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    Optoelectronic Semiconductor Component and Conversion Element
    1.
    发明申请
    Optoelectronic Semiconductor Component and Conversion Element 审中-公开
    光电半导体元件和转换元件

    公开(公告)号：US20140264422A1

    公开(公告)日：2014-09-18

    申请号：US14354098

    申请日：2012-10-09

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Reiner Windisch ,  Hailing Cui ,  Gertrud Kraeuter ,  Markus Schneider

    IPC: H01L33/50 ,  C09K11/02 ,  H01L33/58

    CPC classification number: H01L33/504 ,  C09K11/025 ,  H01L33/501 ,  H01L33/56 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

    Abstract: In at least one embodiment, an optoelectronic semiconductor component includes an optoelectronic semiconductor chip. The semiconductor component includes a conversion element that is arranged to convert at least some radiation emitted by the semiconductor chip into radiation of a different wavelength. The conversion element comprises at least one luminescent substance and scattering particles and also at least one matrix material. The scattering particles are embedded in the matrix material. A difference in the refractive index between the matrix material and a material of the scattering particles at a temperature of 300 K is at the most 0.15. The difference in the refractive index between the matrix material and the material of the scattering particles at a temperature of 380 K is greater than at a temperature of 300 K.

    Abstract translation: 在至少一个实施例中，光电子半导体部件包括光电子半导体芯片。 半导体部件包括转换元件，其被配置为将由半导体芯片发射的至少一些辐射转换成不同波长的辐射。 转换元件包括至少一种发光物质和散射粒子以及至少一种基质材料。 散射颗粒嵌入基质材料中。 在300K的温度下，基体材料和散射粒子的材料之间的折射率差异为0.15以下。 在380K的温度下，基体材料与散射粒子的材料之间的折射率之差大于300K的温度。

    Method for producing an optoelectronic assembly and optoelectronic assembly
    2.
    发明申请
    Method for producing an optoelectronic assembly and optoelectronic assembly 有权
    光电组件和光电组件的制造方法

    公开(公告)号：US20140312375A1

    公开(公告)日：2014-10-23

    申请号：US14255524

    申请日：2014-04-17

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Schneider

    IPC: H01L33/50

    CPC classification number: H01L33/50 ,  H01L24/97 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

    Abstract: A method for producing an optoelectronic assembly (12) is provided, in which an optoelectronic component (16) is arranged on a carrier (14). Electrical terminals of the optoelectronic component (16) are electrically coupled to electrical contacts of the carrier (14) corresponding thereto. A dummy body (20) is arranged on a first side of the optoelectronic component (16) facing away from the carrier (14). A potting material (22) is arranged on the carrier (14), which potting material at least partially encloses the optoelectronic component (16) and at least partially encloses the dummy body (20). The dummy body (20) is removed, after the potting material (22) is dimensionally stable, whereby a recess (23) results, which is at least partially enclosed by the dimensionally stable potting material (22). An optically functional material (24) is decanted into the recess (23).

    Abstract translation: 提供了一种用于制造光电组件（12）的方法，其中光电子部件（16）布置在载体（14）上。 光电子部件（16）的电端子电耦合到对应于其的载体（14）的电触头。 虚设体（20）布置在远离载体（14）的光电子部件（16）的第一侧上。 灌封材料（22）布置在载体（14）上，该灌封材料至少部分地包围光电子部件（16）并且至少部分地包围虚设体（20）。 在灌封材料（22）尺寸稳定之后，去除虚设体（20），由此产生至少部分地被尺寸稳定的灌封材料（22）包围的凹部（23）。 将光学功能材料（24）倾倒到凹部（23）中。

    Method for producing an optoelectronic assembly and optoelectronic assembly
    3.
    发明授权
    Method for producing an optoelectronic assembly and optoelectronic assembly 有权
    光电组件和光电组件的制造方法

    公开(公告)号：US09006007B2

    公开(公告)日：2015-04-14

    申请号：US14255524

    申请日：2014-04-17

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Schneider

    IPC: H01L33/60 ,  H01L33/50 ,  H01L23/00 ,  H01L33/54 ,  H01L33/56

    CPC classification number: H01L33/50 ,  H01L24/97 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

    Abstract: A method for producing an optoelectronic assembly (12) is provided, in which an optoelectronic component (16) is arranged on a carrier (14). Electrical terminals of the optoelectronic component (16) are electrically coupled to electrical contacts of the carrier (14) corresponding thereto. A dummy body (20) is arranged on a first side of the optoelectronic component (16) facing away from the carrier (14). A potting material (22) is arranged on the carrier (14), which potting material at least partially encloses the optoelectronic component (16) and at least partially encloses the dummy body (20). The dummy body (20) is removed, after the potting material (22) is dimensionally stable, whereby a recess (23) results, which is at least partially enclosed by the dimensionally stable potting material (22). An optically functional material (24) is decanted into the recess (23).

    Abstract translation: 提供了一种用于制造光电组件（12）的方法，其中光电子部件（16）布置在载体（14）上。 光电子部件（16）的电端子电耦合到对应于其的载体（14）的电触头。 虚设体（20）布置在远离载体（14）的光电子部件（16）的第一侧上。 灌封材料（22）布置在载体（14）上，该灌封材料至少部分地包围光电子部件（16）并且至少部分地包围虚设体（20）。 在灌封材料（22）尺寸稳定之后，去除虚设体（20），由此产生至少部分地被尺寸稳定的灌封材料（22）包围的凹部（23）。 将光学功能材料（24）倾倒到凹部（23）中。

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