公开(公告)号：US08659135B2

公开(公告)日：2014-02-25

申请号：US11572873

申请日：2005-07-21

申请人： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vllsmeler ,  Holger Woerner ,  Bernhard Zuhr

发明人： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vllsmeler ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/488

CPC分类号： H01L25/0657 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate, which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.

摘要翻译： 公开了一种具有布线基板和半导体器件堆叠的中间布线板的半导体堆叠和半导体基底器件。 在一个实施例中，半导体芯片布置在中间布线板和布线基板之间，其一方面通过布线基板与布线基板的下侧上的外部触点电连接，另一方面与布线基板 接线基板的边缘区域的端子区域。 中间布线板具有成角度的外部扁平导体，其电连接在布线板的接触端子区域中。 此外，在中间布线板的上侧，布置在内部扁平导体的自由端上的是外部接触端子区域，其尺寸和布置对应于要堆叠的半导体器件的外部触点。

公开(公告)号：US07700956B2

公开(公告)日：2010-04-20

申请号：US10561819

申请日：2004-06-04

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L27/15

CPC分类号： H04N5/2253 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0411 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01032 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H04N5/2254 ,  H04N5/2257

摘要： A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.

摘要翻译： 公开了用于生产传感器部件和面板。 除了具有传感器区域的传感器芯片之外，传感器部件还具有后侧和无源部件。 它们共同地嵌入塑料组合物中，使得它们各自的电极可以从塑料板的整个顶侧布线。

公开(公告)号：US07391103B2

公开(公告)日：2008-06-24

申请号：US10928458

申请日：2004-08-27

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Holger Woerner ,  Peter Strobel

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Holger Woerner ,  Peter Strobel

IPC分类号： H01L23/02

CPC分类号： H01L24/82 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2224/96 ,  H01L2224/82

摘要： The invention relates to an electronic module having plug contacts, which has a semiconductor chip embedded in a plastics composition with its rear side and its edge sides. An active top side of the semiconductor chip forms, together with the plastics composition, an overall top side, there being arranged on the latter a rewiring layer with plug contact areas and rewiring lines that connect the plug contact areas to contact areas of the top side of the semiconductor chip.

摘要翻译： 本发明涉及一种具有插头触点的电子模块，其具有嵌入塑料组合物中的半导体芯片，其后侧及其边缘侧。 半导体芯片的有源顶侧与塑料组合物一起形成整个顶侧，其上布置有具有插头接触区域的重新布线层和将插头接触区域连接到顶侧的接触区域的重新布线 的半导体芯片。

公开(公告)号：US20060175419A1

公开(公告)日：2006-08-10

申请号：US11341892

申请日：2006-01-30

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： G06K19/06

CPC分类号： H01L21/568 ,  G06K19/07743 ,  G06K19/07745 ,  G06K19/07747 ,  H01L21/561 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L24/96 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.

公开(公告)号：US20050087851A1

公开(公告)日：2005-04-28

申请号：US10928458

申请日：2004-08-27

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Holger Woerner ,  Peter Strobel

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Holger Woerner ,  Peter Strobel

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/02

CPC分类号： H01L24/82 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2224/96 ,  H01L2224/82

摘要： The invention relates to an electronic module having plug contacts, which has a semiconductor chip embedded in a plastics composition with its rear side and its edge sides. An active top side of the semiconductor chip forms, together with the plastics composition, an overall top side, there being arranged on the latter a rewiring layer with plug contact areas and rewiring lines that connect the plug contact areas to contact areas of the top side of the semiconductor chip.

