公开(公告)号：US20240308841A1

公开(公告)日：2024-09-19

申请号：US18601334

申请日：2024-03-11

Applicant: ROHM CO., LTD.

Inventor： Toma FUJITA ,  Martin Wilfried HELLER ,  Daisuke KAMINISHI ,  Naoki IZUMI

IPC: B81B3/00

CPC classification number: B81B3/0021 ,  B81B2201/0235 ,  B81B2203/0163 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2207/07

Abstract: The present disclosure provides a MEMS device including a device wafer, a cap wafer and a bonding layer. The device wafer includes: a device substrate, having a first main surface, a second main surface opposite to the first main surface, and a cavity recessed along a first direction from the first main surface toward the second main surface; a sensor unit, located within the cavity and mechanically connected to and electrically insulated from the device substrate by a single anchor; and a device wiring, electrically coupled to the sensor unit. The cap wafer includes: a cap substrate, facing the device wafer from a side of the first main surface; and a cap wiring, electrically coupled to the device wiring. The bonding layer bonds the device wafer with the cap wafer, and the device wiring is directly connected to the bonding layer.

公开(公告)号：US20240425360A1

公开(公告)日：2024-12-26

申请号：US18753348

申请日：2024-06-25

Applicant: ROHM CO., LTD.

Inventor： Toma FUJITA ,  Martin HELLER ,  Daisuke KAMINISHI

IPC: B81B3/00 ,  B81C1/00

Abstract: Provided is a MEMS resonator which is inexpensive in manufacturing cost and can secure long-term stability of vibration. A MEMS resonator includes: a substrate; a cavity provided in the substrate; a MEMS structure held within the cavity, the MEMS structure including: an anchor having a first end and a second end, the first end being connected to the substrate; a vibrator connected to the second end of the anchor and held in a hollow; and an electrode disposed around the vibrator, the vibrator and the electrode forming a capacitive vibrator; and a cap layer which is formed over the substrate and seals the MEMS structure therein, in which the anchor includes an isolation joint having an insulation property disposed to electrically insulate the first end from the second end.

公开(公告)号：US20250011159A1

公开(公告)日：2025-01-09

申请号：US18898410

申请日：2024-09-26

Applicant: ROHM CO., LTD.

Inventor： Martin Wilfried HELLER ,  Toma FUJITA

IPC: B81B3/00 ,  G01P15/125

Abstract: An acceleration sensor includes a device-side substrate having a first main surface and a second main surface facing the first main surface, a recessed portion recessed from the first main surface toward the second main surface side, a MEMS electrode that is provided in the recessed portion, includes a fixed electrode having a first fixed electrode and a second fixed electrode electrically insulated from the first fixed electrode, and a movable electrode having a first movable electrode and a second movable electrode electrically insulated from the first movable electrode, and constitutes a differential circuit, and an isolation joint that mechanically connects the first movable electrode and the second movable electrode while electrically insulating the first movable electrode and the second movable electrode.

公开(公告)号：US20240327198A1

公开(公告)日：2024-10-03

申请号：US18619807

申请日：2024-03-28

Applicant: ROHM CO., LTD.

Inventor： Martin Wilfried HELLER ,  Toma FUJITA

IPC: B81B3/00 ,  G01P15/125

CPC classification number: B81B3/0027 ,  G01P15/125 ,  B81B2201/0235 ,  B81B2203/0163 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2203/051

Abstract: An acceleration detection device includes: a substrate including cavity; an anchor mechanically connected to the substrate inside the cavity; a spring mechanically connected to the anchor; a mass mechanically connected to the spring; a first movable electrode mechanically connected to and electrically insulated from the mass; a first fixed electrode mechanically connected to and electrically insulated from the substrate; a pair of second movable electrodes facing each other by being mechanically connected to and electrically insulated from the mass; and a second fixed electrode mechanically connected to and electrically insulated from the substrate to be interposed between the pair of second movable electrodes, the second fixed electrode generating an electrostatic force between the pair of second movable electrodes and the second fixed electrode when a voltage is applied to each of the pair of second movable electrodes and the second fixed electrode.

公开(公告)号：US20230417613A1

公开(公告)日：2023-12-28

申请号：US18337502

申请日：2023-06-20

Applicant: ROHM CO., LTD.

Inventor： Martin Wilfried HELLER ,  Toma FUJITA

IPC: G01L9/00

CPC classification number: G01L9/0047 ,  G01L9/0098

Abstract: A pressure sensor includes: a substrate having first and second main surfaces and having a thickness in first direction; a first chamber recessed from the first main surface in the first direction with respect to the substrate; a second chamber recessed from the first main surface in the first direction with respect to the substrate and adjacent to the first chamber in second direction; a fluid passage recessed from the first main surface in the first direction with respect to the substrate and causing the first chamber to be in fluid communication with an outside; a closing layer laminated on the first main surface of the substrate and closing openings of the first chamber and the second chamber; and a membrane partitioned by the first and second chambers in the second direction and extending in a plane parallel to the first direction and a third direction.

