Semiconductor illuminating device

    公开(公告)号:US10141483B2

    公开(公告)日:2018-11-27

    申请号:US15549364

    申请日:2016-01-11

    Abstract: A semiconductor illuminating device is disclosed. The device includes an LED configured for emitting blue primary radiation and an LED phosphor arranged and configured such that it emits secondary light that forms at least one component of the illumination light, wherein the LED phosphor comprises a red phosphor for emitting red light as a component of the secondary light and a green phosphor for emitting green light as a component of the secondary light, wherein the green light has a color point located above a first straight line having a slope m1 and a y-intercept n1 in a CIE standard chromaticity diagram, with the slope m1=1.189 and the y-intercept n1=0.226, and wherein the components of the illumination light are at such a ratio to one another that the illumination light has a color temperature of at most 5500 K.

    LED FILAMENT COMPRISING CONVERSION LAYER
    5.
    发明申请

    公开(公告)号:US20190157250A1

    公开(公告)日:2019-05-23

    申请号:US16197939

    申请日:2018-11-21

    Abstract: An LED filament includes semiconductor chips arranged on a top side of a radiation-transmissive carrier, and at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor including less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.

    Luminescence conversion element and optoelectronic semiconductor component comprising such a luminescence conversion element and method of producing same
    6.
    发明授权
    Luminescence conversion element and optoelectronic semiconductor component comprising such a luminescence conversion element and method of producing same 有权
    发光转换元件和包含这种发光转换元件的光电子半导体元件及其制造方法

    公开(公告)号:US09583670B2

    公开(公告)日:2017-02-28

    申请号:US15036893

    申请日:2014-11-17

    Abstract: A luminescence conversion element for wavelength conversion of primary electromagnetic radiation into secondary electromagnetic radiation includes first luminescent material particles that, when excited by the primary electromagnetic radiation, emit a first electromagnetic radiation, a peak wavelength of which is at least 515 nm to at most 550 nm of a green region of the electromagnetic spectrum; second luminescent material particles that, when excited by the primary electromagnetic radiation, emit a second electromagnetic radiation, a peak wavelength of which is at least 595 nm to at most 612 nm of a yellow-red region of the electromagnetic spectrum; and third luminescent material particles that, when excited by the primary electromagnetic radiation, emit a third electromagnetic radiation, a peak wavelength of which is at least 625 nm to at most 660 nm of a red region of the electromagnetic spectrum.

    Abstract translation: 用于主电磁辐射到次级电磁辐射的波长转换的发光转换元件包括第一发光材料颗粒,当第一电磁辐射激发时,发射第一电磁辐射,其峰值波长为至少515nm至至多550 nm的电磁光谱的绿色区域; 第二发光材料颗粒,当被主要电磁辐射激发时,其发射第二电磁辐射,其峰值波长为电磁光谱的黄色 - 红色区域的至少595nm至最多612nm; 以及第三发光材料颗粒,当被主电磁辐射激发时,其发射第三电磁辐射,其峰值波长为电磁光谱的红色区域的至少625nm至至多660nm。

    LED filament comprising conversion layer

    公开(公告)号:US10886258B2

    公开(公告)日:2021-01-05

    申请号:US16197939

    申请日:2018-11-21

    Abstract: An LED filament includes semiconductor chips arranged on a top side of a radiation-transmissive carrier, and at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor including less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.

    Optoelectronic semiconductor chip, method for producing an optoelectronic semiconductor chip, conversion element and phosphor for a conversion element

    公开(公告)号:US10418530B2

    公开(公告)日:2019-09-17

    申请号:US15531349

    申请日:2015-11-25

    Abstract: An optoelectronic semiconductor chip having a semiconductor body (1) that is suitable for emitting electromagnetic radiation in a first wavelength range from a radiation exit face (3) is specified. Furthermore, the semiconductor chip comprises a ceramic or monocrystalline conversion platelet (6) that is suitable for converting electromagnetic radiation in the first wavelength range into electromagnetic radiation in a second wavelength range, which is different from the first wavelength range, and a wavelength-converting joining layer (7) that connects the conversion platelet (6) to the radiation exit face (3), wherein the wavelength-converting joining layer (7) has luminescent material particles (4) that are suitable for converting radiation in the first wavelength range into radiation in a third wavelength range, which is different from the first wavelength range and the second wavelength range. The wavelength-converting joining layer (7) furthermore has a thickness of no more than 30 micrometers. A method for fabricating an optoelectronic semiconductor chip, a further semiconductor chip, conversion element and luminescent material are specified.

