METHOD FOR MANUFACTURING PHOTOSEMICONDUCTOR, PHOTOSEMICONDUCTOR AND HYDROGEN PRODUCTION DEVICE

    公开(公告)号:US20190040536A1

    公开(公告)日:2019-02-07

    申请号:US16044416

    申请日:2018-07-24

    Abstract: The method for manufacturing a photosemiconductor according to the present disclosure includes treating a metal base material containing at least one kind of transition metal with a plasma under a pressure lower than atmospheric pressure and at a temperature lower than a volatilization temperature of the transition metal under an atmosphere at the pressure to provide the photosemiconductor containing the transition metal and a nitrogen element from at least a part of the metal base material. Here, the plasma is generated by applying a high-frequency voltage at a frequency in a range of not less than 30 MHz and not more than 300 MHz to a gas between a first electrode and a second electrode, and the gas is any one of: (i) a nitrogen gas; (ii) a gaseous mixture consisting of a nitrogen gas and an oxygen gas; (iii) a gaseous mixture consisting of a nitrogen gas and a rare gas; and (iv) a gaseous mixture consisting of a nitrogen gas, an oxygen gas, and a rare gas.

    NONVOLATILE STORAGE DEVICE AND METHOD OF PRODUCING THE DEVICE
    7.
    发明申请
    NONVOLATILE STORAGE DEVICE AND METHOD OF PRODUCING THE DEVICE 审中-公开
    非易失存储器件及其制造方法

    公开(公告)号:US20150364681A1

    公开(公告)日:2015-12-17

    申请号:US14726637

    申请日:2015-06-01

    Abstract: A nonvolatile storage device includes a first conductive layer disposed on a substrate, a contact plug including a conductive material and disposed on the first conductive layer, a variable resistance element covering the upper surface of the contact plug, resistance of the variable resistance element changing in accordance with an voltage applied to the variable resistance element, one single insulating layer that is directly or indirectly in contact with a sidewall of the contact plug and that is directly or indirectly in contact with a sidewall of the variable resistance element, and a second conductive layer disposed on the variable resistance element.

    Abstract translation: 非易失性存储装置包括设置在基板上的第一导电层,包括导电材料并设置在第一导电层上的接触插塞,覆盖接触插塞的上表面的可变电阻元件,可变电阻元件的电阻变化 根据施加到可变电阻元件的电压,直接或间接地与接触插塞的侧壁接触并直接或间接与可变电阻元件的侧壁接触的单个绝缘层,以及第二导电 层设置在可变电阻元件上。

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