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    METHOD AND APPARATUS FOR IMPLEMENTING AUTOMATIC-CALIBRATION OF TDR PROBING SYSTEM
    3.
    发明申请
    METHOD AND APPARATUS FOR IMPLEMENTING AUTOMATIC-CALIBRATION OF TDR PROBING SYSTEM 有权
    实现TDR探测系统自动校准的方法与装置

    公开(公告)号：US20070265793A1

    公开(公告)日：2007-11-15

    申请号：US11781372

    申请日：2007-07-23

    申请人： Roger Booth ,  Matthew Doyle ,  Lynn Landin ,  Thomas Liang ,  Ankur Patel

    发明人： Roger Booth ,  Matthew Doyle ,  Lynn Landin ,  Thomas Liang ,  Ankur Patel

    IPC分类号： G01R35/00

    CPC分类号： G01R35/00

    摘要： A method and apparatus are provided for implementing automatic-calibration of a Time Domain Reflectometer (TDR) probing apparatus. A calibration procedure is performed automatically each time a TDR probe is moved from a device under test (DUT). A current calibration TDR waveform is obtained and compared with a reference calibration TDR waveform, checking for deviations between the current and reference measurements. If a deviation is detected, then the user is notified and calibration is failed.

    摘要翻译： 提供了一种用于实现时域反射计（TDR）探测装置的自动校准的方法和装置。 每次TDR探针从被测设备（DUT）移动时，都会自动执行校准程序。 获得当前的校准TDR波形并与参考校准TDR波形进行比较，检查电流和参考测量之间的偏差。 如果检测到偏差，则通知用户并校准失败。

    METHOD AND APPARATUS FOR IMPLEMENTING VERY HIGH DENSITY PROBING (VHDP) OF PRINTED CIRCUIT BOARD SIGNALS
    4.
    发明申请
    METHOD AND APPARATUS FOR IMPLEMENTING VERY HIGH DENSITY PROBING (VHDP) OF PRINTED CIRCUIT BOARD SIGNALS 失效
    实现印刷电路板信号非常高密度探测（VHDP）的方法和装置

    公开(公告)号：US20050110504A1

    公开(公告)日：2005-05-26

    申请号：US10717748

    申请日：2003-11-20

    申请人： Matthew Doyle ,  Gregory Edlund ,  Brian Gregg ,  Lynn Landin ,  Thomas Liang

    发明人： Matthew Doyle ,  Gregory Edlund ,  Brian Gregg ,  Lynn Landin ,  Thomas Liang

    IPC分类号： G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  G01R31/02

    CPC分类号： G01R31/2808 ,  G01R1/06711 ,  G01R1/07328

    摘要： A method and apparatus are provided for implementing very high density signal probing of a printed circuit board having a pad pattern connected to signals of interest. A metal plate includes a plurality of through holes arranged in a predefined pattern that corresponds to the pad pattern on the printed circuit board. At least one signal module is inserted within a selected one of the through holes of the metal plate. Each signal module defines a coaxial connector for electrical mating engagement with a coaxial cable connector and has an embedded resistor. At least one power/ground module is inserted within a selected one of the through holes. Each power/ground module contains a high dielectric constant material between an outer conductor and a center conductor defining a capacitor. The capacitor provides a low impedance path between the metal plate and a power or ground pad of the printed circuit board.

    摘要翻译： 提供了一种用于实现具有连接到感兴趣的信号的焊盘图案的印刷电路板的非常高密度信号探测的方法和装置。 金属板包括以对应于印刷电路板上的焊盘图案的预定图案布置的多个通孔。 至少一个信号模块插入在金属板的选定的一个通孔内。 每个信号模块定义一个同轴连接器，用于与同轴电缆连接器电配合接合，并具有一个嵌入式电阻器。 至少一个电源/接地模块插入所选择的一个通孔中。 每个电源/接地模块在外部导体和限定电容器的中心导体之间包含高介电常数材料。 电容器在金属板和印刷电路板的电源或接地焊盘之间提供低阻抗路径。

