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公开(公告)号：US5440787A
公开(公告)日：1995-08-15
申请号：US154819
申请日：1993-11-19
申请人： Raul Figueroa , Guillermo L. Romero
发明人： Raul Figueroa , Guillermo L. Romero
CPC分类号： A44B11/2592 , A41D25/04 , A44B11/006 , Y10S24/50 , Y10T24/1903 , Y10T24/2708 , Y10T24/45194 , Y10T24/45969 , Y10T24/4709
摘要： A clasp for cloth neckwear and the like including a first clamping member designed to substantially encircle a first end of the neckwear and fixedly clamp the first end in a retained position, a second clamping member designed to substantially encircle a second end of the neckwear and fixedly clamp the second end in a retained position, and clasping means mounted on the first and second clamping members, the clasping means being manually engageable and disengageable for forming the neckwear into a continuous loop about the neck of a wearer. The neckwear is tied with a standard knot and severed in the back to provide the two ends and the clamping members are affixed to the ends after stretching the cloth slightly.
摘要翻译： 一种用于布衣领等的扣环，包括设计成基本上环绕颈衣的第一端并将第一端固定地夹持在保持位置的第一夹紧构件，设计成基本上环绕颈衣的第二端并固定地固定的第二夹紧构件 将第二端夹持在保持位置，并且紧固装置安装在第一和第二夹紧构件上，夹紧装置可手动地接合和脱离，以将颈衣形成围绕穿着者的颈部的连续环路。 颈部用标准的结扣起，并在后面切断以提供两端，并且夹紧件在稍微拉伸布之后固定到端部。
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公开(公告)号：US5371043A
公开(公告)日：1994-12-06
申请号：US255533
申请日：1994-05-25
IPC分类号： H01L23/02 , H01L23/373 , H01L23/473 , H01L25/07 , H03B1/00 , H03B7/06 , H01L21/60
CPC分类号： H01L25/072 , H01L23/3731 , H01L2924/0002 , H01L2924/3011 , H03B2200/0034 , H03B2200/004 , H03B2201/0208 , H03B7/06 , Y10T29/4913
摘要： A method for forming a power circuit package (45) having a porous base structure (20) electrically isolated from a first porous die mount (21) and a second porous die mount (22) by a dielectric material (29). The porous base structure (20) is bonded to a second surface of the the dielectric material (29) whereas the first porous die mount (21 ) , and the second porous die mount (22 ) are bonded to a first surface of the dielectric material (29). Simultaneous with the bonding step, the porous base structure (20) , the first porous die mount (21) , and the second porous die mount (22) are impregnated with a conductive material. Semiconductor die (32, 33, 34, and 35) are bonded to the impregnated die mounts. The semiconductor die (32, 33, 34, and 35) are then encapsulated by a molding compound.
摘要翻译： 一种用于形成具有通过介电材料（29）与第一多孔管芯安装件（21）电隔离的多孔基底结构（20）和第二多孔管芯安装件（22）的电源电路封装（45）的方法。 所述多孔基底结构（20）与所述电介质材料（29）的第二表面接合，而所述第一多孔模座（21）和所述第二多孔模座（22）与所述电介质材料 （29）。 与接合步骤同时，多孔基底结构（20），第一多孔模座（21）和第二多孔模座（22）浸渍有导电材料。 半导体管芯（32,33,34和35）与浸渍的模具安装座结合。 然后，半导体管芯（32,33,34和35）被模塑料包封。
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公开(公告)号：US09003649B1
公开(公告)日：2015-04-14
申请号：US13357783
申请日：2012-01-25
CPC分类号： B23K20/127 , B23K20/122 , B23K2101/14 , B23K2101/40 , B23K2103/10 , F28F3/022 , H01L21/4882 , H01L23/473 , H01L2924/0002 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , H01L2924/00012 , H01L2924/00
摘要： A fluid cooled electrical assembly that includes a metal box, having a bottom wall, side walls and a top wall. A set of straight-edged pins, each smaller than 3 mm across in widest dimension, extend down from the top wall and up from the bottom wall. Also, electrical components are mounted on top of the top wall and on bottom of the bottom wall.
