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公开(公告)号：US09003649B1
公开(公告)日：2015-04-14
申请号：US13357783
申请日：2012-01-25
CPC分类号： B23K20/127 , B23K20/122 , B23K2101/14 , B23K2101/40 , B23K2103/10 , F28F3/022 , H01L21/4882 , H01L23/473 , H01L2924/0002 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , H01L2924/00012 , H01L2924/00
摘要： A fluid cooled electrical assembly that includes a metal box, having a bottom wall, side walls and a top wall. A set of straight-edged pins, each smaller than 3 mm across in widest dimension, extend down from the top wall and up from the bottom wall. Also, electrical components are mounted on top of the top wall and on bottom of the bottom wall.
摘要翻译： 一种流体冷却的电气组件，其包括具有底壁，侧壁和顶壁的金属盒。 一组直边的针，每个小于3毫米，最宽的尺寸，从顶壁向下延伸，并从底壁向上延伸。 此外，电气部件安装在顶壁的顶部和底壁的底部。
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2.发明授权
公开(公告)号：US5544412A
公开(公告)日：1996-08-13
申请号：US247944
申请日：1994-05-24
IPC分类号： H01L21/60 , H01L23/473 , H01L23/495 , H01L25/07 , H05K3/30
CPC分类号： H01L24/73 , H01L23/473 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/49 , H01L24/91 , H01L25/074 , H01L2224/37147 , H01L2224/48091 , H01L2224/48137 , H01L2224/4823 , H01L2224/49 , H01L2224/73221 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/1305 , H01L2924/13055 , H01L2924/15312 , H01L2924/15787 , H01L2924/181 , H01L2924/30107
摘要： An electronic module and a method for coupling a power lead (32) to a bond pad (28) on a semiconductor die (17) within the electronic module. A clip support (13) having a slot (27) is coupled to a baseplate (11) via an isolation structure (14). The semiconductor die (17) is coupled to the baseplate (11) via an isolation structure (19). The power lead (32) is coupled to the isolation structure (14). The clip support (13) is coupled to the semiconductor die (17) via a clip (29), wherein a first end of the clip (29) is inserted in the slot (27) and a second end of the clip (29) is compressively mated with the semiconductor die (17). Compressively mating the clip (29) with the semiconductor die (17) eliminates the need for bond feet, thereby increasing the reliability of the module.
摘要翻译： 一种用于将电源引线（32）耦合到电子模块内的半导体管芯（17）上的接合焊盘（28）的电子模块和方法。 具有狭槽（27）的夹子支撑件（13）经由隔离结构（14）联接到基板（11）。 半导体管芯（17）经由隔离结构（19）耦合到基板（11）。 电源引线（32）耦合到隔离结构（14）。 夹子支撑件（13）经由夹子（29）连接到半导体管芯（17），其中夹子（29）的第一端插入槽（27）和夹子（29）的第二端， 与半导体管芯（17）压配合。 将夹子（29）与半导体管芯（17）压配合，消除了对焊脚的需要，从而提高了模块的可靠性。
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公开(公告)号：US20110315367A1
公开(公告)日：2011-12-29
申请号：US12823990
申请日：2010-06-25
CPC分类号： F28F3/022 , B23K20/122 , B23K2101/14 , B23K2101/40 , B23K2103/10 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method of making a fluid cooled assembly that incorporates a base that forms a partial enclosure defining an interior void space and having a top wall that has a top surface and that defines at least one opening through the top wall to the void space, the base further defining fluid entrance and exit ports into the void space, the top wall being made of material that can be friction stir welded. A lid having a size and shape substantially conformal to the opening, having a top surface and a bottom surface that defines a set of downwardly extending pins, and that is formed of a material that can be friction stir welded to the base is placed into the opening so that the lid top surface is flush with the top surface of the base top wall and friction welding the lid to the base.
摘要翻译： 一种制造流体冷却组件的方法，其包括形成限定内部空隙空间并具有顶壁的基部的基部，所述顶壁具有顶表面并且限定通过所述顶壁至少一个开口到所述空隙空间，所述基部 进一步将流体入口和出口定义为空隙空间，顶壁由可以摩擦搅拌焊接的材料制成。 具有与开口基本一致的尺寸和形状的盖子具有限定一组向下延伸的销的顶表面和底表面，并且由可以摩擦搅拌焊接到基座的材料形成， 打开，使得盖顶表面与基座顶壁的顶表面齐平并且将盖摩擦焊接到基座。
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公开(公告)号：US5565705A
公开(公告)日：1996-10-15
申请号：US235992
申请日：1994-05-02
IPC分类号： H01L23/36 , H01L23/40 , H01L23/473 , H01L25/065 , H01L25/07 , H01L25/18 , H01L23/34
CPC分类号： H01L23/473 , H01L25/0652 , H01L2924/0002
摘要： An electronic module (10) for removing heat from a semiconductor die (41) and a method of making the electronic module (10). The electronic module (10) has a baseplate (11) mated with an isolation structure (23). The isolation structure (23) has three portions: a first portion is bonded to the top surface (12) of the baseplate (11), a second portion is bonded to the bottom surface (13) of the baseplate (11), and a third portion is bonded to a side (14) of the baseplate (11). A semiconductor die (41) is bonded to the first portion of the isolation structure (23) and another semiconductor die (41) is bonded to the second portion of the isolation structure (23). The baseplate (11) has a cavity (20) through which a fluid flows and transports heat away from each semiconductor die (41).
