公开(公告)号：US09245940B2

公开(公告)日：2016-01-26

申请号：US14179202

申请日：2014-02-12

Applicant: QUALCOMM Incorporated

Inventor： Young Kyu Song ,  Yunseo Park ,  Xiaonan Zhang ,  Ryan David Lane ,  Aristotele Hadjichristos

IPC: H01L27/08 ,  H01L49/02 ,  H01L23/00 ,  H01L23/522

CPC classification number: H01L28/10 ,  H01L23/3192 ,  H01L23/5227 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05147 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/13006 ,  H01L2224/16225 ,  H01L2924/01029 ,  H01L2924/30107

Abstract: An inductor design on a wafer level package (WLP) does not need to depopulate the solder balls on the die because the solder balls form part of the inductor. One terminal on the inductor couples to the die, the other terminal couples to a single solder ball on the die, and the remaining solder balls that mechanically contact the inductor remain electrically floating. The resulting device has better inductance, direct current (DC) resistance, board-level reliability (BLR), and quality factor (Q).

Abstract translation: 晶圆级封装（WLP）上的电感器设计不需要将焊球沉淀在芯片上，因为焊球形成电感器的一部分。 电感器上的一个端子耦合到管芯，另一个端子耦合到管芯上的单个焊球，并且与电感器机械接触的剩余焊球保持电浮动。 所产生的器件具有更好的电感，直流（DC）电阻，电路板级可靠性（BLR）和品质因数（Q）。

公开(公告)号：US09035421B2

公开(公告)日：2015-05-19

申请号：US13787219

申请日：2013-03-06

Applicant: QUALCOMM Incorporated

Inventor： Young K. Song ,  Yunseo Park ,  Xiaonan Zhang ,  Ryan D. Lane ,  Babak Nejati ,  Aristotele Hadjichristos ,  Xiaoming Chen

IPC: H01L27/08 ,  H01L23/522 ,  H01L23/00 ,  H01L23/64 ,  H01L25/065 ,  H01L25/07 ,  H01L25/11

CPC classification number: H01L23/5227 ,  H01L23/645 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/117 ,  H01L2224/02375 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15331 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00012

Abstract: Some novel features pertain to a first example provides a semiconductor device that includes a printed circuit board (PCB), asset of solder balls and a die. The PCB includes a first metal layer. The set of solder balls is coupled to the PCB. The die is coupled to the PCB through the set of solder balls. The die includes a second metal layer and a third metal layer. The first metal layer of the PCB, the set of solder balls, the second and third metal layers of the die are configured to operate as an inductor in the semiconductor device. In some implementations, the die further includes a passivation layer. The passivation layer is positioned between the second metal layer and the third metal layer. In some implementations, the second metal layer is positioned between the passivation layer and the set of solder balls.

Abstract translation: 一些新颖特征涉及第一示例，提供了包括印刷电路板（PCB），焊球和裸片的资产的半导体器件。 PCB包括第一金属层。 该组焊球与PCB相连。 模具通过一组焊球耦合到PCB。 模具包括第二金属层和第三金属层。 PCB的第一金属层，焊球集合，管芯的第二和第三金属层被配置为在半导体器件中作为电感器工作。 在一些实施方式中，芯片还包括钝化层。 钝化层位于第二金属层和第三金属层之间。 在一些实施方案中，第二金属层位于钝化层和一组焊球之间。

公开(公告)号：US20140246753A1

公开(公告)日：2014-09-04

申请号：US13787219

申请日：2013-03-06

Applicant: QUALCOMM INCORPORATED

Inventor： Young K. Song ,  Yunseo Park ,  Xiaonan Zhang ,  Ryan D. Lane ,  Babak Nejati ,  Aristotele Hadjichristos ,  Xiaoming Chen

IPC: H01L23/522 ,  H01L23/00

CPC classification number: H01L23/5227 ,  H01L23/645 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/117 ,  H01L2224/02375 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15331 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00012

