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公开(公告)号：US10996482B2
公开(公告)日：2021-05-04
申请号：US15693531
申请日：2017-09-01
发明人： Roland Enzmann , Hubert Halbritter , Markus Arzberger , Andreas Ploessl , Roland Schulz , Georg Rossbach , Bernd Boehm , Frank Singer , Matthias Sabathil
摘要： An optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure. A method of producing an optically effective element includes providing a carrier, forming a first optically effective structure on a top side of the carrier, and arranging a cover above the top side of the carrier and the first optically effective structure.
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公开(公告)号：US10333032B2
公开(公告)日：2019-06-25
申请号：US14915873
申请日：2014-08-08
发明人： Frank Möllmer , Markus Arzberger , Michael Schwind , Thomas Höfer , Martin Haushalter , Mario Wiengarten , Tilman Eckert
IPC分类号： H01L33/48 , H01L33/58 , H01L33/60 , H01L33/62 , H01L23/00 , H01L21/48 , H01L25/16 , H01L29/861 , H01L33/54 , H01L33/64
摘要： An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.
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公开(公告)号：US20180090908A1
公开(公告)日：2018-03-29
申请号：US15565188
申请日：2016-04-29
发明人： Roland Enzmann , Markus Arzberger
CPC分类号： H01S5/02256 , H01L2224/48091 , H01S5/0206 , H01S5/02236 , H01S5/0224 , H01S5/02268 , H01S5/02272 , H01S5/02469 , H01S5/06825 , H01L2924/00014
摘要： An arrangement having a substrate and a semiconductor laser and a method for manufacturing such an arrangement are disclosed. In an embodiment, the arrangement includes a substrate and a semiconductor laser, wherein the substrate has a top, side areas and a bottom, wherein at least one first recess is provided at the top, wherein the semiconductor laser is arranged on the top of the substrate such that a region of the side area of the semiconductor laser via which the electromagnetic radiation is emitted is arranged above the first recess.
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公开(公告)号：US20160218248A1
公开(公告)日：2016-07-28
申请号：US14915873
申请日：2014-08-08
发明人： Frank Möllmer , Markus Arzberger , Michael Schwind , Thomas Höfer , Martin Haushalter , Mario Wiengarten , Tilmann Eckert
IPC分类号： H01L33/48 , H01L33/60 , H01L21/48 , H01L33/58 , H01L25/16 , H01L29/861 , H01L33/62 , H01L33/54
CPC分类号： H01L33/486 , H01L21/4817 , H01L21/4821 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/165 , H01L25/167 , H01L29/861 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2933/005 , H01L2933/0066 , H01L2224/45099 , H01L2924/00
摘要： An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.
摘要翻译： 实施方案光电子半导体器件包括具有带有第一和第二连接导体的引线框的外壳。 壳体还具有在一个或多个区域中围绕引线框架的壳体主体。 壳体在壳体的安装侧和与安装侧相对的壳体的前侧之间沿垂直方向延伸。 第一连接导体具有凹部。 构造成产生辐射的半导体芯片布置在壳体内，并且半导体芯片设置在凹部中并且固定到凹部内的第一连接导体。 凹部的侧面形成用于反射所产生的辐射的反射器。 第一连接导体在安装侧从壳体主体突出。 在至少一些区域中，半导体芯片没有与半导体芯片相邻的封装材料。
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5.发明申请公开(公告)号：US20180101016A1
公开(公告)日：2018-04-12
申请号：US15693531
申请日：2017-09-01
发明人： Roland Enzmann , Hubert Halbritter , Markus Arzberger , Andreas Ploessl , Roland Schulz , Georg Rossbach , Bernd Boehm , Frank Singer , Matthias Sabathil
CPC分类号： G02B27/0916 , G02B3/0025 , G02B3/0068 , G02B3/0075 , G02B5/1814 , G02B5/1823 , G02B5/1857 , G02B5/1866 , G02B27/0944 , G02B27/0961 , G02B27/4272
摘要： An optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure. A method of producing an optically effective element includes providing a carrier, forming a first optically effective structure on a top side of the carrier, and arranging a cover above the top side of the carrier and the first optically effective structure.
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公开(公告)号：US20160036198A1
公开(公告)日：2016-02-04
申请号：US14884500
申请日：2015-10-15
发明人： Uwe Strauss , Markus Arzberger
CPC分类号： H01S5/02244 , H01L23/495 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01S5/02208 , H01S5/02216 , H01S5/02268 , H01S5/02276 , H01S5/02288 , H01S5/02296 , H01S5/024 , H01S5/02476 , H05K5/0091 , H01L2924/00014 , H01L2924/00
摘要： A housing for an optoelectronic semiconductor component includes a housing body having a mounting plane and a leadframe with a first connection conductor and a second connection conductor. The housing body deforms the leadframe in some regions. The leadframe has a main extension plane which extends obliquely or perpendicularly with respect to the mounting plane. A semiconductor component having such a housing and a semiconductor chip and a method for producing a housing are also disclosed.
