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公开(公告)号：US20160007409A1
公开(公告)日：2016-01-07
申请号：US14749519
申请日：2015-06-24
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Hiroki SHIBUYA , Manabu Okamoto , Tomohiro Nishiyama , Norikazu Motohashi
Abstract: To achieve the reduction in size of an electronic device. The electronic device serving as an element of a wireless communication system includes a module unit, a battery that supplies electric power to the module unit, and a coupling part that electrically couples the module unit and the battery. The module unit includes a sensor that detects a physical quantity, and a wireless communication unit configured to transmit the data based on an output signal from the sensor.
Abstract translation: 实现电子设备尺寸的减小。 作为无线通信系统的元件的电子设备包括：模块单元，向模块单元供电的电池;以及电耦合模块单元和电池的耦合部。 模块单元包括检测物理量的传感器，以及被配置为基于来自传感器的输出信号发送数据的无线通信单元。
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公开(公告)号：US20150333048A1
公开(公告)日：2015-11-19
申请号：US14807559
申请日：2015-07-23
Applicant: Renesas Electronics Corporation
Inventor： Shintaro Yamamichi , Manabu Okamoto , Hirokazu Honda
IPC: H01L25/18 , H01L23/31 , H01L23/498 , H01L25/065 , H01L23/48
CPC classification number: H01L25/18 , H01L21/563 , H01L23/12 , H01L23/3135 , H01L23/367 , H01L23/481 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2924/15311 , H01L2924/16251 , H01L2924/181 , H01L2924/351 , H01L2224/81 , H01L2924/00
Abstract: This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.
Abstract translation: 本发明防止在其特定区域中共同布置的通硅通孔的半导体芯片的基板变得破裂。 当将与第一半导体芯片的长边平行的方向定义为行方向并且将与第一半导体芯片的长边垂直的方向定义为列方向时，第一穿硅通孔中的每一个为 布置在以m行和n列（m> n）排列的网格点中的任何一个上。 此外，如沿着第一半导体芯片的短边截取的截面图所示，通过连接以m行和n列布置的最外侧格点限定的贯通硅通孔区域的中心为偏心 在第一方向上的第一半导体芯片的短边。
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公开(公告)号：US09117814B2
公开(公告)日：2015-08-25
申请号：US14284447
申请日：2014-05-22
Applicant: Renesas Electronics Corporation
Inventor： Shintaro Yamamichi , Manabu Okamoto , Hirokazu Honda
IPC: H01L23/02 , H01L23/06 , H01L23/04 , H01L21/44 , H01L23/498 , H01L23/48 , H01L23/31 , H01L23/50 , H01L21/56 , H01L25/065 , H01L23/00 , H01L25/00 , H01L23/12 , H01L23/367
CPC classification number: H01L25/18 , H01L21/563 , H01L23/12 , H01L23/3135 , H01L23/367 , H01L23/481 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2924/15311 , H01L2924/16251 , H01L2924/181 , H01L2924/351 , H01L2224/81 , H01L2924/00
Abstract: This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.
Abstract translation: 本发明防止在其特定区域中共同布置的通硅通孔的半导体芯片的基板变得破裂。 当将与第一半导体芯片的长边平行的方向定义为行方向并且将与第一半导体芯片的长边垂直的方向定义为列方向时，第一穿硅通孔中的每一个为 布置在以m行和n列（m> n）排列的网格点中的任何一个上。 此外，如沿着第一半导体芯片的短边截取的截面图所示，通过连接以m行和n列布置的最外侧格点限定的贯通硅通孔区域的中心为偏心 在第一方向上的第一半导体芯片的短边。
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公开(公告)号：US10085425B2
公开(公告)日：2018-10-02
申请号：US14752886
申请日：2015-06-27
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Takuo Funaya , Tomohiro Nishiyama , Hiroki Shibuya , Manabu Okamoto
IPC: A61N1/375 , A01K29/00 , H04W4/00 , G01D11/24 , H04W4/70 , A01K11/00 , A61B5/00 , A61D17/00 , A61B5/11
Abstract: An electronic apparatus is provided which, even when the electronic apparatus configuring a node is implanted in the body of an object animal, makes the object animal hard to feel stress and can acquire effective data about the natural behavior and state of the object animal. As shown in FIG. 12, a module unit and a battery are arranged separated from each other. That is, an electronic apparatus according to the present embodiment 1 adopts a case including a first capacity part and a second capacity part both arranged separated from each other to thereby accommodate the module unit in an internal space of the first capacity part and accommodate the battery in an internal space of the second capacity part.
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Patent Agency Ranking
公开(公告)号：US20160128179A1
公开(公告)日：2016-05-05
申请号：US14878107
申请日：2015-10-08
Applicant: Renesas Electronics Corporation
Inventor： Manabu Okamoto , Hiroki Shibuya
CPC classification number: H05K1/0268 , G01R31/2801 , H04B1/3827 , H04B1/3888 , H05K1/116 , H05K1/144 , H05K2201/042 , H05K2201/10189
Abstract: Miniaturization of an electronic apparatus which functions as a component of a wireless communication system is achieved. A main feature point in an embodiment resides in that a plurality of test terminals provided over an upper surface of a wiring board are collectively arranged as shown in a drawing, for example. Thus, it is possible to reduce the size of a test terminal forming area (first test terminal forming area) formed with the test terminals used in a unit test. As a result, miniaturization of an electronic apparatus according to the present embodiment can be achieved.