    LUMINESCENCE CONVERSION ELEMENT AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT COMPRISING SUCH A LUMINESCENCE CONVERSION ELEMENT AND METHOD OF PRODUCING SAME
    9.
    发明申请
    LUMINESCENCE CONVERSION ELEMENT AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT COMPRISING SUCH A LUMINESCENCE CONVERSION ELEMENT AND METHOD OF PRODUCING SAME 有权
    包含这种发光变换元件的发光元件和光电子半导体元件及其生产方法

    公开(公告)号:US20160329470A1

    公开(公告)日:2016-11-10

    申请号:US15036893

    申请日:2014-11-17

    Abstract: A luminescence conversion element for wavelength conversion of primary electromagnetic radiation into secondary electromagnetic radiation includes first luminescent material particles that, when excited by the primary electromagnetic radiation, emit a first electromagnetic radiation, a peak wavelength of which is at least 515 nm to at most 550 nm of a green region of the electromagnetic spectrum; second luminescent material particles that, when excited by the primary electromagnetic radiation, emit a second electromagnetic radiation, a peak wavelength of which is at least 595 nm to at most 612 nm of a yellow-red region of the electromagnetic spectrum; and third luminescent material particles that, when excited by the primary electromagnetic radiation, emit a third electromagnetic radiation, a peak wavelength of which is at least 625 nm to at most 660 nm of a red region of the electromagnetic spectrum.

    Abstract translation: 用于主电磁辐射到次级电磁辐射的波长转换的发光转换元件包括第一发光材料颗粒,当第一电磁辐射激发时,发射第一电磁辐射,其峰值波长为至少515nm至至多550 nm的电磁光谱的绿色区域; 第二发光材料颗粒,当被主要电磁辐射激发时,其发射第二电磁辐射,其峰值波长为电磁光谱的黄色 - 红色区域的至少595nm至最多612nm; 以及第三发光材料颗粒,当被主电磁辐射激发时,其发射第三电磁辐射,其峰值波长为电磁光谱的红色区域的至少625nm至至多660nm。

    Optoelectronic Semiconductor Component and Conversion Element
    10.
    发明申请
    Optoelectronic Semiconductor Component and Conversion Element 审中-公开
    光电半导体元件和转换元件

    公开(公告)号:US20140264422A1

    公开(公告)日:2014-09-18

    申请号:US14354098

    申请日:2012-10-09

    Abstract: In at least one embodiment, an optoelectronic semiconductor component includes an optoelectronic semiconductor chip. The semiconductor component includes a conversion element that is arranged to convert at least some radiation emitted by the semiconductor chip into radiation of a different wavelength. The conversion element comprises at least one luminescent substance and scattering particles and also at least one matrix material. The scattering particles are embedded in the matrix material. A difference in the refractive index between the matrix material and a material of the scattering particles at a temperature of 300 K is at the most 0.15. The difference in the refractive index between the matrix material and the material of the scattering particles at a temperature of 380 K is greater than at a temperature of 300 K.

    Abstract translation: 在至少一个实施例中,光电子半导体部件包括光电子半导体芯片。 半导体部件包括转换元件,其被配置为将由半导体芯片发射的至少一些辐射转换成不同波长的辐射。 转换元件包括至少一种发光物质和散射粒子以及至少一种基质材料。 散射颗粒嵌入基质材料中。 在300K的温度下,基体材料和散射粒子的材料之间的折射率差异为0.15以下。 在380K的温度下,基体材料与散射粒子的材料之间的折射率之差大于300K的温度。

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