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    Apparatus and methods for cooling semiconductor integrated circuit chip packages
    3.
    发明申请
    Apparatus and methods for cooling semiconductor integrated circuit chip packages 审中-公开
    用于冷却半导体集成电路芯片封装的装置和方法

    公开(公告)号：US20060180924A1

    公开(公告)日：2006-08-17

    申请号：US11393324

    申请日：2006-03-30

    申请人： Paul Andry ,  Evan Colgan

    发明人： Paul Andry ,  Evan Colgan

    IPC分类号： H01L23/34

    CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2224/0401

    摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.

    摘要翻译： 提供了用于将微通道冷却模块集成在包括多个高性能IC芯片的高密度电子模块（例如，芯片封装，系统级封装模块等）中的装置和方法。 电子模块被设计成使得高性能（大功率）IC芯片被布置成靠近集成冷却模块（或冷却板）以有效地提取热量。 此外，包括具有多个芯片面的大表面积硅载体的电子模块被设计成使得集成的硅冷却模块刚性地结合到这种芯片的背面以增加硅载体的结构完整性。

    Method and apparatus for providing optoelectronic communication with an electronic device
    5.
    发明申请
    Method and apparatus for providing optoelectronic communication with an electronic device 有权
    用于与电子设备进行光电通信的方法和设备

    公开(公告)号：US20050025434A1

    公开(公告)日：2005-02-03

    申请号：US10631933

    申请日：2003-07-31

    申请人： Alan Benner ,  Evan Colgan ,  How Lin ,  John Magerlein ,  Frank Pompeo ,  Subhash Shinde ,  Daniel Stigliani

    发明人： Alan Benner ,  Evan Colgan ,  How Lin ,  John Magerlein ,  Frank Pompeo ,  Subhash Shinde ,  Daniel Stigliani

    IPC分类号： G02B6/36 ,  G02B6/42 ,  G06F1/20 ,  G06F3/00

    CPC分类号： G02B6/4201 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4268 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

    摘要： An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.

    摘要翻译： 用于计算机系统的光电组件包括电子芯片，基板，电信号介质，光电转换器和光耦合引导件。 电子芯片与基板通信，该基板与电信号介质的第一端连通。 电信令介质的第二端与光电换能器通信，并且包括用于使光信号介质与光电换能器对准的光耦合引导件。 来自电子芯片的电信号通过衬底和电信令介质传送到光电换能器。 光学传感器和电子芯片共享共同的散热器，并且完成与其他电子芯片组的通信，而不需要通过第二级电气封装进行通信。

    Devices and methods for side-coupling optical fibers to optoelectronic components
    10.
    发明申请
    Devices and methods for side-coupling optical fibers to optoelectronic components 失效
    将光纤侧耦合到光电子部件的装置和方法

    公开(公告)号：US20070014527A1

    公开(公告)日：2007-01-18

    申请号：US11524597

    申请日：2006-09-21

    申请人： Evan Colgan ,  Fuad Doany ,  Bruce Furman ,  Daniel Stigliani

    发明人： Evan Colgan ,  Fuad Doany ,  Bruce Furman ,  Daniel Stigliani

    IPC分类号： G02B6/00

    CPC分类号： G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/423

    摘要： Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

    摘要翻译： 用于安装光纤的光学装置，部件和方法以及用于使用改进的硅V形槽或光纤V沟槽阵列将光耦合到光纤的光纤，其中V形槽被设计用于精确对准/间隔光学 纤维在硅的表面下“凹进”。 光纤可以在硅衬底的表面下方凹入，从而可以去除（重叠）在硅表面之上延伸的覆层的精确控制部分。 当去除包覆层时，可以减小光纤芯和光电子器件之间的分离，从而当光纤硅阵列连接到例如VCSEL阵列时改善光耦合。