摘要翻译： 一种用于从半导体管芯（41）去除热量的电子模块（10）和制造电子模块（10）的方法。 电子模块（10）具有与隔离结构（23）配合的基板（11）。 隔离结构（23）具有三个部分：第一部分结合到基板（11）的顶表面（12），第二部分结合到基板（11）的底表面（13），并且 第三部分结合到基板（11）的一侧（14）。 半导体管芯（41）接合到隔离结构（23）的第一部分，另一个半导体管芯（41）接合到隔离结构（23）的第二部分。 基板（11）具有空腔（20），流体通过该空腔流动并将热量从每个半导体管芯（41）传送出去。
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公开(公告)号：US5533257A
公开(公告)日：1996-07-09
申请号：US247932
申请日：1994-05-24
IPC分类号： H01L21/48 , H01L23/367 , B23P15/26
CPC分类号： H01L23/3672 , H01L21/4882 , H01L2924/0002 , Y10T29/4935
摘要： A heat dissipation apparatus having a base structure (11) and fins (29, 43) and a method for making the heat dissipation apparatus. The base structure (11) is formed as a molded porous preform structure having a top surface (12), a bottom surface (13), and grooves (14) in the bottom surface (13). A layer of dielectric material (17) is placed on the top surface (12) and the porous base structure is infiltrated with a conductive material, thereby bonding the layer of dielectric material (17) to the base structure (11). The grooves (14) are coated with a conductive epoxy and the fins (29) are inserted into the grooves (14) to form a heat dissipation apparatus (30). Alternatively, the fins (43) are formed when the porous base structure is infiltrated with the conductive material, thereby forming a unitary heat dissipation apparatus (44).
摘要翻译： 一种具有基部结构（11）和散热片（29,43）的散热装置及其制造方法。 基部结构（11）形成为在底面（13）中具有顶表面（12），底表面（13）和凹槽（14）的模制多孔预型体结构。 介电材料层（17）放置在顶表面（12）上，并且多孔基底结构被导电材料渗透，由此将电介质材料层（17）粘合到基座结构（11）上。 凹槽（14）涂覆有导电环氧树脂，翅片（29）插入凹槽（14）中以形成散热装置（30）。 或者，当多孔基底结构被导电材料渗透时形成翅片（43），从而形成一体的散热装置（44）。
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公开(公告)号：US5440787A
公开(公告)日：1995-08-15
申请号：US154819
申请日：1993-11-19
申请人： Raul Figueroa , Guillermo L. Romero
发明人： Raul Figueroa , Guillermo L. Romero
CPC分类号： A44B11/2592 , A41D25/04 , A44B11/006 , Y10S24/50 , Y10T24/1903 , Y10T24/2708 , Y10T24/45194 , Y10T24/45969 , Y10T24/4709
摘要： A clasp for cloth neckwear and the like including a first clamping member designed to substantially encircle a first end of the neckwear and fixedly clamp the first end in a retained position, a second clamping member designed to substantially encircle a second end of the neckwear and fixedly clamp the second end in a retained position, and clasping means mounted on the first and second clamping members, the clasping means being manually engageable and disengageable for forming the neckwear into a continuous loop about the neck of a wearer. The neckwear is tied with a standard knot and severed in the back to provide the two ends and the clamping members are affixed to the ends after stretching the cloth slightly.
摘要翻译： 一种用于布衣领等的扣环，包括设计成基本上环绕颈衣的第一端并将第一端固定地夹持在保持位置的第一夹紧构件，设计成基本上环绕颈衣的第二端并固定地固定的第二夹紧构件 将第二端夹持在保持位置，并且紧固装置安装在第一和第二夹紧构件上，夹紧装置可手动地接合和脱离，以将颈衣形成围绕穿着者的颈部的连续环路。 颈部用标准的结扣起，并在后面切断以提供两端，并且夹紧件在稍微拉伸布之后固定到端部。
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公开(公告)号：US5371043A
公开(公告)日：1994-12-06
申请号：US255533
申请日：1994-05-25
IPC分类号： H01L23/02 , H01L23/373 , H01L23/473 , H01L25/07 , H03B1/00 , H03B7/06 , H01L21/60
CPC分类号： H01L25/072 , H01L23/3731 , H01L2924/0002 , H01L2924/3011 , H03B2200/0034 , H03B2200/004 , H03B2201/0208 , H03B7/06 , Y10T29/4913
摘要： A method for forming a power circuit package (45) having a porous base structure (20) electrically isolated from a first porous die mount (21) and a second porous die mount (22) by a dielectric material (29). The porous base structure (20) is bonded to a second surface of the the dielectric material (29) whereas the first porous die mount (21 ) , and the second porous die mount (22 ) are bonded to a first surface of the dielectric material (29). Simultaneous with the bonding step, the porous base structure (20) , the first porous die mount (21) , and the second porous die mount (22) are impregnated with a conductive material. Semiconductor die (32, 33, 34, and 35) are bonded to the impregnated die mounts. The semiconductor die (32, 33, 34, and 35) are then encapsulated by a molding compound.
