公开(公告)号：US08193559B2

公开(公告)日：2012-06-05

申请号：US13081642

申请日：2011-04-07

申请人： Oliver Haeberlen ,  Walter Rieger ,  Martin Vielemeyer ,  Lutz Goergens ,  Martin Poelzl ,  Milko Paolucci ,  Johannes Schoiswohl ,  Joachim Krumrey ,  Sonja Krumrey, legal representative

发明人： Oliver Haeberlen ,  Walter Rieger ,  Martin Vielemeyer ,  Lutz Goergens ,  Martin Poelzl ,  Milko Paolucci ,  Johannes Schoiswohl ,  Joachim Krumrey

IPC分类号： H01L29/66

CPC分类号： H01L23/495 ,  H01L21/823418 ,  H01L21/823475 ,  H01L21/823487 ,  H01L21/823814 ,  H01L21/823871 ,  H01L21/823885 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L27/088 ,  H01L27/092 ,  H01L27/0922 ,  H01L28/40 ,  H01L29/04 ,  H01L29/0653 ,  H01L29/0856 ,  H01L29/407 ,  H01L29/41 ,  H01L29/41741 ,  H01L29/4175 ,  H01L29/41766 ,  H01L29/66734 ,  H01L29/7803 ,  H01L29/7806 ,  H01L29/7809 ,  H01L29/781 ,  H01L29/7811 ,  H01L29/7813 ,  H01L29/7827 ,  H01L29/7835 ,  H01L2224/40247 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/37099

摘要： One aspect is monolithic semiconductor switches and method for manufacturing. One embodiment provides a semiconductor die with a first n-type channel FET and a second n-type channel FET. A source of the first n-type channel FET and a drain of the second n-type channel FET are electrically coupled to at least one contact area at a first side of the semiconductor die, respectively. A drain of the first n-type channel FET, a gate of the first n-type channel FET, a source of the second n-type channel FET and the gate of the second n-type channel FET are electrically coupled to contact areas at a second side of the semiconductor die opposite to the first side, respectively. The contact areas of the drain of the first n-type channel FET, of the gate of the first n-type channel FET, of the source of the second n-type channel FET and of the gate of the second n-type channel FET are electrically separated from each other, respectively.

摘要翻译： 一个方面是单片半导体开关和制造方法。 一个实施例提供具有第一n型沟道FET和第二n型沟道FET的半导体管芯。 第一n型沟道FET的源极和第二n型沟道FET的漏极分别电耦合到半导体管芯的第一侧的至少一个接触区域。 第一n型沟道FET的漏极，第一n型沟道FET的栅极，第二n型沟道FET的源极和第二n型沟道FET的栅极电耦合到接触区域 半导体管芯的与第一侧相对的第二侧。 第一n型沟道FET的漏极，第一n型沟道FET的栅极，第二n型沟道FET的源极和第二n型沟道FET的栅极的接触面积 分别电分离。

公开(公告)号：US20110241170A1

公开(公告)日：2011-10-06

申请号：US13081642

申请日：2011-04-07

申请人： Oliver Haeberlen ,  Walter Rieger ,  Martin Vielemeyer ,  Lutz Goergens ,  Martin Poelzl ,  Milko Paolucci ,  Johannes Schoiswohl ,  Joachim Krumrey ,  Sonja Krumrey

发明人： Oliver Haeberlen ,  Walter Rieger ,  Martin Vielemeyer ,  Lutz Goergens ,  Martin Poelzl ,  Milko Paolucci ,  Johannes Schoiswohl ,  Joachim Krumrey ,  Sonja Krumrey

IPC分类号： H01L29/92 ,  H01L23/48

CPC分类号： H01L23/495 ,  H01L21/823418 ,  H01L21/823475 ,  H01L21/823487 ,  H01L21/823814 ,  H01L21/823871 ,  H01L21/823885 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L27/088 ,  H01L27/092 ,  H01L27/0922 ,  H01L28/40 ,  H01L29/04 ,  H01L29/0653 ,  H01L29/0856 ,  H01L29/407 ,  H01L29/41 ,  H01L29/41741 ,  H01L29/4175 ,  H01L29/41766 ,  H01L29/66734 ,  H01L29/7803 ,  H01L29/7806 ,  H01L29/7809 ,  H01L29/781 ,  H01L29/7811 ,  H01L29/7813 ,  H01L29/7827 ,  H01L29/7835 ,  H01L2224/40247 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/37099

