公开(公告)号：US11488865B2

公开(公告)日：2022-11-01

申请号：US16381913

申请日：2019-04-11

申请人： Plasma-Therm LLC

发明人： Linnell Martinez ,  David Pays-Volard ,  Chris Johnson ,  David Johnson ,  Russell Westerman ,  Gordon M. Grivna

IPC分类号： H01L21/78 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  H01L21/02 ,  H01L21/66

摘要： The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

公开(公告)号：US20170033008A1

公开(公告)日：2017-02-02

申请号：US15287501

申请日：2016-10-06

申请人： Plasma-Therm LLC

发明人： Linnell Martinez ,  David Pays-Volard ,  Chris Johnson ,  David Johnson ,  Russell Westerman ,  Gordon M. Grivna

IPC分类号： H01L21/78 ,  H01L21/66 ,  H01L21/3065 ,  H01L21/306 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01L21/78 ,  H01J37/32 ,  H01J37/32623 ,  H01L21/30621 ,  H01L21/3065 ,  H01L21/30655 ,  H01L21/67069 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6836 ,  H01L21/68735 ,  H01L21/68771 ,  H01L22/20 ,  H01L2221/68327

摘要： The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

公开(公告)号：US09343365B2

公开(公告)日：2016-05-17

申请号：US14014040

申请日：2013-08-29

申请人： Plasma-Therm LLC

发明人： Thierry Lazerand ,  David Pays-Volard ,  Linnell Martinez ,  Chris Johnson ,  Russell Westerman ,  Gordon M. Grivna

IPC分类号： H01L21/78 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  H01L21/3065

CPC分类号： H01L21/78 ,  H01J37/3211 ,  H01L21/3065 ,  H01L21/30655 ,  H01L21/67069 ,  H01L21/6831 ,  H01L21/68735

摘要： The present invention provides a method for plasma processing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing at least two cutting regions on the substrate, the cutting regions being positioned between all adjacent device structures on the substrate; generating a plasma using the plasma source; and processing the work piece using the generated plasma.

摘要翻译： 本发明提供了一种等离子体处理衬底的方法，该方法包括提供具有壁的处理室; 提供与处理室的壁相邻的等离子体源; 在处理室内提供工件支撑; 将工件装载到工件支撑件上，工件具有支撑膜，框架和基板; 在所述基板上提供至少两个切割区域，所述切割区域位于所述基板上的所有相邻的装置结构之间; 使用等离子体源产生等离子体; 以及使用所产生的等离子体处理工件。

公开(公告)号：US20140235034A1

公开(公告)日：2014-08-21

申请号：US13787153

申请日：2013-03-06

申请人： PLASMA-THERM LLC

发明人： David Pays-Volard ,  Linnell Martinez ,  Chris Johnson ,  David Johnson ,  Russell Westerman ,  Gordon M. Grivna

IPC分类号： H01L21/78 ,  H01L21/3065

CPC分类号： H01L21/78 ,  H01J37/32 ,  H01J37/32009 ,  H01J37/32532 ,  H01J37/32715 ,  H01J2237/334 ,  H01L21/0262 ,  H01L21/3065 ,  H01L21/30655 ,  H01L21/67069 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/68721 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68771 ,  H01L22/12

摘要： The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

摘要翻译： 本发明提供了一种等离子体切割基板的方法。 该方法包括提供具有壁的处理室; 提供与处理室的壁相邻的等离子体源; 在处理室内提供工件支撑; 将基板放置在框架上的支撑膜上以形成工件工件; 将工件装载到工件支架上; 提供用于将工件静电夹持到工件支撑件的夹紧电极; 在等离子体源和工件之间提供机械分隔; 通过等离子体源产生等离子体; 并通过产生的等离子体蚀刻工件。

公开(公告)号：US20130344683A1

公开(公告)日：2013-12-26

申请号：US14014040

申请日：2013-08-29

申请人： Plasma-Therm LLC

发明人： Thierry Lazerand ,  David Pays-Volard ,  Linnell Martinez ,  Chris Johnson ,  Russell Westerman

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  H01J37/3211 ,  H01L21/3065 ,  H01L21/30655 ,  H01L21/67069 ,  H01L21/6831 ,  H01L21/68735

摘要： The present invention provides a method for plasma processing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing at least two cutting regions on the substrate, the cutting regions being positioned between all adjacent device structures on the substrate; generating a plasma using the plasma source; and processing the work piece using the generated plasma.