摘要翻译： 一种流体冷却的电气组件，其包括具有底壁，侧壁和顶壁的金属盒。 一组直边的针，每个小于3毫米，最宽的尺寸，从顶壁向下延伸，并从底壁向上延伸。 此外，电气部件安装在顶壁的顶部和底壁的底部。
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公开(公告)号：US5915463A
公开(公告)日：1999-06-29
申请号：US620522
申请日：1996-03-23
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H05K7/20909 , H01L23/473 , H01L2924/0002
摘要： A heat dissipation apparatus (51) has a lid (12) and an optimized fin arrangement (16) located in a cavity (57) of a base (11). Semiconductor chips (41, 42, 43, 44, 45, and 46) are coupled to the lid (12), and a heat conducting medium (47) is forced into the cavity (57) through a port (13) and out of the cavity (57) through a different port (14). Heat generated by the semiconductor chips (41, 42, 43, 44, 45, and 46) is thermally conducted into the fin arrangement (16) and then transferred into the heat conducting medium (47).
摘要翻译： 散热装置（51）具有位于基座（11）的空腔（57）中的盖（12）和优化的翅片布置（16）。 半导体芯片（41,42,43,44,45和46）联接到盖子（12）上，并且导热介质（47）通过端口（13）被迫进入空腔（57） 空腔（57）通过不同的端口（14）。 由半导体芯片（41,42,43,44,45和46）产生的热量被热传导到散热片装置（16）中，然后转移到导热介质（47）中。
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公开(公告)号：US5616886A
公开(公告)日：1997-04-01
申请号：US464112
申请日：1995-06-05
IPC分类号： H01L23/12 , H01L23/057 , H01L23/498 , H01L25/04 , H01L25/18 , H01L23/02
CPC分类号： H01L24/82 , H01L23/057 , H01L23/49861 , H01L24/24 , H01L2224/24137 , H01L2224/24227 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/30107
摘要： A wirebondless module package and method of fabrication including a molded preform of porous SiC with a cavity having therein an AlN substrate defining a plurality of pockets. The preform being infiltrated with Al and the Al being deposited in each of the pockets. A semiconductor die mounted on the Al in one of the pockets. A dielectric layer covering the Al and defining openings therethrough positioned to expose the aluminum and a connection to the die. A conductive material positioned on the dielectric layer in contact with the die and the Al so as to define terminals and interconnections between the die and the terminals.
摘要翻译： 一种无引线模块封装和制造方法，包括多孔SiC的模制预制件，其中具有限定多个凹穴的AlN衬底的空腔。 预制件被Al渗透，并且Al沉积在每个口袋中。 安装在其中一个凹穴中的Al上的半导体管芯。 覆盖Al并且限定穿过其中的开口的介电层，以暴露铝和与管芯的连接。 位于电介质层上的与导体和Al接触的导电材料，以便限定晶片和端子之间的端子和互连。
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公开(公告)号：US5465481A
公开(公告)日：1995-11-14
申请号：US130824
申请日：1993-10-04
申请人： Guillermo L. Romero
发明人： Guillermo L. Romero
IPC分类号： H01L23/04 , H01L23/053 , H01L23/06 , H01L23/373 , H01L25/16 , H05K3/34
CPC分类号： H01L23/04 , H01L23/053 , H01L23/06 , H01L23/3733 , H01L25/165 , H01L2924/0002 , Y10T29/49144
摘要： A semiconductor package (100) and module (300) includes a unitary base structure (101) and alignment mechanisms (104). The unitary base structure (101) includes a semiconductor mounting area (102) and encircling walls (103). The structure provides resistance to bowing as compared to a flat base. The lack of bowing provides improved thermal contact to a cold plate of the operating environment. The lack of bowing also reduces certain failure modes. The alignment mechanism (104) aligns module components during assembly, thereby simplifying assembly by eliminating the need for complicated fixtures which hold components in place.
摘要翻译： 半导体封装（100）和模块（300）包括整体基础结构（101）和对准机构（104）。 整体式基座结构（101）包括半导体安装区域（102）和环绕壁（103）。 与平底座相比，该结构提供了抗弯曲性。 缺乏弯曲提供了与操作环境的冷板的热接触。 缺乏弯曲也降低了某些失效模式。 对准机构（104）在组装期间对准模块部件，从而通过消除对将部件保持在适当位置的复杂夹具的需要来简化组装。
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公开(公告)号：US08966759B1
公开(公告)日：2015-03-03
申请号：US13189391
申请日：2011-07-22
CPC分类号： F28F3/022 , B23K20/122 , B23K2101/14 , B23K2101/40 , B23K2103/10 , H01L21/4882 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , Y10T29/49353 , Y10T29/49366 , Y10T29/49393 , H01L2924/00
摘要： A method of making a fluid cooled assembly that incorporates a base that forms a partial enclosure defining an interior void space and having a top wall that has a top surface and that defines at least one opening through the top wall to the void space, the base further defining fluid entrance and exit ports into the void space, the top wall being made of material that can be friction stir welded. A lid having a size and shape substantially conformal to the opening, having a top surface and a bottom surface that defines a set of downwardly extending pins, and that is formed of a material that can be friction stir welded to the base is placed into the opening so that the lid top surface is flush with the top surface of the base top wall and friction welding the lid to the base.