公开(公告)号：US20250019226A1

公开(公告)日：2025-01-16

申请号：US18770989

申请日：2024-07-12

Applicant: ROHM CO., LTD.

Inventor： Toma FUJITA ,  Martin Wilfried HELLER

IPC: B81B3/00 ,  B81C1/00 ,  G01P15/125

Abstract: A MEMS device includes a substrate and a MEMS electrode. The MEMS electrode includes a movable electrode finger relatively movable with respect to the substrate, a fixed electrode finger disposed at an interval from the movable electrode finger, and a beam portion cantilevered on the substrate and connecting the fixed electrode finger to the substrate. The beam portion includes a first portion having a first thermal expansion coefficient and a second portion disposed adjacent to the first portion and having a second thermal expansion coefficient different from the first thermal expansion coefficient. The beam portion is deformed due to a difference between thermal stress generated in the first portion and thermal stress generated in the second portion, and the interval is narrowed due to deformation of the beam portion as compared with an interval formed before the deformation of the beam portion.

公开(公告)号：US20240317579A1

公开(公告)日：2024-09-26

申请号：US18676090

申请日：2024-05-28

Applicant: ROHM CO., LTD.

Inventor： Daisuke KAMINISHI ,  Martin Wilfried HELLER ,  Toma FUJITA

IPC: B81C1/00 ,  B81B7/00 ,  G01P15/125

CPC classification number: B81C1/00269 ,  B81B7/0006 ,  G01P15/125 ,  B81B2201/0235 ,  B81B2203/0353 ,  B81B2203/04 ,  B81C2201/013 ,  B81C2201/0159 ,  B81C2201/0176 ,  B81C2203/037

Abstract: A MEMS sensor includes a bond portion in which a metal structure in a device substrate and a metal laminate are eutectically bonded. The bond portion bonds the device substrate and a lid substrate. The metal laminate is located on a main surface of the lid substrate and facing an exposed portion in the metal structure. The metal laminate includes a first metal and a second metal different from the first metal.

公开(公告)号：US20240208804A1

公开(公告)日：2024-06-27

申请号：US18538105

申请日：2023-12-13

Applicant: ROHM CO., LTD.

Inventor： Martin Wilfried HELLER ,  Toma FUJITA

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0041 ,  B81C1/00293 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C2203/0118

Abstract: A MEMS sensor includes: a first substrate; and a second substrate bonded to the first substrate, wherein at least one space, in which at least one sensor element is arranged, is formed inside at least one bonding portion where the first substrate and the second substrate are bonded, wherein at least one communication path communicating the space with outside of the bonding portion is formed in the first substrate, wherein the communication path includes an inner opening opened toward inside of the bonding portion, an outer opening opened toward outside of the bonding portion, and a tubular portion connecting the inner opening and the outer opening, and wherein the outer opening is closed by a sealing layer sealing the outer opening.

公开(公告)号：US20240092631A1

公开(公告)日：2024-03-21

申请号：US18463708

申请日：2023-09-08

Applicant: ROHM CO., LTD.

Inventor： Yoshiyuki INUI ,  Toma FUJITA

IPC: B81B3/00 ,  B81C3/00

CPC classification number: B81B3/0051 ,  B81C3/001 ,  B81B2201/0235 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C2203/019 ,  B81C2203/035

Abstract: The present disclosure provides a MEMS sensor. The MEMS sensor includes a first substrate having a cavity and a second substrate bonded to the first substrate. The first substrate is provided with an electrode movably disposed in the cavity and a sealed member coupling to the second substrate. The second substrate is provided with a stop member for restricting a movement of the electrode toward the second substrate and a sealing member coupling to the sealed member. The sealed member is formed by a first metal layer on the first substrate. The sealing member is formed by a second metal layer on the second substrate. A polycrystalline layer is formed on the stop member. The polycrystalline layer is disposed between the second substrate and the second metal layer.

公开(公告)号：US20240083741A1

公开(公告)日：2024-03-14

申请号：US18460885

申请日：2023-09-05

Applicant: ROHM CO., LTD.

Inventor： Daisuke NISHINOHARA ,  Hideaki HASHIMOTO ,  Toma FUJITA

IPC: B81B3/00

CPC classification number: B81B3/0051 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/042 ,  B81B2201/052 ,  B81B2203/0118 ,  B81B2203/0346

Abstract: The present disclosure provides a MEMS device having a movable portion. The MEMS device includes: a substrate; a recess, disposed in the substrate; the movable portion, hollowly supported in the recess; and a bump stop, hollowly supported in the recess and configured to restrict a movement of the movable portion by contacting the movable portion. The bump stop includes: a protruding portion, configured to contact the movable portion; and a shock absorbing portion, disposed between the protruding portion and the substrate and configured to absorb at least a part of an impact force applied to the protruding portion by elastic deformation.