公开(公告)号：US08201329B2

公开(公告)日：2012-06-19

申请号：US12792812

申请日：2010-06-03

申请人： Osamu Nakamura ,  Kyosuke Ito

发明人： Osamu Nakamura ,  Kyosuke Ito

IPC分类号： H01R43/00 ,  H05K13/00 ,  H01L21/00 ,  H01L21/64

CPC分类号： H05K13/0478 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05548 ,  H01L2224/05572 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15788 ,  Y10T29/41 ,  Y10T29/49018 ,  Y10T29/4913 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/05599

摘要： The manufacturing apparatus of a semiconductor device includes a jig having a plurality of holders arranged in a row, a controller for controlling the pitch of the plurality of holders arranged in a row, a support means provided with a plurality of semiconductor integrated circuits, and a support means provided with a substrate having a plurality of elements. By mounting the semiconductor integrated circuits on the respective elements by using the jig having the plurality of holders arranged in a row, semiconductor devices are manufactured.

摘要翻译： 半导体器件的制造装置包括：具有排列成一列的多个保持器的夹具，用于控制排列成一列的多个保持器的间距的控制器，设置有多个半导体集成电路的支撑装置，以及 支撑装置设置有具有多个元件的基板。 通过使用具有排成行的多个保持器的夹具将半导体集成电路安装在各个元件上，制造半导体器件。

公开(公告)号：US07727809B2

公开(公告)日：2010-06-01

申请号：US11798979

申请日：2007-05-18

申请人： Kyosuke Ito ,  Osamu Nakamura ,  Yukie Suzuki

发明人： Kyosuke Ito ,  Osamu Nakamura ,  Yukie Suzuki

IPC分类号： H01L21/00

CPC分类号： H01L23/4985 ,  G06K19/07718 ,  H01L21/6835 ,  H01L23/49855 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： The invention proposes a method and an apparatus for attaching a plurality of components having different arrangement densities or arrangement intervals, which can achieve shorter takt time. An object is to provide a low-cost manufacturing method of a semiconductor device and a manufacturing apparatus capable of manufacturing a semiconductor device at low cost. Plural pairs of components having different arrangement densities are simultaneously attached to each other by temporarily attaching first components to a first flexible substrate while changing an arrangement interval in an X direction, and then connecting the first components to second components over a second flexible substrate while changing an arrangement interval of the first components in a Y direction.

摘要翻译： 本发明提出了一种用于安装具有不同布置密度或排列间隔的多个部件的方法和装置，其可以实现更短的打印时间。 本发明的目的是提供一种能够以低成本制造半导体器件的半导体器件和制造装置的低成本制造方法。 具有不同排列密度的多组成分通过将第一组分暂时地附着到第一柔性衬底上同时附着，同时改变X方向上的排列间隔，然后在第二柔性衬底上将第一组分连接到第二组分上，同时改变 Y方向上的第一分量的排列间隔。

公开(公告)号：US20070183184A1

公开(公告)日：2007-08-09

申请号：US11655173

申请日：2007-01-19

申请人： Osamu Nakamura ,  Kyosuke Ito

发明人： Osamu Nakamura ,  Kyosuke Ito

IPC分类号： G11C11/24

CPC分类号： H05K13/0478 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05548 ,  H01L2224/05572 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15788 ,  Y10T29/49018 ,  Y10T29/4913 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/05599

摘要： The manufacturing apparatus of a semiconductor device includes a jig having a plurality of holders arranged in a row, a controller for controlling the pitch of the plurality of holders arranged in a row, a support means provided with a plurality of semiconductor integrated circuits, and a support means provided with a substrate having a plurality of elements. By mounting the semiconductor integrated circuits on the respective elements by using the jig having the plurality of holders arranged in a row, semiconductor devices are manufactured.

摘要翻译： 半导体器件的制造装置包括：具有排列成一列的多个保持器的夹具，用于控制排列成一列的多个保持器的间距的控制器，设置有多个半导体集成电路的支撑装置，以及 支撑装置设置有具有多个元件的基板。 通过使用具有排成行的多个保持器的夹具将半导体集成电路安装在各个元件上，制造半导体器件。

公开(公告)号：US20070281391A1

公开(公告)日：2007-12-06

申请号：US11798979

申请日：2007-05-18

申请人： Kyosuke Ito ,  Osamu Nakamura ,  Yukie Suzuki

发明人： Kyosuke Ito ,  Osamu Nakamura ,  Yukie Suzuki

IPC分类号： H01L21/00

CPC分类号： H01L23/4985 ,  G06K19/07718 ,  H01L21/6835 ,  H01L23/49855 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： The invention proposes a method and an apparatus for attaching a plurality of components having different arrangement densities or arrangement intervals, which can achieve shorter takt time. An object is to provide a low-cost manufacturing method of a semiconductor device and a manufacturing apparatus capable of manufacturing a semiconductor device at low cost. Plural pairs of components having different arrangement densities are simultaneously attached to each other by temporarily attaching first components to a first flexible substrate while changing an arrangement interval in an X direction, and then connecting the first components to second components over a second flexible substrate while changing an arrangement interval of the first components in a Y direction.