摘要翻译： 一种制造流体冷却组件的方法，其包括形成限定内部空隙空间并具有顶壁的基部的基部，所述顶壁具有顶表面并且限定通过所述顶壁至少一个开口到所述空隙空间，所述基部 进一步将流体入口和出口定义为空隙空间，顶壁由可以摩擦搅拌焊接的材料制成。 具有与开口基本一致的尺寸和形状的盖子具有限定一组向下延伸的销的顶表面和底表面，并且由可以摩擦搅拌焊接到基座的材料形成， 打开，使得盖顶表面与基座顶壁的顶表面齐平并且将盖摩擦焊接到基座。
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公开(公告)号：US20120104457A1
公开(公告)日：2012-05-03
申请号：US13342742
申请日：2012-01-03
IPC分类号： H01L29/739
CPC分类号： H02M7/003 , H01L23/5385 , H01L25/072 , H01L2924/00014 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H01L2924/00 , H01L2224/48
摘要： A structurally robust power switching assembly, that has a power transistor, comprising a thin and delicate layer of metal oxide, and a major surface of the layer of metal oxide being substantially coincident with a major surface of the power transistor, the major surface of the power transistor defining both an emitter and a gate. Also, dielectric material is placed over a portion of the emitter, so that it abuts the gate and a highly conductive pillar is constructed out of a relatively soft material, supported by the gate and the dielectric material, so that it has a larger area than would be possible if it was supported only by the gate.
摘要翻译： 具有功率晶体管的结构坚固的功率开关组件，其包括薄且精细的金属氧化物层，并且金属氧化物层的主表面基本上与功率晶体管的主表面重合， 功率晶体管限定发射极和栅极。 此外，电介质材料被放置在发射极的一部分上，使得其邻接栅极，并且高导电柱由由栅极和电介质材料支撑的相对软的材料构成，使得其具有比 如果只有门口支持，才有可能。
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公开(公告)号：US07521789B1
公开(公告)日：2009-04-21
申请号：US11017184
申请日：2004-12-18
CPC分类号： H05K7/205 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink protrusions are made of the same metal as is used in the direct bond copper.
摘要翻译： 一种电气组件，包括支撑在直接接合金属基底的第一主表面上的发热半导体器件，该半导体器件具有由其第二主表面支撑的一组散热器突起。 在一个优选实施例中，散热器突起由与直接接合铜中使用的相同的金属制成。
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公开(公告)号：US07173823B1
公开(公告)日：2007-02-06
申请号：US11016603
申请日：2004-12-18
CPC分类号： H05K7/20927 , F28D9/0031 , F28F3/04 , F28F3/12 , F28F21/02 , F28F21/04 , F28F21/065 , F28F21/08 , F28F2255/143
摘要： A heat producing, fluid cooled assembly that includes a housing made of liquid-impermeable material, which defines a fluid inlet and a fluid outlet and an opening. Also included is an electrical package having a set of semiconductor electrical devices supported on a substrate and the second major surface is a heat sink adapted to express heat generated from the electrical apparatus and wherein the second major surface defines a rim that is fit to the opening. Further, the housing is constructed so that as fluid travels from the fluid inlet to the fluid outlet it is constrained to flow past the opening thereby placing the fluid in contact with the heat sink.
摘要翻译： 一种发热流体冷却组件，其包括由液体不可渗透材料制成的壳体，其限定流体入口和流体出口以及开口。 还包括一种电气封装，其具有支撑在基板上的一组半导体电气装置，第二主表面是适于表达从电气设备产生的热量的散热器，并且其中第二主表面限定了适于开口的边缘 。 此外，壳体构造成使得当流体从流体入口流动到流体出口时，其被限制流过开口，从而使流体与散热器接触。
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