公开(公告)号：US09565758B2

公开(公告)日：2017-02-07

申请号：US14140192

申请日：2013-12-24

申请人： Rockwell Collins, Inc.

发明人： Nathan P. Lower ,  Alan P. Boone ,  Ross K. Wilcoxon ,  David D. Hillman

IPC分类号： H05K1/03 ,  C09D1/02 ,  C09D5/32 ,  C23D5/00 ,  H01F1/08 ,  H01F1/113 ,  H01L31/048 ,  H01L31/055 ,  B29D23/00 ,  H02S40/20

CPC分类号： H05K1/0306 ,  B29D23/00 ,  C09D1/02 ,  C09D5/32 ,  C23D5/00 ,  C23D5/005 ,  H01F1/083 ,  H01F1/113 ,  H01L31/048 ,  H01L31/055 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01037 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H02S40/20 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A coating for reducing interaction between a surface and the environment around the surface includes an alkali silicate glass material configured to protect the surface from environmental corrosion due to water or moisture. The alkali silicate glass material is doped with a first element to affect various forms of radiation passing through the coating. The electromagnetic radiation is at least one of ultraviolet, x-ray, atomic (gamma, alpha, beta), and electromagnetic or radio wave radiation. The coating may also be used to protect a solar cell from the environment and UV rays while retransmitting received light as usable light for conversion into electrical energy. The coating may also be used to prevent whisker formation in metal finishes of tin, cadmium, zinc, etc.

摘要翻译： 用于减少表面和表面周围环境之间的相互作用的涂层包括碱性硅酸盐玻璃材料，其被配置为保护表面免受水或水分的环境腐蚀。 碱性硅酸盐玻璃材料掺杂有第一元素以影响通过涂层的各种形式的辐射。 电磁辐射是紫外线，X射线，原子（γ，α，β）和电磁或无线电波辐射中的至少一种。 涂层还可以用于保护太阳能电池免受环境和紫外线的影响，同时将接收到的光作为可用光转发到电能。 该涂层也可用于防止在锡，镉，锌等金属表面形成晶须。

公开(公告)号：US11474576B1

公开(公告)日：2022-10-18

申请号：US16523216

申请日：2019-07-26

申请人： Rockwell Collins, Inc.

发明人： Alan P. Boone ,  Brandon C. Hamilton ,  Kyle B. Snyder ,  Bryan M. Jefferson

IPC分类号： G06F1/20 ,  G01K7/42 ,  G01K7/01 ,  G05D23/19 ,  G05D23/20 ,  G05D23/22 ,  G05D23/24 ,  G01K7/02

摘要： An electrical device with thermally controlled performance is disclosed. The electrical device includes at least one die with a plurality of device components disposed upon or at least partially embedded within the die. The electrical device further includes a plurality of signal paths interconnecting the plurality of device components. The electrical device further includes a plurality of temperature sensors disposed upon or at least partially embedded within the die. The temperature sensors are configured to detect thermal loads at respective portions of the die. The electrical device further includes at least one controller disposed upon or at least partially embedded within the die. The controller is configured to adjust one or more operating parameters for one or more of the device components based on the thermal loads detected by the temperature sensors.

公开(公告)号：US10727203B1

公开(公告)日：2020-07-28

申请号：US15974057

申请日：2018-05-08

申请人： Rockwell Collins, Inc.

发明人： Reginald D. Bean ,  Brandon C. Hamilton ,  Steven J. Wiebers ,  Alan P. Boone

IPC分类号： H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L23/31 ,  H01L23/552

摘要： A system-in-package (SIP) incorporating die-in-die cavity packaging may include hybrid dies fabricated by milling or otherwise creating a cavity through the additive surfaces of a primary application specific integrated circuit (ASIC) die configured for flip-chip bonding and encapsulating a secondary die such as a Flash/non-volatile memory module, analog-digital converter (ADC), or other processing circuit into the cavity. The primary and secondary dies are then connected by the addition of redistribution layers. The resulting hybrid die may then be vertically integrated into the SIP along with additional memory modules or dies.

公开(公告)号：US11233030B1

公开(公告)日：2022-01-25

申请号：US15639932

申请日：2017-06-30

申请人： Rockwell Collins, Inc.

发明人： Brandon C. Hamilton ,  Kyle B. Snyder ,  Alan P. Boone

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L25/00

摘要： An electrical device with printed interconnects between packaged integrated circuit components and a substrate as well as a method for printing interconnects between packaged integrated circuit components and a substrate are disclosed. An electrical device with printed interconnects may include a dielectric layer forming a continuous surface between a substrate and a terminal face of an integrated circuit component. The electrical device may further include interconnects formed from a layer of material printed across the continuous surface formed by the dielectric layer to connect electrical terminals on the substrate to electrical terminals on the terminal face of the integrated circuit component.

公开(公告)号：US09589913B1

公开(公告)日：2017-03-07

申请号：US13853232

申请日：2013-03-29

申请人： Rockwell Collins, Inc.

发明人： Sarah M. Shepard ,  Bret W. Simon ,  Alan P. Boone

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L21/82 ,  H05K1/18 ,  H01L25/065

CPC分类号： H01L23/57 ,  H01L21/82 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/37001 ,  H05K1/181 ,  H01L2924/00

摘要： An interposer and a method for stacking dies utilizing such an interposer in an integrated circuit are disclosed. The interposer includes a substrate and a plurality of vias defined in the substrate. At least one of the plurality of vias of the interposer is positioned to establish a connection with at least one of the plurality of vias of a first die. At least one additional die is positioned to establish a connection with the first die utilizing the connection established between the interposer and the first die through at least one of the vias.

摘要翻译： 公开了一种在集成电路中利用这种插入件堆叠芯片的插入件和方法。 内插器包括衬底和限定在衬底中的多个通孔。 插入器的多个通孔中的至少一个定位成建立与第一管芯的多个通孔中的至少一个的连接。 定位至少一个另外的管芯，以利用通过至少一个通孔在插入件和第一管芯之间建立的连接来与第一管芯建立连接。