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公开(公告)号：US10566879B2
公开(公告)日：2020-02-18
申请号：US15563011
申请日：2015-09-14
Applicant: Renesas Electronics Corporation
Inventor： Shinji Nishizono , Tadashi Shimizu , Tomohiro Nishiyama , Norikazu Motohashi
IPC: H02K11/33 , H01L23/528 , H01L23/00 , H02M7/537 , H02P27/06
Abstract: A first semiconductor device having a power transistor for switching is mounted on a power wiring substrate PB1; a semiconductor device PKG6 having a driving circuit for driving the first semiconductor device and a semiconductor device PKG5 having a control circuit for controlling the semiconductor device PKG6 are mounted on a first principal surface of a control wiring substrate PB2; and a semiconductor device PKG4 having a regulator circuit is mounted on a second principal surface of the control wiring substrate PB2. On the first principal surface of the control wiring substrate PB2, the semiconductor device PKG5 and the semiconductor device PKG6 are mounted in a second area out of the second area and a third area adjacent to each other via a first area in which a plurality of holes HC3 are arranged. On the second principal surface of the control wiring substrate PB2, the semiconductor device PKG4 is mounted in a fifth area out of a fourth area positioned opposite the second area and the fifth area positioned opposite the third area.
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公开(公告)号：US10314169B2
公开(公告)日：2019-06-04
申请号：US15562992
申请日：2015-08-21
Applicant: Renesas Electronics Corporation
Inventor： Norikazu Motohashi , Tomohiro Nishiyama , Tadashi Shimizu , Shinji Nishizono
IPC: H05K1/18 , H02M7/48 , H02K11/33 , F02M37/08 , H01L23/31 , H01L23/495 , H02M7/00 , H02P27/06 , H05K1/11 , H05K1/14
Abstract: A plurality of semiconductor devices each including a semiconductor chip having a high-side MOSFET and a semiconductor chip having a low-side MOSFET are mounted on a wiring board (PB1). The wiring board (PB1) includes a power supply wiring WV1 to which a power supply potential is supplied and output wirings WD1, WD2, and WD3 electrically connecting a low-side drain terminal of each of the plurality of semiconductor devices to a plurality of output terminals. A minimum value and a maximum value of a current path width in the power supply wiring WV1 are referred to as a first minimum width and a first maximum width, respectively, and a minimum value and a maximum value of a current path width in the output wirings WD1, WD2, and WD3 are referred to as a second minimum width and a second maximum width, respectively. When the first minimum width is smaller than the second minimum width, the first minimum width is larger than half of the second maximum width, and when the second minimum width is smaller than the first minimum width, the second minimum width is larger than half of the first maximum width.
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公开(公告)号：US10098179B2
公开(公告)日：2018-10-09
申请号：US14258246
申请日：2014-04-22
Applicant: Renesas Electronics Corporation
Inventor： Shintaro Yamamichi , Hirokazu Honda , Masaki Watanabe , Junichi Arita , Norio Okada , Jun Ueno , Masashi Nishimoto , Michitaka Kimura , Tomohiro Nishiyama
Abstract: A compact electronic device as a constituent element of a wireless communication system using a sensor. A first feature of the device is that a first semiconductor chip is bare-chip-mounted over a front surface of a first wiring board in the form of a chip and a second semiconductor chip is bare-chip-mounted over a second wiring board in the form of a chip. A second feature is that a wireless communication unit and a data processing unit which configure a module are separately mounted. A third feature is that the first and second wiring boards are stacked in the board thickness direction to make up the module (electronic device).
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公开(公告)号：US20160007409A1
公开(公告)日：2016-01-07
申请号：US14749519
申请日：2015-06-24
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Hiroki SHIBUYA , Manabu Okamoto , Tomohiro Nishiyama , Norikazu Motohashi
Abstract: To achieve the reduction in size of an electronic device. The electronic device serving as an element of a wireless communication system includes a module unit, a battery that supplies electric power to the module unit, and a coupling part that electrically couples the module unit and the battery. The module unit includes a sensor that detects a physical quantity, and a wireless communication unit configured to transmit the data based on an output signal from the sensor.
Abstract translation: 实现电子设备尺寸的减小。 作为无线通信系统的元件的电子设备包括：模块单元，向模块单元供电的电池;以及电耦合模块单元和电池的耦合部。 模块单元包括检测物理量的传感器，以及被配置为基于来自传感器的输出信号发送数据的无线通信单元。
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公开(公告)号：US20170373567A1
公开(公告)日：2017-12-28
申请号：US15629261
申请日：2017-06-21
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Shinji NISHIZONO , Tadashi SHIMIZU , Norikazu MOTOHASHI , Tomohiro Nishiyama
CPC classification number: H02K11/33 , H02H7/08 , H02H9/02 , H02K7/145 , H02M7/003 , H02P6/085 , H05K1/0206 , H05K1/0263 , H05K1/115 , H05K1/181 , H05K3/3447 , H05K3/429 , H05K7/1432 , H05K2201/10015 , H05K2201/10166 , H05K2201/10356 , H05K2201/10522 , H05K2201/10545 , H05K2201/10628 , H05K2201/10636
Abstract: An electronic device is downsized while suppressing performance degradation of the electronic device. In the electronic device, a power module including a power transistor is arranged in a first region on a back surface of a through hole board having a plurality of through hole vias having different sizes while a pre-driver including a control circuit is arranged in a second region on a front surface of the board. In this case, in a plan view, the first region and the second region have an overlapping region. The power module and the pre-driver are electrically connected to each other via a through hole via. The plurality of through hole vias include a through hole via having a first size, a through hole via which is larger than the first size and in which a cable can be inserted, and a through hole via in which a conductive member is embedded.