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公开(公告)号：US20180145211A1
公开(公告)日：2018-05-24
申请号：US15577626
申请日：2016-05-27
CPC分类号： H01L33/08 , G02B1/005 , G02B5/04 , G06T7/521 , H01L33/0045 , H01L33/105 , H01L33/58
摘要： An optoelectronic arrangement that produces a light pattern includes a light-emitting diode chip configured to emit electromagnetic radiation on its upper side and forming a first two-dimensional pattern on the upper side of the light-emitting diode chip, and an optically imaging element configured to project electromagnetic radiation emitted by the light-emitting diode chip into an environment of the optoelectronic arrangement.
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公开(公告)号：US09608401B2
公开(公告)日：2017-03-28
申请号：US14653698
申请日：2013-12-17
发明人： Roland Enzmann , Markus Horn , Markus Graul , Thomas Veit , Juergen Dachs , Stefan Listl , Markus Arzberger
CPC分类号： H01S5/0201 , H01S5/0202 , H01S5/0206 , H01S5/02236 , H01S5/0226 , H01S5/02268 , H01S5/02272 , H01S5/323 , H01S5/32333
摘要： Method for producing semiconductor laser elements (1) comprises A) providing a carrier composite (20) having a plurality of carriers (2) for the semiconductor laser elements (1), B) providing a laser bar (30) having a plurality of semiconductor laser diodes (3) which comprise a common growth substrate (31) and a semiconductor layer sequence (32) grown thereon, C) generating predetermined breaking points (35) on a substrate underside (34) of the growth substrate (31), said substrate underside facing away from the semiconductor layer sequence (32), D) attaching the laser bar (30) to a carrier upper side (23) of the carrier composite (20), wherein the attachment is performed at an elevated temperature and is followed by cooling, and E) singulating into the semiconductor laser elements (1), wherein steps B) to E) are performed in the indicated sequence.
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公开(公告)号：US09461438B2
公开(公告)日：2016-10-04
申请号：US14884500
申请日：2015-10-15
发明人： Uwe Strauss , Markus Arzberger
IPC分类号： H01L23/495 , H01S5/024 , H01S5/022 , H05K5/00 , H01L33/62
CPC分类号： H01S5/02244 , H01L23/495 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01S5/02208 , H01S5/02216 , H01S5/02268 , H01S5/02276 , H01S5/02288 , H01S5/02296 , H01S5/024 , H01S5/02476 , H05K5/0091 , H01L2924/00014 , H01L2924/00
摘要： A housing for an optoelectronic semiconductor component includes a housing body having a mounting plane and a leadframe with a first connection conductor and a second connection conductor. The housing body deforms the leadframe in some regions. The leadframe has a main extension plane which extends obliquely or perpendicularly with respect to the mounting plane. A semiconductor component having such a housing and a semiconductor chip and a method for producing a housing are also disclosed.
摘要翻译： 一种用于光电子半导体部件的壳体包括具有安装平面的壳体和具有第一连接导体和第二连接导体的引线框架。 壳体在一些区域使引线框变形。 引线框具有相对于安装平面倾斜或垂直延伸的主延伸平面。 还公开了一种具有这种外壳和半导体芯片的半导体元件及其制造方法。
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10.发明授权Method of producing a semiconductor laser element, and semiconductor laser element 有权半导体激光元件的制造方法以及半导体激光元件公开(公告)号：US09450376B2
公开(公告)日：2016-09-20
申请号：US14420411
申请日：2013-08-12
发明人： Roland Enzmann , Stephan Haneder , Markus Arzberger , Christoph Walter , Tomasz Swietlik , Harald König , Robin Fehse , Mathias Kämpf , Markus Graul , Markus Horn
CPC分类号： H01S5/0201 , H01S5/0202 , H01S5/02268 , H01S5/02272 , H01S5/02276
摘要： A method of producing a semiconductor laser element includes A) providing at least one carrier assemblage having a multiplicity of carriers for the semiconductor laser elements, C) providing at least one laser bar having a multiplicity of semiconductor laser diodes which include a common growth substrate and a semiconductor layer sequence grown thereon, D) fitting the laser bar on a top side of the carrier assemblage, and E) singulating to form the semiconductor laser elements after D).
摘要翻译： 一种制造半导体激光元件的方法包括：A）为半导体激光元件提供具有多个载流子的至少一个载体组件，C）提供具有多个半导体激光二极管的至少一个激光棒，所述半导体激光二极管包括共同的生长衬底和 在其上生长的半导体层序列，D）将激光棒装配在载体组件的顶侧，以及E）在D）之后单分解以形成半导体激光元件。
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