being tested. The third member includes a second body coupled to the second member and a third contact portion.

公开(公告)号：US20240159794A1

公开(公告)日：2024-05-16

申请号：US18218029

申请日：2023-07-04

Applicant: okins electronics Co.,Ltd

Inventor： Jin Kook JUN ,  Chan Ho Lee ,  Jae Hyun SEO

IPC: G01R1/04 ,  G01R31/28

CPC classification number: G01R1/0466 ,  G01R31/2886

Abstract: A test socket is provided. According to an aspect of the present invention, provided is a test socket energizably connected to a semiconductor device to electrically test the semiconductor device, the test socket including a base on which a seating part on which the semiconductor device is seated is formed and a test pin protruding from the seating part in one direction, the test pin contactable with a conductive part of the semiconductor device; a cover capable of reciprocating a first position located at an end of the base in one direction and a second position located apart from the first position in the one direction; and a support member coupled to the base and supporting an outer surface of the cover.

公开(公告)号：US20180188290A1

公开(公告)日：2018-07-05

申请号：US15741213

申请日：2016-07-04

Applicant: OKINS ELECTRONICS CO.,LTD

Inventor： Sung Gye PARK ,  Jin Kook JUN

IPC: G01R3/00 ,  G01R1/04 ,  G01R31/28 ,  H05K3/10 ,  H05K3/28 ,  H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: G01R3/00 ,  G01R1/0433 ,  G01R31/2863 ,  G01R31/2896 ,  H05K1/0268 ,  H05K1/028 ,  H05K1/111 ,  H05K3/103 ,  H05K3/28 ,  H05K3/285 ,  H05K3/3484 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2201/10757 ,  H05K2201/10795 ,  H05K2201/10856 ,  H05K2203/041 ,  H05K2203/1327 ,  H05K2203/166

Abstract: A method of manufacturing a test socket includes preparing a printed circuit board (PCB) on which a bonding pad is disposed, bonding a conductive wire on the bonding pad, mounting, on an upper surface of the PCB, a space through which the bonding pad is exposed, mounting, on an upper surface of the space, a base through which the bonding pad is exposed, mounting, on an upper surface of the base, a jig which covers the bonding pad, and injecting a liquid silicone rubber into a jig assembly by using the jig assembly as a mold, the jig assembly including the PCB, the space, the base, and the jig.

公开(公告)号：US20240364050A1

公开(公告)日：2024-10-31

申请号：US18645432

申请日：2024-04-25

Applicant: okins electronics Co.,Ltd

Inventor： Jin Kook JUN ,  Chan Ho Lee ,  Seung Hyun NOH

IPC: H01R13/629 ,  H01R12/72 ,  H01R13/04

CPC classification number: H01R13/629 ,  H01R12/727 ,  H01R13/04

Abstract: A test connector tests the electrical characteristics of a semiconductor device, the test connector including a housing; a plurality of wafers having a plurality of coupling parts arranged at regular intervals on one side and stacked standing upright on the housing; a guide part having a width smaller than that of the plurality of coupling parts and arranged on one surface of the plurality of coupling parts; connector pins provided on both sides of the guide part, wherein the guide part includes a first introduction portion and a second introduction portion inclined in the center direction on both sides of an end thereof and the positions of the first introduction portion and the second introduction portion are different.

公开(公告)号：US20210233789A1

公开(公告)日：2021-07-29

申请号：US17154253

申请日：2021-01-21

Applicant: OKINS ELECTRONICS CO., LTD

Inventor： Jin Kook JUN ,  Sung Gye PARK ,  Soung Hun CHOI

IPC: H01L21/677 ,  H01F7/02

Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.

公开(公告)号：US20210190822A1

公开(公告)日：2021-06-24

申请号：US17193449

申请日：2021-03-05

Applicant: OKINS ELECTRONICS CO., LTD

Inventor： Jin Kook JUN ,  Sang Hoon CHA ,  Chang Mo JEONG

IPC: G01R1/067

Abstract: A three-layer micro electro mechanical system (MEMS) spring pin includes a lower-layer spring pin in which a lower-layer wave is disposed between and connected to a lower-layer top plunger and a lower-layer bottom plunger, an upper-layer spring pin in which an upper-layer wave is disposed between and connected to an upper-layer top plunger and an upper-layer bottom plunger, a middle-layer top tip interposed between the upper-layer top plunger and the lower-layer top plunger, and a middle-layer bottom tip interposed between the upper-layer bottom plunger and the lower-layer bottom plunger. According to the above-described structure, effects are expected in which bending is prevented, a stroke is stabilized due to the multi-layer spring, and contact characteristics are enhanced due to the multi-layer plunger.

公开(公告)号：US20240291207A1

公开(公告)日：2024-08-29

申请号：US18573811

申请日：2022-06-13

Applicant: SENSORVIEW CO., LTD. ,  OKINS ELECTRONICS CO., LTD

Inventor： Byoung Nam KIM ,  Kyoung ll KANG ,  Jong Hyup LIM ,  Dong UK LEE ,  Jae Kun CHOI ,  Jin Kook JUN ,  Sung Gyu PARK ,  Jong Wook HAM

IPC: H01R13/6582

CPC classification number: H01R13/6582

Abstract: The connector assembly, according to the present invention, comprises: a receptacle arranged on a substrate; and a plug coupled to the receptacle, wherein the plug includes: a pin having one side electrically connected to a cable and having a contact portion arranged on the other side; a dielectric arranged on the outside of the pin; a shield can arranged on the outside of the dielectric; and a plug shell arranged on the outside of the shield can, wherein the receptacle comprises a first hole, the dielectric comprises a second hole in which the pin is arranged, the pin is arranged in the second hole such that the contact portion protrudes farther than the outer surface of the dielectric, and the dielectric is positioned in the first hole so that the contact portion is directly and elastically in contact with a contact point of the substrate.