公开(公告)号：US20180047696A1

公开(公告)日：2018-02-15

申请号：US15782182

申请日：2017-10-12

Applicant: Renesas Electronics Corporation

Inventor： Jun YAMADA ,  Takafumi BETSUI

IPC: H01L23/00 ,  H01L23/14 ,  H01L23/498 ,  H01L23/48 ,  H01L23/31 ,  H01L25/065 ,  H01L23/538 ,  H05K3/32

CPC classification number: H01L24/33 ,  H01L23/145 ,  H01L23/31 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/065 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/13009 ,  H01L2224/13147 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13564 ,  H01L2224/13565 ,  H01L2224/13578 ,  H01L2224/13611 ,  H01L2224/13686 ,  H01L2224/16146 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/335 ,  H01L2224/33515 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/13091 ,  H01L2924/15333 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K3/323 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/04941

Abstract: A semiconductor integrated circuit chip, in which multi-core processors are integrated, is usually mounted over an organic wiring board by FC bonding to form a BGA package by being integrated with the substrate. In such a structure, power consumption is increased, and hence the power supplied only from a peripheral portion of the chip is insufficient, so that a power supply pad is also provided in the chip central portion. However, because of an increase in the wiring associated with the integration of a plurality of CPU cores, etc., there occurs a portion between the peripheral portion and the central portion of the chip, where a power supply pad cannot be arranged. According to the outline of the present application, in a semiconductor integrated circuit device such as a BGA, etc., in which a semiconductor chip is mounted over an interposer, such as a multilayer organic wiring board, in a face-up manner, a first group of metal through electrodes, which are provided in the semiconductor chip to supply a power supply potential to a core circuit, etc., and a first metal land over the interposer are interconnected by a first conductive adhesive member film.

公开(公告)号：US20150116968A1

公开(公告)日：2015-04-30

申请号：US14523862

申请日：2014-10-25

Applicant: Renesas Electronics Corporation

Inventor： Jun YAMADA ,  Takafumi BETSUI

IPC: H01L23/00 ,  H05K1/18 ,  H05K1/11 ,  H01L23/538 ,  H05K1/03

CPC classification number: H01L24/33 ,  H01L23/145 ,  H01L23/31 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/065 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/13009 ,  H01L2224/13147 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13564 ,  H01L2224/13565 ,  H01L2224/13578 ,  H01L2224/13611 ,  H01L2224/13686 ,  H01L2224/16146 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/335 ,  H01L2224/33515 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/13091 ,  H01L2924/15333 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K3/323 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/04941

Abstract: A semiconductor integrated circuit chip, in which multi-core processors are integrated, is usually mounted over an organic wiring board by FC bonding to form a BGA package by being integrated with the substrate. In such a structure, power consumption is increased, and hence the power supplied only from a peripheral portion of the chip is insufficient, so that a power supply pad is also provided in the chip central portion. However, because of an increase in the wiring associated with the integration of a plurality of CPU cores, etc., there occurs a portion between the peripheral portion and the central portion of the chip, where a power supply pad cannot be arranged. According to the outline of the present application, in a semiconductor integrated circuit device such as a BGA, etc., in which a semiconductor chip is mounted over an interposer, such as a multilayer organic wiring board, in a face-up manner, a first group of metal through electrodes, which are provided in the semiconductor chip to supply a power supply potential to a core circuit, etc., and a first metal land over the interposer are interconnected by a first conductive adhesive member film.

Abstract translation: 集成了多核处理器的半导体集成电路芯片通常通过FC结合安装在有机布线板上，通过与衬底集成来形成BGA封装。 在这样的结构中，功率消耗增加，因此仅从芯片的周边部供给的功率不足，从而在芯片中心部分也设置电源焊盘。 然而，由于与多个CPU核心等的集成相关联的布线的增加，在芯片的周边部分和中心部分之间出现一部分，其中不能布置电源焊盘。 根据本申请的概要，在诸如BGA等的半导体集成电路器件中，其中将半导体芯片以面朝上的方式安装在诸如多层有机布线板的中介层之上， 第一组金属通孔电极设置在半导体芯片中以向芯电路等提供电源电位，并且第一金属焊盘通过第一导电粘合构件膜互连。