摘要翻译： 本发明涉及一种具有插头触点的电子模块，其具有嵌入塑料组合物中的半导体芯片，其后侧及其边缘侧。 半导体芯片的有源顶侧与塑料组合物一起形成整个顶侧，其上布置有具有插头接触区域的重新布线层和将插头接触区域连接到顶侧的接触区域的重新布线 的半导体芯片。

公开(公告)号：US20080284043A1

公开(公告)日：2008-11-20

申请号：US10598483

申请日：2005-02-23

申请人： Robert-Christian Hagen ,  Jens Pohl

发明人： Robert-Christian Hagen ,  Jens Pohl

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A base semiconductor component for a semiconductor component stack is disclosed. In one embodiment, the base semiconductor component has a semiconductor chip arranged centrally on a stiff wiring substrate. The wiring substrate has, in its edge regions, contact pads which are electrically connected to external contacts and at the same time to contact areas of the semiconductor chip and also to stack contact areas. The stack contact areas simultaneously form the upper side of the base semiconductor component and have an arrangement pattern corresponding to an arrangement pattern of external contacts of a semiconductor component to be stacked.

摘要翻译： 公开了一种用于半导体部件堆叠的基底半导体部件。 在一个实施例中，基底半导体部件具有中央布置在刚性布线基板上的半导体芯片。 布线基板在其边缘区域中具有电连接到外部触点并且同时接触半导体芯片的区域并且还与堆叠接触区域的接触焊盘。 堆叠接触区域同时形成基底半导体部件的上侧，并且具有对应于待堆叠的半导体部件的外部触头的布置图案的布置图案。

公开(公告)号：US07327023B2

公开(公告)日：2008-02-05

申请号：US11246545

申请日：2005-10-11

申请人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/48 ,  H01L23/02 ,  H01L23/52 ,  H01L23/40

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。

公开(公告)号：US20070278639A1

公开(公告)日：2007-12-06

申请号：US11572873

申请日：2005-07-21

申请人： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/02 ,  H01L21/00 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.

摘要翻译： 公开了一种具有布线基板和半导体器件堆叠的中间布线板的半导体堆叠和半导体基底器件。 在一个实施例中，半导体芯片布置在中间布线板和布线基板之间，该布线基板一方面通过布线基板与布线基板的下侧的外部触点电连接，另一方面与布线基板 布线基板的边缘区域的区域。 中间布线板具有成角度的外部扁平导体，其电连接在布线板的接触端子区域中。 此外，在中间布线板的上侧，布置在内部扁平导体的自由端上的是外部接触端子区域，其尺寸和布置对应于要堆叠的半导体器件的外部触点。

公开(公告)号：US07755178B2

公开(公告)日：2010-07-13

申请号：US10598483

申请日：2005-02-23

申请人： Robert-Christian Hagen ,  Jens Pohl

发明人： Robert-Christian Hagen ,  Jens Pohl

IPC分类号： H01L23/498

CPC分类号： H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A base semiconductor component for a semiconductor component stack is disclosed. In one embodiment, the base semiconductor component has a semiconductor chip arranged centrally on a stiff wiring substrate. The wiring substrate has, in its edge regions, contact pads which are electrically connected to external contacts and at the same time to contact areas of the semiconductor chip and also to stack contact areas. The stack contact areas simultaneously form the upper side of the base semiconductor component and have an arrangement pattern corresponding to an arrangement pattern of external contacts of a semiconductor component to be stacked.

摘要翻译： 公开了一种用于半导体部件堆叠的基底半导体部件。 在一个实施例中，基底半导体部件具有中央布置在刚性布线基板上的半导体芯片。 布线基板在其边缘区域中具有电连接到外部触点并且同时接触半导体芯片的区域并且还与堆叠接触区域的接触焊盘。 堆叠接触区域同时形成基底半导体部件的上侧，并且具有对应于待堆叠的半导体部件的外部触头的布置图案的布置图案。

公开(公告)号：US20070128754A1

公开(公告)日：2007-06-07

申请号：US10561819

申请日：2004-06-04

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L21/00 ,  H01L29/82

CPC分类号： H04N5/2253 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0411 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01032 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H04N5/2254 ,  H04N5/2257

摘要： A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.

摘要翻译： 公开了用于生产传感器部件和面板。 除了具有传感器区域的传感器芯片之外，传感器部件还具有后侧和无源部件。 它们共同地嵌入塑料组合物中，使得它们各自的电极可以从塑料板的整个顶侧布线。