OPTICAL MODULE
    1.
    发明申请
    OPTICAL MODULE 审中-公开

    公开(公告)号:US20170139160A1

    公开(公告)日:2017-05-18

    申请号:US15339979

    申请日:2016-11-01

    IPC分类号: G02B6/42 G01J1/44

    摘要: A first conductive layer includes a first signal wiring including, at a position except for an end portion, a wide portion having a width wider than that of the other portion. A second conductive layer includes a signal electrode electrically continuous with the end portion of the first signal wiring, a first ground plane overlapping the wide portion, and a ground terminal. A third conductive layer includes a second signal wiring including an end portion overlapping and bonded to the signal electrode, and a ground electrode overlapping and bonded to the ground terminal. A fourth conductive layer includes a second ground plane. The second ground plane includes a through hole overlapping the end portion of the second signal wiring. A fifth conductive layer includes a third groundplane. The third groundplane overlaps the end portion of the second signal wiring inside the through hole.

    OPTICAL MODULE AND OPTICAL TRANSMISSION EQUIPMENT

    公开(公告)号:US20180172933A1

    公开(公告)日:2018-06-21

    申请号:US15840199

    申请日:2017-12-13

    发明人: Daisuke NOGUCHI

    摘要: There is provided an optical module, including a first optical subassembly, a second optical subassembly, a first flexible printed circuit board, and a second flexible printed circuit board. The first/second optical subassembly includes a first/second normal phase lead terminal and a first/second reverse phase lead terminal, arranged in a positive direction of a first orientation. The first/second flexible printed circuit board includes a first/second normal phase strip conductor, a first/second reverse phase strip conductor, and a ground conductor layer. The back surface of the first/second flexible printed circuit board faces the end surface of the first/second optical subassembly. The first/second normal phase strip conductor extends in a positive/negative direction of a second orientation.

    OPTICAL MODULE
    4.
    发明申请
    OPTICAL MODULE 有权
    光学模块

    公开(公告)号:US20170064831A1

    公开(公告)日:2017-03-02

    申请号:US15247970

    申请日:2016-08-26

    摘要: The second wiring pattern includes extended regions from the main body side to the projecting portions as seen in a direction in which the pair of leads extend, and wiring regions continuously spreading from the extended regions in a direction away from the main body. Supposing that a length of the wiring region from an end of the projecting portion as a reference point to a farthest position in a direction away from the main body is a first width and a width of the extended region in a direction parallel to a side opposed to the main body side through the end of the projecting portion is a second width, the first width is smaller than the second width. The second insulating substrate is sandwiched between the second wiring pattern and a base, and thereby, a capacitance is formed.

    摘要翻译: 第二布线图案包括从一对引线延伸的方向看,从主体侧到突出部分的延伸区域,以及布线区域沿远离主体的方向从延伸区域连续扩展。 假设从作为基准点的突出部分的端部到远离主体的方向上的最远位置的布线区域的长度是与平行于主体的一侧的方向上的延伸区域的第一宽度和宽度 通过突出部分的端部到主体侧是第二宽度,第一宽度小于第二宽度。 第二绝缘基板被夹在第二布线图案和基底之间,从而形成电容。

    OPTICAL MODULE
    5.
    发明申请
    OPTICAL MODULE 有权
    光学模块

    公开(公告)号:US20160365700A1

    公开(公告)日:2016-12-15

    申请号:US15171189

    申请日:2016-06-02

    IPC分类号: H01S5/022 H01S5/024

    摘要: An optical module includes: a wiring substrate that has a wiring pattern including a connecting portion and is arranged on an optical subassembly so as to be electrically connected thereto; and a flexible insulating layer formed between the optical subassembly and the wiring substrate. The optical subassembly includes: a conductive stem that has a surface opposed to the wiring substrate, the conductive stem being shaped so that the surface has a through hole opened therein and being connected to a reference potential; and a signal lead for transmitting a signal, the signal lead passing through the through hole while being electrically insulated from the conductive stem. The signal lead passes through the flexible insulating layer to be joined to the connecting portion. The flexible insulating layer is in contact with the connecting portion, the signal lead, and the surface of the conductive stem.

