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    Promoting whole body health
    5.
    发明申请
    Promoting whole body health 审中-公开
    促进全身健康

    公开(公告)号：US20070140987A1

    公开(公告)日：2007-06-21

    申请号：US11701848

    申请日：2007-02-01

    申请人： Matthew Doyle ,  Stephen Hunter-Rinderle ,  Robert Singer

    发明人： Matthew Doyle ,  Stephen Hunter-Rinderle ,  Robert Singer

    IPC分类号： A61K9/68 ,  A61K31/4745 ,  A61K8/00 ,  A23K1/165 ,  A61K31/44

    CPC分类号： A61Q11/00 ,  A61K8/347 ,  A61K8/416 ,  A61K8/43 ,  A61K8/49 ,  A61K8/4926 ,  A61K9/006 ,  A61K31/05 ,  A61K31/14 ,  A61K31/155 ,  A61K31/44 ,  A61K31/4745 ,  A61K33/24 ,  A61K33/30 ,  A61K33/34 ,  A61K45/06

    摘要： The present invention relates to promoting whole body health in humans and animals by using topical oral compositions comprising a safe and effective amount of an antimicrobial agent in admixture with a pharmaceutically acceptable carrier, said compositions being effective in controlling bacterial-mediated diseases and conditions present in the oral cavity and in inhibiting the spread into the bloodstream of pathogenic oral bacteria, associated bacterial toxins and endotoxins, and resultant inflammatory cytokines and mediators. The present invention also encompasses methods of use of these compositions by topically applying to the oral cavity, a safe and effective amount of an antimicrobial agent to promote and/or enhance whole body health in humans and other animals.

    摘要翻译： 本发明涉及通过使用包含安全有效量的抗微生物剂与药学上可接受的载体混合的局部口服组合物来促进人和动物的全身健康，所述组合物有效地控制细菌介导的疾病和病症 口腔和抑制扩散到病原性口腔细菌，相关细菌毒素和内毒素的血液中，以及产生的炎性细胞因子和介质。 本发明还包括通过局部施用于口腔使用这些组合物的方法，一种安全有效量的抗微生物剂以促进和/或增强人和其他动物的全身健康。

    Method, apparatus and computer program product for implementing enhanced high frequency return current paths utilizing decoupling capacitors in a package design
    6.
    发明申请
    Method, apparatus and computer program product for implementing enhanced high frequency return current paths utilizing decoupling capacitors in a package design 失效
    用于在封装设计中实现使用去耦电容器的增强型高频返回电流路径的方法，装置和计算机程序产品

    公开(公告)号：US20050108671A1

    公开(公告)日：2005-05-19

    申请号：US10712536

    申请日：2003-11-13

    申请人： Darryl Becker ,  Daniel Douriet ,  Matthew Doyle ,  Andrew Maki ,  Joel Ziegelbein

    发明人： Darryl Becker ,  Daniel Douriet ,  Matthew Doyle ,  Andrew Maki ,  Joel Ziegelbein

    IPC分类号： G06F9/45 ,  G06F17/50 ,  H05K1/02 ,  H05K3/00

    CPC分类号： G06F17/5036 ,  G06F17/5068 ,  H05K1/0231 ,  H05K1/0262 ,  H05K3/0005

    摘要： A method, apparatus and computer program product are provided for implementing high frequency return current paths utilizing decoupling capacitors within electronic packages. Electronic package physical design data are received for identifying a board layout. For each of a plurality of cells in a grid of a set cell size within the identified board layout, a respective number of signal vias are identified. A ratio of signal vias to return current paths is calculated for each of the plurality of cells. Each cell having a calculated ratio greater than a target ratio is identified. One or more decoupling capacitors are selectively added within each of the identified cells to provide high frequency return current paths.

