Microarchitecture control for thermoelectric cooling
    1.
    发明授权
    Microarchitecture control for thermoelectric cooling 有权
    微结构控制用于热电冷却

    公开(公告)号:US08209989B2

    公开(公告)日:2012-07-03

    申请号:US11694788

    申请日:2007-03-30

    IPC分类号: F25B21/02

    摘要: An integrated circuit is cooled by microarchitecture controlled Peltier effect cooling. In one embodiment, a temperature sensor thermally coupled to at least a portion of the integrated circuit of a die is adapted to provide an output as a function of the temperature of an integrated circuit portion. Operation of a thermoelectric cooler thermally coupled to the integrated circuit portion is controlled as a function of the sensor output, wherein a controller of the integrated circuit controls the thermal electric cooler. Other embodiments are described and claimed.

    摘要翻译: 集成电路通过微架构控制的Peltier效应冷却来冷却。 在一个实施例中,热耦合到管芯的集成电路的至少一部分的温度传感器适于提供作为集成电路部分的温度的函数的输出。 热耦合到集成电路部分的热电冷却器的操作作为传感器输出的函数被控制,其中集成电路的控制器控制热电冷却器。 描述和要求保护其他实施例。

    MICROARCHITECTURE CONTROLLER FOR THIN-FILM THERMOELECTRIC COOLING
    3.
    发明申请
    MICROARCHITECTURE CONTROLLER FOR THIN-FILM THERMOELECTRIC COOLING 有权
    薄膜热电冷却微晶控制器

    公开(公告)号:US20080310099A1

    公开(公告)日:2008-12-18

    申请号:US11764412

    申请日:2007-06-18

    IPC分类号: H05K7/20

    摘要: A device having multiple cores executes an algorithm to control Thin-Film Thermoelectric Coolers (TFTEC) that employ the Peltier effect to remove heat from the various cores of the multi-core processor. The algorithms may combine Thread Migration (TM) and Dynamic Voltage/Frequency Scaling (DVFS) to provide Dynamic Thermal Management (DTM) and TFTEC control.

    摘要翻译: 具有多个核的装置执行一种算法来控制采用珀尔帖效应的薄膜热电冷却器(TFTEC),以从多核处理器的各种核心去除热量。 这些算法可以组合线程迁移(TM)和动态电压/频率缩放(DVFS)来提供动态热管理(DTM)和TFTEC控制。

    MICROARCHITECTURE CONTROL FOR THERMOELECTRIC COOLING
    7.
    发明申请
    MICROARCHITECTURE CONTROL FOR THERMOELECTRIC COOLING 有权
    热电冷却微观控制

    公开(公告)号:US20080236175A1

    公开(公告)日:2008-10-02

    申请号:US11694788

    申请日:2007-03-30

    IPC分类号: F25B21/02 H01L23/34

    摘要: An integrated circuit is cooled by microarchitecture controlled Peltier effect cooling. In one embodiment, a temperature sensor thermally coupled to at least a portion of the integrated circuit of a die is adapted to provide an output as a function of the temperature of an integrated circuit portion. Operation of a thermoelectric cooler thermally coupled to the integrated circuit portion is controlled as a function of the sensor output, wherein a controller of the integrated circuit controls the thermal electric cooler. Other embodiments are described and claimed.

    摘要翻译: 集成电路通过微架构控制的Peltier效应冷却来冷却。 在一个实施例中,热耦合到管芯的集成电路的至少一部分的温度传感器适于提供作为集成电路部分的温度的函数的输出。 热耦合到集成电路部分的热电冷却器的操作作为传感器输出的函数被控制,其中集成电路的控制器控制热电冷却器。 描述和要求保护其他实施例。