    摘要翻译: 光学模块包括:布线基板,其具有包括连接部分的布线图案,并布置在光学子组件上以与其电连接; 以及形成在所述光学子组件和所述布线基板之间的柔性绝缘层。 所述光学子组件包括:导电杆,其具有与所述布线基板相对的表面,所述导电杆被成形为使得所述表面具有在其中打开并连接到参考电位的通孔; 以及用于传输信号的信号引线,所述信号引线通过所述通孔,同时与所述导电杆电绝缘。 信号引线穿过柔性绝缘层以与连接部分接合。 柔性绝缘层与连接部分,信号引线和导电杆的表面接触。

    OPTICAL MODULE AND OPTICAL TRANSMISSION EQUIPMENT

    公开(公告)号:US20190069395A1

    公开(公告)日:2019-02-28

    申请号:US16111281

    申请日:2018-08-24

    IPC分类号: H05K1/02 H01R12/58 H05K1/11

    摘要: An optical module includes a conductor plate including a first through hole, a signal lead terminal fixed to the first through hole, and a wiring circuit board. The wiring circuit board includes a signal strip conductor member and a land on a first surface and a ground conductor layer and a second through hole on a second surface, the land surrounds the second through hole and is in contact with the signal strip conductor member, the signal lead terminal and the land are physically connected to each other through a solder and thus the signal lead terminal and the signal strip conductor member are electrically connected to each other, and at least a part of the land spreads outwardly, in a plan view, from not only a portion in contact with the signal strip conductor member but also an outer edge of the first through hole.

    OPTICAL MODULE
    7.
    发明申请
    OPTICAL MODULE 审中-公开

    公开(公告)号:US20170264074A1

    公开(公告)日:2017-09-14

    申请号:US15603864

    申请日:2017-05-24

    IPC分类号: H01S5/022 H01S5/062 H01S5/024

    摘要: An optical module includes: a wiring substrate that has a wiring pattern including a connecting portion and is arranged on an optical subassembly so as to be electrically connected thereto; and a flexible insulating layer formed between the optical subassembly and the wiring substrate. The optical subassembly includes: a conductive stem that has a surface opposed to the wiring substrate, the conductive stem being shaped so that the surface has a through hole opened therein and being connected to a reference potential; and a signal lead for transmitting a signal, the signal lead passing through the through hole while being electrically insulated from the conductive stem. The signal lead passes through the flexible insulating layer to be joined to the connecting portion. The flexible insulating layer is in contact with the connecting portion, the signal lead, and the surface of the conductive stem.

    OPTICAL MODULE
    8.
    发明申请

    公开(公告)号:US20170168255A1

    公开(公告)日:2017-06-15

    申请号:US15366008

    申请日:2016-12-01

    摘要: A plurality of leads include a pair of differential signal leads for inputting differential signals, and a power supply lead for supplying power. A wiring pattern includes a pair of differential transmission lines connected to the pair of differential signal leads, and a power supply wiring connected to the power supply lead. A wiring board includes a first region overlapping an optical subassembly, and a second region extending from the first region so as to protrude from the optical subassembly. The pair of differential signal leads are farther away from the second region than the power supply lead. The pair of differential transmission lines are close together so as to be electromagnetically coupled to each other. The optical subassembly does not include a lead penetrating the wiring board in a region between the pair of differential transmission lines.

    OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE
    9.
    发明申请
    OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE 有权
    光学模块和制造光学模块的方法

    公开(公告)号:US20160006210A1

    公开(公告)日:2016-01-07

    申请号:US14791782

    申请日:2015-07-06

    摘要: An optical module includes an optical semiconductor device and a stem including a lead terminal configured to perform at least one of transmitting an electric signal to the optical semiconductor device or transmitting an electric signal output from the optical semiconductor device. The optical module also includes a substrate having a ground layer, a first opening through which the lead terminal passes, and a connecting portion configured to electrically connect the stem and the ground layer. The connecting portion is formed on one of an edge portion of the substrate and a surface of the substrate on a side on which the substrate is arranged on the stem.

    摘要翻译: 光学模块包括光学半导体器件和杆,其包括引线端子,该引线端子被配置为执行向光学半导体器件发送电信号或发送从光学半导体器件输出的电信号中的至少一个。 光学模块还包括具有接地层的基板,引线端子穿过的第一开口以及被构造为电连接该杆和接地层的连接部分。 连接部形成在基板的边缘部分之一和基板的表面上,基板的表面布置在杆上。