    Method and mesh reference structures for implementing Z-axis cross-talk reduction through copper sputtering onto mesh reference planes
    5.
    发明申请
    Method and mesh reference structures for implementing Z-axis cross-talk reduction through copper sputtering onto mesh reference planes 有权
    用于通过铜溅射实现Z轴串扰降低的网格参考平面的方法和网格参考结构

    公开(公告)号：US20070087556A1

    公开(公告)日：2007-04-19

    申请号：US11250043

    申请日：2005-10-13

    申请人： Roger Booth ,  Matthew Doyle

    发明人： Roger Booth ,  Matthew Doyle

    IPC分类号： H01L21/4763 ,  H01L21/44

    CPC分类号： H05K1/0224 ,  H05K1/0253 ,  H05K3/16 ,  H05K2201/09681 ,  H05K2201/09736

    摘要： A method and mesh reference applications are provided for implementing Z-axis cross-talk reduction. A mesh reference plane including a grid of mesh traces is formed with the mesh traces having selected thickness and width dimensions effective for reference current-flow distribution. An electrically conductive coating is deposited to fill the mesh electrical holes in the mesh reference plane to reduce cross-talk, substantially without affecting mechanical flexibility.

    摘要翻译： 提供了一种实现Z轴串扰降低的方法和网格参考应用。 包括网格轨迹的网格的网格参考平面形成为具有选定的厚度和宽度尺寸的网格轨迹对于参考电流分布有效。 沉积导电涂层以填充网格参考平面中的网格电孔，以减少串扰，基本上不影响机械灵活性。

    Promoting whole body health
    8.
    发明申请
    Promoting whole body health 审中-公开
    促进全身健康

    公开(公告)号：US20070140987A1

    公开(公告)日：2007-06-21

    申请号：US11701848

    申请日：2007-02-01

    申请人： Matthew Doyle ,  Stephen Hunter-Rinderle ,  Robert Singer

    发明人： Matthew Doyle ,  Stephen Hunter-Rinderle ,  Robert Singer

    IPC分类号： A61K9/68 ,  A61K31/4745 ,  A61K8/00 ,  A23K1/165 ,  A61K31/44

    CPC分类号： A61Q11/00 ,  A61K8/347 ,  A61K8/416 ,  A61K8/43 ,  A61K8/49 ,  A61K8/4926 ,  A61K9/006 ,  A61K31/05 ,  A61K31/14 ,  A61K31/155 ,  A61K31/44 ,  A61K31/4745 ,  A61K33/24 ,  A61K33/30 ,  A61K33/34 ,  A61K45/06

    摘要： The present invention relates to promoting whole body health in humans and animals by using topical oral compositions comprising a safe and effective amount of an antimicrobial agent in admixture with a pharmaceutically acceptable carrier, said compositions being effective in controlling bacterial-mediated diseases and conditions present in the oral cavity and in inhibiting the spread into the bloodstream of pathogenic oral bacteria, associated bacterial toxins and endotoxins, and resultant inflammatory cytokines and mediators. The present invention also encompasses methods of use of these compositions by topically applying to the oral cavity, a safe and effective amount of an antimicrobial agent to promote and/or enhance whole body health in humans and other animals.

    摘要翻译： 本发明涉及通过使用包含安全有效量的抗微生物剂与药学上可接受的载体混合的局部口服组合物来促进人和动物的全身健康，所述组合物有效地控制细菌介导的疾病和病症 口腔和抑制扩散到病原性口腔细菌，相关细菌毒素和内毒素的血液中，以及产生的炎性细胞因子和介质。 本发明还包括通过局部施用于口腔使用这些组合物的方法，一种安全有效量的抗微生物剂以促进和/或增强人和其他动物的全身健康。