Abstract translation: 实现用作无线通信系统的组件的电子设备的小型化。 实施例的主要特征在于，例如，如图所示，在布线板的上表面上设置的多个测试端子被集体布置。 因此，可以减小在单元测试中使用的测试端子形成的测试端子形成区域（第一测试端子形成区域）的尺寸。 结果，可以实现根据本实施例的电子设备的小型化。
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公开(公告)号：US20160000045A1
公开(公告)日：2016-01-07
申请号：US14752886
申请日：2015-06-27
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Takuo Funaya , Tomohiro Nishiyama , Hiroki Shibuya , Manabu Okamoto
CPC classification number: A01K29/005 , A01K11/006 , A61B5/0002 , A61B5/11 , A61D17/00 , G01D11/245 , H04W4/70
Abstract: An electronic apparatus is provided which, even when the electronic apparatus configuring a node is implanted in the body of an object animal, makes the object animal hard to feel stress and can acquire effective data about the natural behavior and state of the object animal. As shown in FIG. 12, a module unit and a battery are arranged separated from each other. That is, an electronic apparatus according to the present embodiment 1 adopts a case including a first capacity part and a second capacity part both arranged separated from each other to thereby accommodate the module unit in an internal space of the first capacity part and accommodate the battery in an internal space of the second capacity part.
Abstract translation: 提供了一种电子设备，即使构成节点的电子装置植入物体动物的身体中，也能够使对象动物难以感受到压力，并且能够获取关于对象动物的自然行为和状态的有效数据。 如图所示。 如图12所示，模块单元和电池被布置成彼此分离。 也就是说，根据本实施例1的电子设备采用包括彼此分离布置的第一电容部分和第二电容部分的壳体，从而将模块单元容纳在第一电容部分的内部空间中并且容纳电池 在第二容量部分的内部空间中。
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公开(公告)号：US20140361410A1
公开(公告)日：2014-12-11
申请号：US14284447
申请日：2014-05-22
Applicant: Renesas Electronics Corporation
Inventor： Shintaro Yamamichi , Manabu Okamoto , Hirokazu Honda
IPC: H01L23/498 , H01L23/48
CPC classification number: H01L25/18 , H01L21/563 , H01L23/12 , H01L23/3135 , H01L23/367 , H01L23/481 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2924/15311 , H01L2924/16251 , H01L2924/181 , H01L2924/351 , H01L2224/81 , H01L2924/00
Abstract: This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.
Abstract translation: 本发明防止在其特定区域中共同布置的通硅通孔的半导体芯片的基板变得破裂。 当将与第一半导体芯片的长边平行的方向定义为行方向并且将与第一半导体芯片的长边垂直的方向定义为列方向时，第一穿硅通孔中的每一个为 布置在以m行和n列（m> n）排列的网格点中的任何一个上。 此外，如沿着第一半导体芯片的短边截取的截面图所示，通过连接以m行和n列布置的最外侧格点限定的贯通硅通孔区域的中心为偏心 在第一方向上的第一半导体芯片的短边。
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公开(公告)号：US09585192B2
公开(公告)日：2017-02-28
申请号：US14749519
申请日：2015-06-24
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Hiroki Shibuya , Manabu Okamoto , Tomohiro Nishiyama , Norikazu Motohashi
Abstract: To achieve the reduction in size of an electronic device. The electronic device serving as an element of a wireless communication system includes a module unit, a battery that supplies electric power to the module unit, and a coupling part that electrically couples the module unit and the battery. The module unit includes a sensor that detects a physical quantity, and a wireless communication unit configured to transmit the data based on an output signal from the sensor.
Abstract translation: 实现电子设备尺寸的减小。 作为无线通信系统的元件的电子设备包括：模块单元，向模块单元供电的电池;以及电耦合模块单元和电池的耦合部。 模块单元包括检测物理量的传感器，以及被配置为基于来自传感器的输出信号发送数据的无线通信单元。
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公开(公告)号：US09362262B2
公开(公告)日：2016-06-07
申请号：US14807559
申请日：2015-07-23
Applicant: Renesas Electronics Corporation
Inventor： Shintaro Yamamichi , Manabu Okamoto , Hirokazu Honda
IPC: H01L23/04 , H01L23/34 , H01L23/52 , H01L21/44 , H01L25/18 , H01L23/498 , H01L23/48 , H01L23/31 , H01L23/50 , H01L21/56 , H01L25/065 , H01L23/00 , H01L25/00 , H01L23/12 , H01L23/367
CPC classification number: H01L25/18 , H01L21/563 , H01L23/12 , H01L23/3135 , H01L23/367 , H01L23/481 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2924/15311 , H01L2924/16251 , H01L2924/181 , H01L2924/351 , H01L2224/81 , H01L2924/00
Abstract: This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.
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