Abstract: Some novel features pertain to a first example provides a semiconductor device that includes a printed circuit board (PCB), asset of solder balls and a die. The PCB includes a first metal layer. The set of solder balls is coupled to the PCB. The die is coupled to the PCB through the set of solder balls. The die includes a second metal layer and a third metal layer. The first metal layer of the PCB, the set of solder balls, the second and third metal layers of the die are configured to operate as an inductor in the semiconductor device. In some implementations, the die further includes a passivation layer. The passivation layer is positioned between the second metal layer and the third metal layer. In some implementations, the second metal layer is positioned between the passivation layer and the set of solder balls.

Abstract translation: 一些新颖特征涉及第一示例，提供了包括印刷电路板（PCB），焊球和裸片的资产的半导体器件。 PCB包括第一金属层。 该组焊球与PCB相连。 模具通过一组焊球耦合到PCB。 模具包括第二金属层和第三金属层。 PCB的第一金属层，焊球集合，管芯的第二和第三金属层被配置为在半导体器件中作为电感器工作。 在一些实施方式中，芯片还包括钝化层。 钝化层位于第二金属层和第三金属层之间。 在一些实施方案中，第二金属层位于钝化层和一组焊球之间。

公开(公告)号：US09160377B2

公开(公告)日：2015-10-13

申请号：US13720851

申请日：2012-12-19

Applicant: QUALCOMM Incorporated

Inventor： Chang-Ho Lee ,  Woonyun Kim ,  Minsik Ahn ,  Jeongwon Cha ,  Yunseo Park ,  Aristotele Hadjichristos

IPC: H03F1/02 ,  H04B1/04 ,  H03F3/72 ,  H03H7/38

CPC classification number: H04B1/0458 ,  H03F1/0277 ,  H03F3/72 ,  H03F2203/7239 ,  H03H7/38 ,  H04B1/0483

Abstract: Exemplary embodiments are directed to an amplifier module which may comprise a transmit path including a first amplifier and a second amplifier. The exemplary amplifier module may further include a transformer coupled between the first amplifier and the second amplifier and switchably configured for coupling the first amplifier in series with the second amplifier in a first mode and coupling the first amplifier to bypass the second amplifier in a second mode.

Abstract translation: 示例性实施例涉及放大器模块，其可以包括包括第一放大器和第二放大器的发射路径。 示例性放大器模块还可以包括耦合在第一放大器和第二放大器之间的变压器，并且可切换地配置用于以第一模式将第一放大器与第二放大器串联耦合，并且以第二模式耦合第一放大器旁路第二放大器 。

公开(公告)号：US20150050901A1

公开(公告)日：2015-02-19

申请号：US13720851

申请日：2012-12-19

Applicant: QUALCOMM INCORPORATED

Inventor： Chang-Ho Lee ,  Woonyun Kim ,  Minsik Ahn ,  Jeongwon Cha ,  Yunseo Park ,  Aristotele Hadjichristos

IPC: H04B1/04

CPC classification number: H04B1/0458 ,  H03F1/0277 ,  H03F3/72 ,  H03F2203/7239 ,  H03H7/38 ,  H04B1/0483

Abstract: Exemplary embodiments are directed to an amplifier module which may comprise a transmit path including a first amplifier and a second amplifier. The exemplary amplifier module may further include a transformer coupled between the first amplifier and the second amplifier and switchably configured for coupling the first amplifier in series with the second amplifier in a first mode and coupling the first amplifier to bypass the second amplifier in a second mode.

Abstract translation: 示例性实施例涉及放大器模块，其可以包括包括第一放大器和第二放大器的发射路径。 示例性放大器模块还可以包括耦合在第一放大器和第二放大器之间的变压器，并且可切换地配置用于以第一模式将第一放大器与第二放大器串联耦合，并且以第二模式耦合第一放大器旁路第二放大器 。