摘要翻译： 本发明提供了一种等离子体处理衬底的方法，该方法包括提供具有壁的处理室; 提供与处理室的壁相邻的等离子体源; 在处理室内提供工件支撑; 将工件装载到工件支撑件上，工件具有支撑膜，框架和基板; 在所述基板上提供至少两个切割区域，所述切割区域位于所述基板上的所有相邻的装置结构之间; 使用等离子体源产生等离子体; 以及使用所产生的等离子体处理工件。

公开(公告)号：US20130230974A1

公开(公告)日：2013-09-05

申请号：US13787032

申请日：2013-03-06

申请人： PLASMA-THERM LLC

发明人： Linnell Martinez ,  David Pays-Volard ,  Chris Johnson ,  David Johnson ,  Russell Westerman

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  H01J37/32 ,  H01J37/32009 ,  H01J37/32532 ,  H01J37/32715 ,  H01J2237/334 ,  H01L21/0262 ,  H01L21/3065 ,  H01L21/30655 ,  H01L21/67069 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/68721 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68771 ,  H01L22/12

摘要： The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

公开(公告)号：US20130230969A1

公开(公告)日：2013-09-05

申请号：US13764160

申请日：2013-02-11

申请人： PLASMA-THERM LLC

发明人： Linnell Martinez ,  David Pays-Volard ,  Chris Johnson ,  David Johnson ,  Russell Westerman

IPC分类号： H01L21/78 ,  H01L21/67

CPC分类号： H01L21/78 ,  H01J37/321 ,  H01J37/32155 ,  H01J37/32422 ,  H01J37/32623 ,  H01J37/32642 ,  H01J37/32651 ,  H01J37/32724 ,  H01L21/3065 ,  H01L21/30655 ,  H01L21/31116 ,  H01L21/67011 ,  H01L21/67069 ,  H01L21/67739 ,  H01L21/68 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/782 ,  H01L2221/68327 ,  Y10S414/139

摘要： The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

公开(公告)号：US20230020438A1

公开(公告)日：2023-01-19

申请号：US17950048

申请日：2022-09-21

申请人： Plasma-Therm LLC

发明人： Linnell Martinez ,  David Pays-Volard ,  Chris Johnson ,  David Johnson ,  Russell Westerman ,  Gordon M. Grivna

IPC分类号： H01L21/78 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683 ,  H01L21/3065 ,  H01J37/32 ,  H01L21/66 ,  H01L21/02

摘要： The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

公开(公告)号：US10573557B2

公开(公告)日：2020-02-25

申请号：US14729610

申请日：2015-06-03

申请人： Plasma-Therm LLC

发明人： David Pays-Volard ,  Linnell Martinez ,  Chris Johnson ,  David Johnson ,  Russell Westerman ,  Gordon M. Grivna

IPC分类号： H01L21/78 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/02 ,  H01L21/683 ,  H01L21/67 ,  H01L21/687 ,  H01L21/66

摘要： The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

公开(公告)号：US20190244859A1

公开(公告)日：2019-08-08

申请号：US16381913

申请日：2019-04-11

申请人： Plasma-Therm LLC

发明人： Linnell Martinez ,  David Pays-Volard ,  Chris Johnson ,  David Johnson ,  Russell Westerman ,  Gordon M. Grivna

IPC分类号： H01L21/78 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/687 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01L21/78 ,  H01J37/32 ,  H01J37/32009 ,  H01J37/32532 ,  H01J37/32715 ,  H01J2237/334 ,  H01L21/0262 ,  H01L21/3065 ,  H01L21/30655 ,  H01L21/67069 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/68721 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68771 ,  H01L22/12

摘要： The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.