摘要： One aspect is monolithic semiconductor switches and method for manufacturing. One embodiment provides a semiconductor die with a first n-type channel FET and a second n-type channel FET. A source of the first n-type channel FET and a drain of the second n-type channel FET are electrically coupled to at least one contact area at a first side of the semiconductor die, respectively. A drain of the first n-type channel FET, a gate of the first n-type channel FET, a source of the second n-type channel FET and the gate of the second n-type channel FET are electrically coupled to contact areas at a second side of the semiconductor die opposite to the first side, respectively. The contact areas of the drain of the first n-type channel FET, of the gate of the first n-type channel FET, of the source of the second n-type channel FET and of the gate of the second n-type channel FET are electrically separated from each other, respectively.

摘要翻译： 一个方面是单片半导体开关和制造方法。 一个实施例提供具有第一n型沟道FET和第二n型沟道FET的半导体管芯。 第一n型沟道FET的源极和第二n型沟道FET的漏极分别电耦合到半导体管芯的第一侧的至少一个接触区域。 第一n型沟道FET的漏极，第一n型沟道FET的栅极，第二n型沟道FET的源极和第二n型沟道FET的栅极电耦合到接触区域 半导体管芯的与第一侧相对的第二侧。 第一n型沟道FET的漏极，第一n型沟道FET的栅极，第二n型沟道FET的源极和第二n型沟道FET的栅极的接触面积 分别电分离。

公开(公告)号：US08946767B2

公开(公告)日：2015-02-03

申请号：US13487999

申请日：2012-06-04

申请人： Oliver Haeberlen ,  Walter Rieger ,  Martin Vielemeyer ,  Lutz Goergens ,  Martin Poelzl ,  Milko Paolucci ,  Johannes Schoiswohl ,  Sonja Krumrey

发明人： Oliver Haeberlen ,  Walter Rieger ,  Martin Vielemeyer ,  Lutz Goergens ,  Martin Poelzl ,  Milko Paolucci ,  Johannes Schoiswohl ,  Joachim Krumrey

IPC分类号： H01L29/66 ,  H01L29/417 ,  H01L29/78 ,  H01L21/8238 ,  H01L49/02 ,  H01L23/492 ,  H01L23/00 ,  H01L23/495 ,  H01L27/092 ,  H01L27/088 ,  H01L21/8234 ,  H01L29/08 ,  H01L29/41 ,  H01L29/06 ,  H01L29/04 ,  H01L29/40

CPC分类号： H01L23/495 ,  H01L21/823418 ,  H01L21/823475 ,  H01L21/823487 ,  H01L21/823814 ,  H01L21/823871 ,  H01L21/823885 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L27/088 ,  H01L27/092 ,  H01L27/0922 ,  H01L28/40 ,  H01L29/04 ,  H01L29/0653 ,  H01L29/0856 ,  H01L29/407 ,  H01L29/41 ,  H01L29/41741 ,  H01L29/4175 ,  H01L29/41766 ,  H01L29/66734 ,  H01L29/7803 ,  H01L29/7806 ,  H01L29/7809 ,  H01L29/781 ,  H01L29/7811 ,  H01L29/7813 ,  H01L29/7827 ,  H01L29/7835 ,  H01L2224/40247 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/37099

摘要： A semiconductor device and method are disclosed. One embodiment provides a semiconductor die with a first n-type channel FET and a second n-type channel FET. A source of the first n-type channel FET and a drain of the second n-type channel FET are electrically coupled to at least one contact area at a first side. A drain of the first n-type channel FET, a gate of the first n-type channel FET, a source of the second n-type channel FET and the gate of the second n-type channel FET are electrically coupled to contact areas at a second side. Contact areas of the first n-type channel FET and the second n-type channel FET are electrically separated from each other.