摘要翻译： 本发明提出了一种用于安装具有不同布置密度或排列间隔的多个部件的方法和装置，其可以实现更短的打印时间。 本发明的目的是提供一种能够以低成本制造半导体器件的半导体器件和制造装置的低成本制造方法。 具有不同排列密度的多组成分通过将第一组分暂时地附着到第一柔性衬底上同时附着，同时改变X方向上的排列间隔，然后在第二柔性衬底上将第一组分连接到第二组分上，同时改变 Y方向上的第一分量的排列间隔。

公开(公告)号：US08508027B2

公开(公告)日：2013-08-13

申请号：US12555832

申请日：2009-09-09

申请人： Hidekazu Takahashi ,  Daiki Yamada ,  Kyosuke Ito ,  Eiji Sugiyama ,  Yoshitaka Dozen

发明人： Hidekazu Takahashi ,  Daiki Yamada ,  Kyosuke Ito ,  Eiji Sugiyama ,  Yoshitaka Dozen

IPC分类号： H01L23/552

CPC分类号： H01L23/66 ,  H01L23/49855 ,  H01L2924/0002 ,  H01L2924/00

摘要： The semiconductor device of the invention includes a transistor, an insulating layer provided over the transistor, a first conductive layer (corresponding to a source wire or a drain wire) electrically connected to a source region or a drain region of the transistor through an opening portion provided in the insulating layer, a first resin layer provided over the insulating layer and the first conductive layer, a layer containing conductive particles which is electrically connected to the first conductive layer through an opening portion provided in the first resin layer, and a substrate provided with a second resin layer and a second conductive layer serving as an antenna. In the semiconductor device having the above-described structure, the second conductive layer is electrically connected to the first conductive layer with the layer containing conductive particles interposed therebetween. In addition, the second resin layer is provided over the first resin layer.

公开(公告)号：US07125137B2

公开(公告)日：2006-10-24

申请号：US10856532

申请日：2004-05-28

申请人： Shigemasa Kitajima ,  Shinobu Takahashi ,  Kyosuke Ito

发明人： Shigemasa Kitajima ,  Shinobu Takahashi ,  Kyosuke Ito

IPC分类号： F21S8/00

CPC分类号： G02B6/0055 ,  E04F2290/026 ,  F21S8/032 ,  F21S10/02 ,  F21V2200/20 ,  F21Y2105/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/0068 ,  G02B6/0078 ,  G02B6/0083 ,  G02B6/0086 ,  Y10S362/80

摘要： A surface light-emitting unit installed on a floor or wall of a structure is able to emit light from its surface for unique illumination effects. A surface light-emitting unit includes a transparent glass plate that can transmit light; a light-conducting plate installed below the glass plate; a light-emitting means having multiple light-emitting diodes of different colors and installed on the side face of the light-conducting plate; a light-diffusing/reflecting member installed below the light-conducting plate that diffuses and reflects the light; an emission-color selection means for selecting the light-emitting diode to be illuminated or blinked; a casing for providing the transparent glass plate at the top opening; a casing for installing above components; and a connection part that can be connected to other surface light-emitting unit installed adjacently.

摘要翻译： 安装在结构的地板或墙壁上的表面发光单元能够从其表面发光以获得独特的照明效果。 表面发光单元包括可透射光的透明玻璃板; 安装在玻璃板下方的导光板; 具有多个不同颜色的发光二极管并且安装在导光板的侧面上的发光装置; 设置在所述导光板的下方扩散并反射光的光扩散/反射部件; 发光颜色选择装置，用于选择要被点亮或闪烁的发光二极管; 用于在顶部开口处提供透明玻璃板的壳体; 用于安装上述部件的外壳; 以及可以与其他表面发光单元相邻连接的连接部。

公开(公告)号：US09559129B2

公开(公告)日：2017-01-31

申请号：US13468354

申请日：2012-05-10

申请人： Kyosuke Ito ,  Junya Maruyama ,  Takuya Tsurume ,  Shunpei Yamazaki

发明人： Kyosuke Ito ,  Junya Maruyama ,  Takuya Tsurume ,  Shunpei Yamazaki

IPC分类号： H01L27/13 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01L27/12

CPC分类号： H01L27/1266 ,  G06K19/07749 ,  H01L27/1214 ,  H01L27/13 ,  H01L2224/95001 ,  H01Q1/2225 ,  H01Q7/00 ,  Y10T29/49018

摘要： The present invention provides an antenna in that the adhesive intensity of a conductive body formed on a base film is increased, and a semiconductor device including the antenna. The invention further provides a semiconductor device with high reliability that is formed by attaching an element formation layer and an antenna, wherein the element formation layer is not damaged due to a structure of the antenna. The semiconductor device includes the element formation layer provided over a substrate and the antenna provided over the element formation layer. The element formation layer and the antenna are electrically connected. The antenna has a base film and a conductive body, wherein at least a part of the conductive body is embedded in the base film. As a method for embedding the conductive body in the base film, a depression is formed in the base film and the conductive body is formed therein.