摘要翻译： 一种用于形成具有通过介电材料（29）与第一多孔管芯安装件（21）电隔离的多孔基底结构（20）和第二多孔管芯安装件（22）的电源电路封装（45）的方法。 所述多孔基底结构（20）与所述电介质材料（29）的第二表面接合，而所述第一多孔模座（21）和所述第二多孔模座（22）与所述电介质材料 （29）。 与接合步骤同时，多孔基底结构（20），第一多孔模座（21）和第二多孔模座（22）浸渍有导电材料。 半导体管芯（32,33,34和35）与浸渍的模具安装座结合。 然后，半导体管芯（32,33,34和35）被模塑料包封。
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公开(公告)号：US5915463A
公开(公告)日：1999-06-29
申请号：US620522
申请日：1996-03-23
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H05K7/20909 , H01L23/473 , H01L2924/0002
摘要： A heat dissipation apparatus (51) has a lid (12) and an optimized fin arrangement (16) located in a cavity (57) of a base (11). Semiconductor chips (41, 42, 43, 44, 45, and 46) are coupled to the lid (12), and a heat conducting medium (47) is forced into the cavity (57) through a port (13) and out of the cavity (57) through a different port (14). Heat generated by the semiconductor chips (41, 42, 43, 44, 45, and 46) is thermally conducted into the fin arrangement (16) and then transferred into the heat conducting medium (47).
摘要翻译： 散热装置（51）具有位于基座（11）的空腔（57）中的盖（12）和优化的翅片布置（16）。 半导体芯片（41,42,43,44,45和46）联接到盖子（12）上，并且导热介质（47）通过端口（13）被迫进入空腔（57） 空腔（57）通过不同的端口（14）。 由半导体芯片（41,42,43,44,45和46）产生的热量被热传导到散热片装置（16）中，然后转移到导热介质（47）中。
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公开(公告)号：US5616886A
公开(公告)日：1997-04-01
申请号：US464112
申请日：1995-06-05
IPC分类号： H01L23/12 , H01L23/057 , H01L23/498 , H01L25/04 , H01L25/18 , H01L23/02
CPC分类号： H01L24/82 , H01L23/057 , H01L23/49861 , H01L24/24 , H01L2224/24137 , H01L2224/24227 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/30107
摘要： A wirebondless module package and method of fabrication including a molded preform of porous SiC with a cavity having therein an AlN substrate defining a plurality of pockets. The preform being infiltrated with Al and the Al being deposited in each of the pockets. A semiconductor die mounted on the Al in one of the pockets. A dielectric layer covering the Al and defining openings therethrough positioned to expose the aluminum and a connection to the die. A conductive material positioned on the dielectric layer in contact with the die and the Al so as to define terminals and interconnections between the die and the terminals.
摘要翻译： 一种无引线模块封装和制造方法，包括多孔SiC的模制预制件，其中具有限定多个凹穴的AlN衬底的空腔。 预制件被Al渗透，并且Al沉积在每个口袋中。 安装在其中一个凹穴中的Al上的半导体管芯。 覆盖Al并且限定穿过其中的开口的介电层，以暴露铝和与管芯的连接。 位于电介质层上的与导体和Al接触的导电材料，以便限定晶片和端子之间的端子和互连。
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公开(公告)号：US5465481A
公开(公告)日：1995-11-14
申请号：US130824
申请日：1993-10-04
申请人： Guillermo L. Romero
发明人： Guillermo L. Romero
IPC分类号： H01L23/04 , H01L23/053 , H01L23/06 , H01L23/373 , H01L25/16 , H05K3/34
CPC分类号： H01L23/04 , H01L23/053 , H01L23/06 , H01L23/3733 , H01L25/165 , H01L2924/0002 , Y10T29/49144
摘要： A semiconductor package (100) and module (300) includes a unitary base structure (101) and alignment mechanisms (104). The unitary base structure (101) includes a semiconductor mounting area (102) and encircling walls (103). The structure provides resistance to bowing as compared to a flat base. The lack of bowing provides improved thermal contact to a cold plate of the operating environment. The lack of bowing also reduces certain failure modes. The alignment mechanism (104) aligns module components during assembly, thereby simplifying assembly by eliminating the need for complicated fixtures which hold components in place.
摘要翻译： 半导体封装（100）和模块（300）包括整体基础结构（101）和对准机构（104）。 整体式基座结构（101）包括半导体安装区域（102）和环绕壁（103）。 与平底座相比，该结构提供了抗弯曲性。 缺乏弯曲提供了与操作环境的冷板的热接触。 缺乏弯曲也降低了某些失效模式。 对准机构（104）在组装期间对准模块部件，从而通过消除对将部件保持在适当位置的复杂夹具的需要来简化组装。
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