    摘要翻译： 提供了一种方法，装置和计算机程序产品，用于在电子封装内实现使用去耦电容器的高频返回电流路径。 接收电子封装物理设计数据以识别电路板布局。 对于在所识别的板布局内的设置单元尺寸的网格中的多个单元中的每一个，识别相应数量的信号通孔。 针对多个单元中的每个单元计算信号通孔与返回电流路径的比率。 识别具有大于目标比率的计算比率的每个单元。 每个识别的单元中选择性地添加一个或多个去耦电容器，以提供高频返回电流路径。

    Method, structure, and computer program product for implementing high frequency return current paths within electronic packages
    7.
    发明申请
    Method, structure, and computer program product for implementing high frequency return current paths within electronic packages 失效
    用于实现电子封装内高频返回电流路径的方法，结构和计算机程序产品

    公开(公告)号：US20050086623A1

    公开(公告)日：2005-04-21

    申请号：US10682135

    申请日：2003-10-09

    申请人： Darryl Becker ,  Daniel Douriet ,  Matthew Doyle ,  Andrew Maki ,  Joel Ziegelbein

    发明人： Darryl Becker ,  Daniel Douriet ,  Matthew Doyle ,  Andrew Maki ,  Joel Ziegelbein

    IPC分类号： G06F17/50 ,  G06F9/45

    CPC分类号： G06F17/5068 ,  G06F17/5036

    摘要： A method, structure and computer program product are provided for implementing high frequency return current paths within electronic packages. Electronic package physical design data is received for identifying a design layout. For each of a plurality of cells in a grid of a set cell size within the identified design layout, a respective number of signal vias, reference voltage vias, and ground vias are identified. A signal to reference via ratio is calculated for each of the plurality of cells. Each cell having a calculated signal to reference via ratio greater than a target ratio is identified. Vias are selectively added within each of the identified cells for providing high frequency return current paths.

    摘要翻译： 提供了一种方法，结构和计算机程序产品，用于在电子封装内实现高频返回电流路径。 收到电子包物理设计数据，用于识别设计布局。 对于所识别的设计布局内的设置单元尺寸的网格中的多个单元格中的每一个，识别相应数量的信号通孔，参考电压通孔和接地通孔。 针对多个单元中的每个单元计算信号到参考通孔比。 识别具有大于目标比率的计算出的参考通路比的信号的每个单元。 选择性地在每个所识别的单元中添加通孔以提供高频返回电流路径。

    Method for manufacturing multilayer flexible circuits
    8.
    发明申请
    Method for manufacturing multilayer flexible circuits 审中-公开
    多层柔性电路的制造方法

    公开(公告)号：US20070102092A1

    公开(公告)日：2007-05-10

    申请号：US11272590

    申请日：2005-11-10

    申请人： John Dangler ,  Matthew Doyle

    发明人： John Dangler ,  Matthew Doyle

    IPC分类号： B32B38/00 ,  B32B41/00

    CPC分类号： B32B37/12 ,  B32B2457/08 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0195 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/09881

    摘要： A method for manufacturing multilayer flexible circuits is disclosed. The cross-sectional area of an unoccupied signal layer volume is initially determined. The unoccupied signal layer includes multiple conductive elements, and the unoccupied signal layer volume is formed between two of the conductive elements. Next, the thickness of an adhesive layer for filling the unoccupied signal layer volume is determined. Finally, the thickness of the adhesive layer is adjusted such that the adhesive layer only fills the unoccupied signal layer volume while the two conductive elements come in direct contact with a dielectric layer without any adhesive in between.

    摘要翻译： 公开了一种制造多层柔性电路的方法。 初始确定未占用信号层体积的横截面面积。 未占用的信号层包括多个导电元件，并且在两个导电元件之间形成未占用的信号层体积。 接下来，确定用于填充未占用信号层体积的粘合剂层的厚度。 最后，调节粘合剂层的厚度，使得粘合剂层仅填充未占用的信号层体积，同时两个导电元件与电介质层直接接触，而两者之间没有任何粘合剂。