摘要翻译： 本发明提供了一种天线，其特征在于，形成在基膜上的导电体的粘合强度增加，并且包括该天线的半导体器件。 本发明还提供一种通过附着元件形成层和天线形成的具有高可靠性的半导体器件，其中元件形成层由于天线的结构而不被损坏。 半导体器件包括设置在衬底上的元件形成层和设置在元件形成层上的天线。 元件形成层和天线电连接。 天线具有基膜和导电体，其中导电体的至少一部分嵌入基膜中。 作为将导电体嵌入基膜中的方法，在基膜中形成凹部，在其中形成导电体。

公开(公告)号：US08951664B2

公开(公告)日：2015-02-10

申请号：US13479582

申请日：2012-05-24

申请人： Kyosuke Ito ,  Toru Itakura

发明人： Kyosuke Ito ,  Toru Itakura

IPC分类号： H01M6/04 ,  C07D207/06 ,  H01M10/052 ,  H01M10/0569 ,  H01G11/62 ,  C07C309/06 ,  C07C311/48 ,  H01G11/06

CPC分类号： H01M10/0569 ,  C07C309/06 ,  C07C311/48 ,  C07D207/06 ,  H01G11/04 ,  H01G11/06 ,  H01G11/52 ,  H01G11/60 ,  H01G11/62 ,  H01M10/052 ,  H01M10/0525 ,  H01M2220/20 ,  H01M2220/30 ,  H01M2300/0017 ,  H01M2300/0028 ,  H01M2300/0045 ,  Y02E60/122 ,  Y02E60/13 ,  Y02T10/7011 ,  Y02T10/7022

摘要： An ionic liquid having high electrochemical stability and a low melting point. An ionic liquid represented by the following general formula (G0) is provided. In the general formula (G0), R0 to R5 are individually any of an alkyl group having 1 to 20 carbon atoms, a methoxy group, a methoxymethyl group, a methoxyethyl group, and a hydrogen atom, and A− is a univalent imide-based anion, a univalent methide-based anion, a perfluoroalkyl sulfonic acid anion, tetrafluoroborate, or hexafluorophosphate.

公开(公告)号：US08477477B2

公开(公告)日：2013-07-02

申请号：US12890867

申请日：2010-09-27

申请人： Kyosuke Ito ,  Kiyofumi Ogino

发明人： Kyosuke Ito ,  Kiyofumi Ogino

IPC分类号： H01G9/00

CPC分类号： H01G9/035

摘要： To provide an electrolyte easily manufactured at low cost, and a power storage device including such an electrolyte. The power storage device includes a positive electrode having a positive electrode current collector and a positive electrode active material, a negative electrode having a negative electrode current collector and a negative electrode active material, and an electrolyte having 1-piperidine-1-propanesulfonic acid or 1-piperidine-1-butanesulfonic acid, which is provided between the positive electrode and the negative electrode. The capacitance can be increased when water is added to the obtained electrolyte and the temperature of the power storage device rises.

摘要翻译： 提供以低成本容易制造的电解质，以及包括这种电解质的蓄电装置。 蓄电装置包括具有正极集电体和正极活性物质的正极，具有负极集电体的负极和负极活性物质，以及具有1-哌啶-1-丙磺酸的电解质或 设置在正极和负极之间的1-哌啶-1-丁磺酸。 当将水添加到所获得的电解质中并且蓄电装置的温度升高时，电容可以增加。

公开(公告)号：US20060267204A1

公开(公告)日：2006-11-30

申请号：US11436090

申请日：2006-05-18

申请人： Hidekazu Takahashi ,  Daiki Yamada ,  Kyosuke Ito ,  Eiji Sugiyama ,  Yoshitaka Dozen

发明人： Hidekazu Takahashi ,  Daiki Yamada ,  Kyosuke Ito ,  Eiji Sugiyama ,  Yoshitaka Dozen

IPC分类号： H01L23/48

CPC分类号： H01L23/66 ,  H01L23/49855 ,  H01L2924/0002 ,  H01L2924/00

摘要： The semiconductor device of the invention includes a transistor, an insulating layer provided over the transistor, a first conductive layer (corresponding to a source wire or a drain wire) electrically connected to a source region or a drain region of the transistor through an opening portion provided in the insulating layer, a first resin layer provided over the insulating layer and the first conductive layer, a layer containing conductive particles which is electrically connected to the first conductive layer through an opening portion provided in the first resin layer, and a substrate provided with a second resin layer and a second conductive layer serving as an antenna. In the semiconductor device having the above-described structure, the second conductive layer is electrically connected to the first conductive layer with the layer containing conductive particles interposed therebetween. In addition, the second resin layer is provided over the first resin layer.