摘要翻译： 公开了半导体器件和方法。 一个实施例提供具有第一n型沟道FET和第二n型沟道FET的半导体管芯。 第一n型沟道FET的源极和第二n型沟道FET的漏极电耦合到第一侧的至少一个接触区域。 第一n型沟道FET的漏极，第一n型沟道FET的栅极，第二n型沟道FET的源极和第二n型沟道FET的栅极电耦合到接触区域 第二面。 第一n型沟道FET和第二n型沟道FET的接触区域彼此电分离。

公开(公告)号：US20130140673A1

公开(公告)日：2013-06-06

申请号：US13487999

申请日：2012-06-04

申请人： Oliver Haeberlen ,  Walter Rieger ,  Martin Vielemeyer ,  Lutz Goergens ,  Martin Poelzl ,  Milko Paolucci ,  Johannes Schoiswohl ,  Joachim Krumrey

发明人： Oliver Haeberlen ,  Walter Rieger ,  Martin Vielemeyer ,  Lutz Goergens ,  Martin Poelzl ,  Milko Paolucci ,  Johannes Schoiswohl ,  Joachim Krumrey

IPC分类号： H01L23/495

CPC分类号： H01L23/495 ,  H01L21/823418 ,  H01L21/823475 ,  H01L21/823487 ,  H01L21/823814 ,  H01L21/823871 ,  H01L21/823885 ,  H01L23/492 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L27/088 ,  H01L27/092 ,  H01L27/0922 ,  H01L28/40 ,  H01L29/04 ,  H01L29/0653 ,  H01L29/0856 ,  H01L29/407 ,  H01L29/41 ,  H01L29/41741 ,  H01L29/4175 ,  H01L29/41766 ,  H01L29/66734 ,  H01L29/7803 ,  H01L29/7806 ,  H01L29/7809 ,  H01L29/781 ,  H01L29/7811 ,  H01L29/7813 ,  H01L29/7827 ,  H01L29/7835 ,  H01L2224/40247 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/37099

摘要： A semiconductor device and method are disclosed. One embodiment provides a semiconductor die with a first n-type channel FET and a second n-type channel FET. A source of the first n-type channel FET and a drain of the second n-type channel FET are electrically coupled to at least one contact area at a first side. A drain of the first n-type channel FET, a gate of the first n-type channel FET, a source of the second n-type channel FET and the gate of the second n-type channel FET are electrically coupled to contact areas at a second side. Contact areas of the first n-type channel FET and the second n-type channel FET are electrically separated from each other.

摘要翻译： 公开了半导体器件和方法。 一个实施例提供具有第一n型沟道FET和第二n型沟道FET的半导体管芯。 第一n型沟道FET的源极和第二n型沟道FET的漏极电耦合到第一侧的至少一个接触区域。 第一n型沟道FET的漏极，第一n型沟道FET的栅极，第二n型沟道FET的源极和第二n型沟道FET的栅极电耦合到接触区域 第二面。 第一n型沟道FET和第二n型沟道FET的接触区域彼此电分离。

公开(公告)号：US20140167069A1

公开(公告)日：2014-06-19

申请号：US13718775

申请日：2012-12-18

申请人： Martin Vielemeyer ,  Sylvain Leomant ,  Milko Paolucci ,  Martin Poelzl

发明人： Martin Vielemeyer ,  Sylvain Leomant ,  Milko Paolucci ,  Martin Poelzl

IPC分类号： H01L27/06 ,  H01L21/8234

CPC分类号： H01L27/0629 ,  H01L21/38 ,  H01L21/385 ,  H01L21/8234 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L27/0676 ,  H01L27/0705 ,  H01L27/0711 ,  H01L2924/0002 ,  H03K17/6871 ,  H01L2924/00

摘要： Embodiments relate to bootstrap circuits integrated with at least one other device, such as a power transistor or other semiconductor device. In embodiments, the bootstrap circuit can comprise a bootstrap capacitor and a bootstrap diode, or the bootstrap circuit can comprise a bootstrap capacitor and a bootstrap transistor. The bootstrap capacitor comprises a semiconductor-based capacitor, as opposed to an electrolytic, ceramic or other capacitor, in embodiments. The integration of the bootstrap circuit with another circuit or device, such as a power transistor device in one embodiment, is at a silicon-level in embodiments, rather than as a module-like system-in-package of conventional approaches. In other words, the combination of the bootstrap circuit elements and power transistor or other device forms a system-on-silicon, or an integrated circuit, in embodiments, and additionally can be arranged in a single package.