    Method, apparatus and computer program product for implementing enhanced high frequency return current paths utilizing decoupling capacitors in a package design
    9.
    发明申请
    Method, apparatus and computer program product for implementing enhanced high frequency return current paths utilizing decoupling capacitors in a package design 失效
    用于在封装设计中实现使用去耦电容器的增强型高频返回电流路径的方法，装置和计算机程序产品

    公开(公告)号：US20050108671A1

    公开(公告)日：2005-05-19

    申请号：US10712536

    申请日：2003-11-13

    申请人： Darryl Becker ,  Daniel Douriet ,  Matthew Doyle ,  Andrew Maki ,  Joel Ziegelbein

    发明人： Darryl Becker ,  Daniel Douriet ,  Matthew Doyle ,  Andrew Maki ,  Joel Ziegelbein

    IPC分类号： G06F9/45 ,  G06F17/50 ,  H05K1/02 ,  H05K3/00

    CPC分类号： G06F17/5036 ,  G06F17/5068 ,  H05K1/0231 ,  H05K1/0262 ,  H05K3/0005

    摘要： A method, apparatus and computer program product are provided for implementing high frequency return current paths utilizing decoupling capacitors within electronic packages. Electronic package physical design data are received for identifying a board layout. For each of a plurality of cells in a grid of a set cell size within the identified board layout, a respective number of signal vias are identified. A ratio of signal vias to return current paths is calculated for each of the plurality of cells. Each cell having a calculated ratio greater than a target ratio is identified. One or more decoupling capacitors are selectively added within each of the identified cells to provide high frequency return current paths.

    摘要翻译： 提供了一种方法，装置和计算机程序产品，用于在电子封装内实现使用去耦电容器的高频返回电流路径。 接收电子封装物理设计数据以识别电路板布局。 对于在所识别的板布局内的设置单元尺寸的网格中的多个单元中的每一个，识别相应数量的信号通孔。 针对多个单元中的每个单元计算信号通孔与返回电流路径的比率。 识别具有大于目标比率的计算比率的每个单元。 每个识别的单元中选择性地添加一个或多个去耦电容器，以提供高频返回电流路径。

    Method, structure, and computer program product for implementing high frequency return current paths within electronic packages
    10.
    发明申请
    Method, structure, and computer program product for implementing high frequency return current paths within electronic packages 失效
    用于实现电子封装内高频返回电流路径的方法，结构和计算机程序产品

    公开(公告)号：US20050086623A1

    公开(公告)日：2005-04-21

    申请号：US10682135

    申请日：2003-10-09

    申请人： Darryl Becker ,  Daniel Douriet ,  Matthew Doyle ,  Andrew Maki ,  Joel Ziegelbein

    发明人： Darryl Becker ,  Daniel Douriet ,  Matthew Doyle ,  Andrew Maki ,  Joel Ziegelbein

    IPC分类号： G06F17/50 ,  G06F9/45

    CPC分类号： G06F17/5068 ,  G06F17/5036

    摘要： A method, structure and computer program product are provided for implementing high frequency return current paths within electronic packages. Electronic package physical design data is received for identifying a design layout. For each of a plurality of cells in a grid of a set cell size within the identified design layout, a respective number of signal vias, reference voltage vias, and ground vias are identified. A signal to reference via ratio is calculated for each of the plurality of cells. Each cell having a calculated signal to reference via ratio greater than a target ratio is identified. Vias are selectively added within each of the identified cells for providing high frequency return current paths.

    摘要翻译： 提供了一种方法，结构和计算机程序产品，用于在电子封装内实现高频返回电流路径。 收到电子包物理设计数据，用于识别设计布局。 对于所识别的设计布局内的设置单元尺寸的网格中的多个单元格中的每一个，识别相应数量的信号通孔，参考电压通孔和接地通孔。 针对多个单元中的每个单元计算信号到参考通孔比。 识别具有大于目标比率的计算出的参考通路比的信号的每个单元。 选择性地在每个所识别的单元中添加通孔以提供高频返回电流路径。