摘要:
One embodiment of the present invention provides a capacitively-coupled receiver amplifier that has an input with no DC coupling. A DC voltage is programmed on the input. During programming, a transmitter is held at a voltage at a midpoint between a voltage that represents a logical “1” and a voltage that represents a logical “0” and the input voltage of the receiver amplifier is programmed to be substantially the switching-threshold voltage for the receiver amplifier. Then, during normal data communication, the transmitter drives high and low electrical signals that are coupled to the receiver amplifier. Since the input of the receiver amplifier has been substantially set to the DC voltage, the receiver amplifier need not control the DC voltage of the input for each transition in the electrical signals.
摘要:
One embodiment of the present invention provides a system that facilitates capacitive inter-chip communication. During operation, the system first determines an alignment between a first semiconductor die and a second semiconductor die. Next, electrical signals are selectively routed to at least one interconnect pad in a plurality of interconnect pads based on the alignment thereby facilitating communication between the first semiconductor die and the second semiconductor die. The plurality of interconnect pads can include transmitting pads, receiving pads, and transmitting and receiving pads. The alignment may be determined continuously or at times separated by an interval, where the interval is fixed or variable. Several variations on this embodiment are provided.
摘要:
One embodiment of the present invention provides an electronic circuit and method for measuring a capacitance. A signal generating mechanism generates a signal having a predefined frequency and predefined low and high voltage levels on one terminal of the capacitance. The other terminal of the capacitance is coupled to a switching mechanism. The switching mechanism is set to couple the other terminal of the capacitance to a first amplifier or a second amplifier for a portion of each signal cycle thereby full-wave rectifying a transient current flowing between the two terminals in the capacitance. Outputs of the first amplifier and the second amplifier are coupled to a current measurement mechanism for measuring the current. The capacitance is determined from the measured current. Several variations on this embodiment are provided.
摘要:
One embodiment of the present invention provides an electronic circuit and method for measuring a capacitance. A signal generating mechanism generates a signal having a predefined frequency and predefined low and high voltage levels on one terminal of the capacitance. The other terminal of the capacitance is coupled to a switching mechanism. The switching mechanism is set to couple the other terminal of the capacitance to a first amplifier or a second amplifier for a portion of each signal cycle thereby full-wave rectifying a transient current flowing between the two terminals in the capacitance. Outputs of the first amplifier and the second amplifier are coupled to a current measurement mechanism for measuring the current. The capacitance is determined from the measured current. Several variations on this embodiment are provided.
摘要:
A semiconductor die is described. This semiconductor die includes a driver, and a spatial alignment transducer that is electrically coupled to the driver and which is proximate to a surface of the semiconductor die. The driver establishes a spatially varying electric charge distribution in at least one direction in the spatial alignment transducer, thereby facilitating determination of a spatial alignment in more than one direction between the semiconductor die and another semiconductor die. In particular, a spatial alignment sensor proximate to the surface of the other semiconductor die may detect an electrical field (or an associated electrostatic potential) associated with the spatially varying electric charge distribution. This detected electric field may allow the vertical spacing between the surfaces of the semiconductor dies and/or an angular alignment of the semiconductor dies to be determined.
摘要:
A semiconductor die is described. This semiconductor die includes a driver, and a spatial alignment transducer that is electrically coupled to the driver and which is proximate to a surface of the semiconductor die. The driver establishes a spatially varying electric charge distribution in at least one direction in the spatial alignment transducer, thereby facilitating determination of a spatial alignment in more than one direction between the semiconductor die and another semiconductor die. In particular, a spatial alignment sensor proximate to the surface of the other semiconductor die may detect an electrical field (or an associated electrostatic potential) associated with the spatially varying electric charge distribution. This detected electric field may allow the vertical spacing between the surfaces of the semiconductor dies and/or an angular alignment of the semiconductor dies to be determined.
摘要:
A memory module is formed of multiple memory chips and an optical interface chip fixed on a substrate. The chips are interconnected by proximity communication (PxC) in which each chip includes transmitting and receiving elements, such as electrical pads which form capacitively coupled links when the chips are placed together with their pads facing each other. The PxC links may be directly between the chips or through an intermediate passive bridge chip. The interface chip is coupled to an external optical channel and includes converters between optical and electrical signals, control circuitry, buffers, and PxC elements for communicating with the memory chips. The array of memories may be a linear or two-dimensional array around the interface chip forming a redundant PxC network, optionally with redundant PxC connections. Multiple rectangular memory chips may present their narrow sides to the interface chip to maximize bandwidth.
摘要:
A memory module is formed of multiple memory chips and an optical interface chip fixed on a substrate. The chips are interconnected by proximity communication (PxC) in which each chip includes transmitting and receiving elements, such as electrical pads which form capacitively coupled links when the chips are placed together with their pads facing each other. The PxC links may be directly between the chips or through an intermediate passive bridge chip. The interface chip is coupled to an external optical channel and includes converters between optical and electrical signals, control circuitry, buffers, and PxC elements for communicating with the memory chips. The array of memories may be a linear or two-dimensional array around the interface chip forming a redundant PxC network, optionally with redundant PxC connections. Multiple rectangular memory chips may present their narrow sides to the interface chip to maximize bandwidth.
摘要:
One embodiment of the present invention provides a system that electronically aligns mini-bars on different semiconductor chips which are situated face-to-face to facilitate communication between the semiconductor chips through capacitive coupling. During operation, the system measures an alignment between a first chip and a second chip. The system then selects a group of transmitter mini-bars on the first chip to form a transmitter bit position based on the measured alignment. In this way, the system allows a data signal to be distributed to and transmitted by the mini-bars that form the transmitter bit position. The system also selects a group of receiver mini-bars on the second chip to form a receiver bit position based on the measured alignment. Next, the system associates transmitter bit positions on the first chip with proximate receiver bit positions on the second chip based on the measured alignment. In this way, the system allows data signals transmitted by the mini-bars within a transmitter bit position on the first chip to be collectively received by the mini-bars within an associated receiver bit position on the second chip.
摘要:
A system is presented for latching and amplifying a capacitively coupled inter-chip communication signal that operates by receiving an input signal on a capacitive receiver pad and feeding the input signal through an inverter to produce an output signal. The output signal is fed back through a weakened inverter to produce a feedback signal that is fed into an input of the inverter to form a latch for the input signal. The weakened inverter is biased to produce a feedback signal that swings between a high bias voltage, VH, and a low bias voltage, VL. VH is set slightly higher than the switching threshold of the inverter, and VL is set slightly lower than the switching threshold. This feedback signal causes the input signal to reside within a narrow voltage range near the switching threshold of the inverter, thereby making the inverter sensitive to small transitions in the input signal.
摘要翻译:提出了一种用于锁存和放大电容耦合的芯片间通信信号的系统,其通过接收电容性接收器焊盘上的输入信号并通过反相器馈送输入信号以产生输出信号来操作。 输出信号通过弱化逆变器反馈,产生反馈信号,该反馈信号馈送到反相器的输入端,形成输入信号的锁存器。 弱化的逆变器被偏置以产生在高偏置电压V H H和低偏压V L之间摆动的反馈信号。 V H设定得比逆变器的切换阈值略高,并且将V L L设定得比切换阈值略低。 该反馈信号使得输入信号驻留在接近逆变器的开关阈值的窄电压范围内,从而使得反相器对输入信号中的小转变敏感。