摘要翻译： 实施例涉及与诸如功率晶体管或其它半导体器件的至少一个其它器件集成的自举电路。 在实施例中，自举电路可以包括自举电容器和自举二极管，或者自举电路可以包括自举电容器和自举晶体管。 在实施例中，自举电容器包括与电解，陶瓷或其它电容器相对的基于半导体的电容器。 在一个实施例中，自举电路与另一电路或器件（例如功率晶体管器件）的集成在实施例中处于硅级，而不是作为常规方法的模块化系统级封装。 换句话说，在实施例中，自举电路元件和功率晶体管或其它器件的组合形成硅系统或集成电路，并且另外可以被布置在单个封装中。

公开(公告)号：US09276097B2

公开(公告)日：2016-03-01

申请号：US13435447

申请日：2012-03-30

申请人： Martin Vielemeyer ,  Michael Hutzler ,  Gilberto Curatola ,  Gianmauro Pozzovivo

发明人： Martin Vielemeyer ,  Michael Hutzler ,  Gilberto Curatola ,  Gianmauro Pozzovivo

IPC分类号： H01L29/778 ,  H01L29/861 ,  H01L27/02 ,  H01L29/16 ,  H01L29/20

CPC分类号： H01L27/0248 ,  H01L28/20 ,  H01L29/0653 ,  H01L29/0891 ,  H01L29/1608 ,  H01L29/165 ,  H01L29/2003 ,  H01L29/41766 ,  H01L29/778 ,  H01L29/7786 ,  H01L29/7787 ,  H01L29/861

摘要： A transistor device includes a compound semiconductor body, a drain disposed in the compound semiconductor body and a source disposed in the compound semiconductor body and spaced apart from the drain by a channel region. A gate is provided for controlling the channel region. The transistor device further includes a gate overvoltage protection device connected between the source and the gate, the gate overvoltage protection device including p-type and n-type silicon-containing semiconductor material.

摘要翻译： 晶体管器件包括化合物半导体本体，设置在化合物半导体本体中的漏极和设置在化合物半导体本体中并且通过沟道区与漏极间隔开的源极。 提供用于控制通道区域的门。 晶体管器件还包括连接在源极和栅极之间的栅极过电压保护器件，栅极过电压保护器件包括p型和n型含硅半导体材料。

公开(公告)号：US20130256699A1

公开(公告)日：2013-10-03

申请号：US13435447

申请日：2012-03-30

申请人： Martin Vielemeyer ,  Michael Hutzler ,  Gilberto Curatola ,  Gianmauro Pozzovivo

发明人： Martin Vielemeyer ,  Michael Hutzler ,  Gilberto Curatola ,  Gianmauro Pozzovivo

IPC分类号： H01L29/778 ,  H01L29/20 ,  H01L29/16

CPC分类号： H01L27/0248 ,  H01L28/20 ,  H01L29/0653 ,  H01L29/0891 ,  H01L29/1608 ,  H01L29/165 ,  H01L29/2003 ,  H01L29/41766 ,  H01L29/778 ,  H01L29/7786 ,  H01L29/7787 ,  H01L29/861

摘要： A transistor device includes a compound semiconductor body, a drain disposed in the compound semiconductor body and a source disposed in the compound semiconductor body and spaced apart from the drain by a channel region. A gate is provided for controlling the channel region. The transistor device further includes a gate overvoltage protection device connected between the source and the gate, the gate overvoltage protection device including p-type and n-type silicon-containing semiconductor material.

摘要翻译： 晶体管器件包括化合物半导体本体，设置在化合物半导体本体中的漏极和设置在化合物半导体本体中并且通过沟道区与漏极间隔开的源极。 提供用于控制通道区域的门。 晶体管器件还包括连接在源极和栅极之间的栅极过电压保护器件，栅极过电压保护器件包括p型和n型含硅半导体材料。