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Patent Agency Ranking
公开(公告)号：US10361609B2
公开(公告)日：2019-07-23
申请号：US15629261
申请日：2017-06-21
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Shinji Nishizono , Tadashi Shimizu , Norikazu Motohashi , Tomohiro Nishiyama
IPC: H05K1/18 , H02K11/33 , H05K1/11 , H05K1/02 , H05K7/14 , H02H9/02 , H02K7/14 , H02M7/00 , H02P6/08 , H05K3/34 , H05K3/42 , H02H7/08
Abstract: An electronic device is downsized while suppressing performance degradation of the electronic device. In the electronic device, a power module including a power transistor is arranged in a first region on a back surface of a through hole board having a plurality of through hole vias having different sizes while a pre-driver including a control circuit is arranged in a second region on a front surface of the board. In this case, in a plan view, the first region and the second region have an overlapping region. The power module and the pre-driver are electrically connected to each other via a through hole via. The plurality of through hole vias include a through hole via having a first size, a through hole via which is larger than the first size and in which a cable can be inserted, and a through hole via in which a conductive member is embedded.
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公开(公告)号：US09585192B2
公开(公告)日：2017-02-28
申请号：US14749519
申请日：2015-06-24
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Hiroki Shibuya , Manabu Okamoto , Tomohiro Nishiyama , Norikazu Motohashi
Abstract: To achieve the reduction in size of an electronic device. The electronic device serving as an element of a wireless communication system includes a module unit, a battery that supplies electric power to the module unit, and a coupling part that electrically couples the module unit and the battery. The module unit includes a sensor that detects a physical quantity, and a wireless communication unit configured to transmit the data based on an output signal from the sensor.
Abstract translation: 实现电子设备尺寸的减小。 作为无线通信系统的元件的电子设备包括：模块单元，向模块单元供电的电池;以及电耦合模块单元和电池的耦合部。 模块单元包括检测物理量的传感器，以及被配置为基于来自传感器的输出信号发送数据的无线通信单元。
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公开(公告)号：US10375817B2
公开(公告)日：2019-08-06
申请号：US15480920
申请日：2017-04-06
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Norikazu Motohashi , Tomohiro Nishiyama , Tadashi Shimizu , Shinji Nishizono
Abstract: An electronic device has a control board having a plurality of wiring layers, a metal-made housing supporting the control board, and a fixing screw for fixing the control board to the housing through a washer. The control board includes a through hole penetrating from a third surface to a fourth surface, a through electrode formed inside the through hole, and a power system GND pattern formed on any wiring layer of the wiring layers. The power system GND pattern and the housing are electrically coupled through the through electrode, the washer, and the fixing screw.
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公开(公告)号：US10361174B2
公开(公告)日：2019-07-23
申请号：US16035152
申请日：2018-07-13
Applicant: Renesas Electronics Corporation
Inventor： Koji Bando , Tomohiro Nishiyama
IPC: H01L23/52 , H01L25/065 , H01L23/367 , H01L23/31 , H01L23/538
Abstract: An improvement is achieved in the heat dissipation property of an electronic device including power transistors. A semiconductor module includes first and second packages included in an inverter circuit. In the first package, a semiconductor chip having a high-side power transistor is embedded. In the second package, a semiconductor chip having a low-side power transistor is embedded. At the both wide surfaces of the first and second packages, first metal electrodes electrically coupled to respective collector electrodes of the power transistors and second metal electrodes electrically coupled to respective emitter electrodes of the power transistors are exposed. To the first and second metal electrodes of the first and second packages, four respective bus bar plates having areas larger than those of the first and second metal electrodes are joined.
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公开(公告)号：US10085425B2
公开(公告)日：2018-10-02
申请号：US14752886
申请日：2015-06-27
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Takuo Funaya , Tomohiro Nishiyama , Hiroki Shibuya , Manabu Okamoto
IPC: A61N1/375 , A01K29/00 , H04W4/00 , G01D11/24 , H04W4/70 , A01K11/00 , A61B5/00 , A61D17/00 , A61B5/11
Abstract: An electronic apparatus is provided which, even when the electronic apparatus configuring a node is implanted in the body of an object animal, makes the object animal hard to feel stress and can acquire effective data about the natural behavior and state of the object animal. As shown in FIG. 12, a module unit and a battery are arranged separated from each other. That is, an electronic apparatus according to the present embodiment 1 adopts a case including a first capacity part and a second capacity part both arranged separated from each other to thereby accommodate the module unit in an internal space of the first capacity part and accommodate the battery in an internal space of the second capacity part.
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